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1. 发明申请

WO2009128886A1 MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND AN ELECTRODE FOR USE THEREIN 审中-公开
标题翻译：用于沉积材料和电极的制造设备
公开(公告)号：WO2009128886A1
公开(公告)日：2009-10-22
申请号：PCT/US2009/002289
申请日：2009-04-13
申请人： HEMLOCK SEMICONDUCTOR CORPORATION , DEHTIAR, Max , HILLABRAND, David , KNAPP, Theodore , MCCOY, Keith , MOLNAR, Michael
发明人： DEHTIAR, Max , HILLABRAND, David , KNAPP, Theodore , MCCOY, Keith , MOLNAR, Michael
IPC分类号： F28F13/18 , C23C16/44 , C01B33/035
CPC分类号： B23K10/02 , C23C16/4418 , H05B3/03
摘要： The present invention relates to a manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus. Typically, the carrier body has a first end and a second end spaced from each other. A socket is disposed at each of the end of the carrier body. The apparatus includes a housing that defines a chamber. At least one electrode is disposed through the housing for receiving the socket. The electrode includes an interior surface that defines a channel. The electrode heats the carrier body to a necessary deposition temperature by direct passage of electrical current to the carrier body. A coolant is in fluid communication with the channel of the electrode for reducing the temperature of the electrode. A channel coating is disposed in the interior surface of the electrode for preventing loss of heat transfer between the coolant and the interior surface.
摘要翻译：本发明涉及用于在载体上沉积材料的制造装置和用于制造装置的电极。通常，载体主体具有彼此间隔开的第一端和第二端。插座设置在载体主体的每个端部。该装置包括限定腔室的壳体。至少一个电极通过壳体设置以接收插座。电极包括限定通道的内表面。电极通过电流直接通过载体而使承载体加热到必要的沉积温度。冷却剂与电极的通道流体连通，以降低电极的温度。通道涂层设置在电极的内表面中，以防止冷却剂和内表面之间的热传递损失。

2. 发明申请

WO2011044457A1 MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND AN ELECTRODE FOR USE THEREIN 审中-公开
标题翻译：用于沉积材料和电极的制造设备
公开(公告)号：WO2011044457A1
公开(公告)日：2011-04-14
申请号：PCT/US2010/051970
申请日：2010-10-08
申请人： HEMLOCK SEMICONDUCTOR CORPORATION , HILLABRAND, David , MCCOY, Keith
发明人： HILLABRAND, David , MCCOY, Keith
IPC分类号： C23C16/44
CPC分类号： C23C16/4404 , C01B33/035 , C23C16/4418
摘要： A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. The exterior surface has a contact region that is adapted to contact a socket. A contact region coating is disposed on the contact region of the electrode for maintaining electrical conductivity between the electrode and the socket. The contact region coating has an electrical conductivity of at least 7x10 6 Siemens/meter at room temperature and a greater wear resistance than nickel as measured in mm 3 /N*m.
摘要翻译：提供了一种用于在载体上沉积材料的制造装置和用于制造装置的电极。制造装置包括限定腔室的壳体。壳体还限定用于将气体引入腔室的入口和用于从腔室排出气体的出口。至少一个电极通过壳体设置，电极至少部分地设置在腔室内。电极具有外表面。外表面具有适于接触插座的接触区域。接触区域涂层设置在电极的接触区域上，以保持电极和插座之间的导电性。接触区域涂层在室温下的电导率至少为7×10 6西门子/米，并且具有比以mm 3 / N * m测量的镍更大的耐磨性。

3. 发明申请

WO2011044441A1 CVD APPARATUS WITH ELECTRODE 审中-公开
标题翻译： CVD装置与电极
公开(公告)号：WO2011044441A1
公开(公告)日：2011-04-14
申请号：PCT/US2010/051945
申请日：2010-10-08
申请人： HEMLOCK SEMICONDUCTOR CORPORATION , HILLABRAND, David , MCCOY, Keith
发明人： HILLABRAND, David , MCCOY, Keith
IPC分类号： C23C16/44 , C01B33/035
CPC分类号： C23C16/4418 , C01B33/035 , C23C16/4404
摘要： A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode has an exterior surface. A first exterior coating having an electrical conductivity of at least 7x10 6 Siemens/meter at room temperature is disposed on the exterior surface of the electrode. A second exterior coating different from the first exterior coating is disposed on the first exterior coating. A power supply device is coupled to the electrode.
摘要翻译：提供了一种用于在载体上沉积材料的制造装置和用于制造装置的电极。制造装置包括限定腔室的壳体。壳体还限定用于将气体引入腔室的入口和用于从腔室排出气体的出口。至少一个电极通过壳体设置，电极至少部分地设置在腔室内。电极具有外表面。在电极的外表面上设置有室温下至少为7×10 6西门子/米的电导率的第一外涂层。与第一外部涂层不同的第二外部涂层设置在第一外部涂层上。电源装置耦合到电极。

4. 发明申请

WO2011044467A1 CVD APPARATUS 审中-公开
标题翻译： CVD装置
公开(公告)号：WO2011044467A1
公开(公告)日：2011-04-14
申请号：PCT/US2010/051989
申请日：2010-10-08
申请人： HEMLOCK SEMICONDUCTOR CORPORATION , HILLABRAND, David , MCCOY, Keith
发明人： HILLABRAND, David , MCCOY, Keith
IPC分类号： C23C16/44
CPC分类号： C23C16/4404 , C01B33/035 , C23C16/4418
摘要： A manufacturing apparatus for deposition of a material on a carrier body and an electrode for use with the manufacturing apparatus are provided. The manufacturing apparatus includes a housing that defines a chamber. The housing also defines an inlet for introducing a gas into the chamber and an outlet for exhausting the gas from the chamber. At least one electrode is disposed through the housing with the electrode at least partially disposed within the chamber. The electrode includes a shaft having a first end and a second end, and a head disposed on one of the ends of the shaft. The head of the electrode has an exterior surface having a contact. An exterior coating is disposed on the exterior surface of the electrode, outside of the contact region. The exterior coating has a greater wear resistance than nickel as measured in mm 3 /N*m.
摘要翻译：提供了用于在载体上沉积材料的制造装置和用于制造装置的电极。制造装置包括限定腔室的壳体。壳体还限定用于将气体引入腔室的入口和用于从腔室排出气体的出口。至少一个电极通过壳体设置，电极至少部分地设置在腔室内。电极包括具有第一端和第二端的轴，以及设置在轴的一端的头部。电极的头部具有具有接触的外表面。外部涂层设置在电极的外表面上，在接触区域的外部。外部涂层具有比以mm3 / N * m测量的更高的耐磨性。

5. 发明申请

WO2014150242A1 DEPOSITION APPARATUS 审中-公开
标题翻译：沉积装置
公开(公告)号：WO2014150242A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/022696
申请日：2014-03-10
申请人： HEMLOCK SEMICONDUCTOR CORPORATION
发明人： DEEG, Matthew , HILLABRAND, David, C. , MCCOY, Keith , IDDESON, Andrew , ZOTT, Paul, Michael
IPC分类号： C23C16/44 , C01B33/027
CPC分类号： C23C16/4418 , C01B33/027 , C01B33/035 , C23C16/4409
摘要： A gasket seals a chamber of a manufacturing apparatus. The manufacturing apparatus deposits a material on a carrier body. The manufacturing apparatus includes a housing having a jar, which defines the chamber, and a base plate for coupling with the jar. An electrode is disposed through the housing with the electrode at least partially disposed within the chamber. An inlet is defined by the housing for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The gasket is disposable between the base plate and either the jar or the electrode for preventing the deposition composition from escaping the chamber. The gasket comprises a body portion with a hollow interior.
摘要翻译：垫圈密封制造装置的腔室。制造装置将材料沉积在载体上。制造装置包括具有限定腔室的罐的壳体和用于与罐接合的基板。电极通过壳体设置，电极至少部分地设置在腔室内。入口由壳体限定，用于将包括该材料或其前体的沉积组合物引入腔室。垫片在基板和罐或电极之间是一次性的，以防止沉积组合物逸出室。垫圈包括具有中空内部的主体部分。

6. 发明申请

WO2014143910A1 MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND A GASKET FOR USE THEREIN 审中-公开
标题翻译：用于沉积材料的制造装置及其使用的垫圈
公开(公告)号：WO2014143910A1
公开(公告)日：2014-09-18
申请号：PCT/US2014/028081
申请日：2014-03-14
申请人： HEMLOCK SEMICONDUCTOR CORPORATION
发明人： DEEG, Matthew , HILLABRAND, David, C. , MCCOY, Keith , COPPOLA, Stephen , KAMIBAYASHIYAMA, Julian , VELTMAN, Melissa
IPC分类号： F16J15/12 , C23C16/44 , C01B33/035 , B01J3/03 , B01J19/00 , H01B17/30
CPC分类号： F16J15/127 , C23C16/4409
摘要： A gasket seals a chamber of a manufacturing apparatus, which is used to deposit a material on a carrier body. The manufacturing apparatus including a housing defining a chamber. An electrode is disposed through the housing. The housing defines an inlet for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The gasket comprises a body portion defining an upper groove for positioning adjacent the electrode. The body portion of the gasket also defines a lower groove opposite the upper groove for positioning adjacent the housing. A first sealing element is disposed within the upper groove for sealing against the electrode. A second sealing element is disposed within the lower groove for sealing against the housing. Sealing between the electrode and the housing prevents the deposition composition from escaping the chamber.
摘要翻译：垫圈密封用于将材料沉积在载体上的制造装置的腔室。该制造装置包括限定腔室的壳体。电极通过壳体设置。壳体限定用于将包括该材料或其前体的沉积组合物引入该腔室的入口。垫圈包括限定用于邻近电极定位的上槽的主体部分。垫圈的主体部分还限定与上槽相对的下槽，用于邻近壳体定位。第一密封元件设置在上槽内用于密封电极。第二密封元件设置在下槽内，用于密封住壳体。电极和壳体之间的密封防止沉积组合物逸出腔室。

7. 发明申请

WO2014150213A1 INDUCTION HEATING APPARATUS 审中-公开
标题翻译：感应加热装置
公开(公告)号：WO2014150213A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/022596
申请日：2014-03-10
申请人： HEMLOCK SEMICONDUCTOR CORPORATION
发明人： ARMSTRONG, Timothy , DEEG, Matthew , LARIMER, Jennifer , LARSON, William , MCCOY, Keith , MOLNAR, Michael, John , SCHULTZ, James, A.
IPC分类号： H05B6/10 , H05B6/42 , C23C16/24
CPC分类号： H05B6/108 , C23C16/24 , C23C16/442 , C23C16/46 , H05B6/365 , H05B6/42
摘要： An induction heating apparatus includes a susceptor defining a reaction chamber. A housing is spaced from the susceptor opposite the reaction chamber and defines a port. A void space is defined between the housing and the susceptor. An induction coil extends through the port and is disposed within the void space for conducting an electric current to heat the susceptor to heat the reaction chamber. A flange comprises a metal material and is coupled to the housing at the port for sealing the port with the induction coil extending through the flange. An isolator is disposed between the flange and the housing to prevent the electric current from passing into the housing.
摘要翻译：感应加热装置包括限定反应室的基座。壳体与反应室相对的基座间隔开并限定了一个端口。在壳体和基座之间限定空隙。感应线圈延伸穿过端口并且设置在空隙空间内，用于传导电流以加热感受器以加热反应室。凸缘包括金属材料，并且在端口处联接到壳体，用于密封端口，感应线圈延伸穿过凸缘。隔离器设置在凸缘和壳体之间以防止电流进入壳体。

8. 发明申请

WO2014143903A1 MANUFACTURING APPARATUS FOR DEPOSITING A MATERIAL AND A GASKET FOR USE THEREIN 审中-公开
标题翻译：用于沉积材料的制造装置及其使用的垫圈
公开(公告)号：WO2014143903A1
公开(公告)日：2014-09-18
申请号：PCT/US2014/028072
申请日：2014-03-14
申请人： HEMLOCK SEMICONDUCTOR CORPORATION
发明人： DEEG, Matthew , HILLABRAND, David, C. , MCCOY, Keith , KAMIBAYASHIYAMA, Julian , KOTECKI, Keith , SCHENK, Doug , VELTMAN, Melissa
IPC分类号： C23C16/44 , C01B33/035 , B01J3/03 , B01J19/00 , F16J15/02
CPC分类号： B01J19/0073 , B01J3/03 , C01B33/035 , C23C16/4409 , F16J15/122 , F16J15/127
摘要： A gasket seals a chamber of a manufacturing apparatus, which deposits material on a carrier body. The manufacturing apparatus includes a housing defining the chamber. The housing also includes a jar and a base plate for coupling with the jar. The housing defines an inlet for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The gasket comprises a body portion defining an upper groove for positioning adjacent the jar. The body portion also defines a lower groove opposite said upper groove for positioning adjacent the base plate. A first sealing element is disposed within said upper groove for sealing against the jar. A second sealing element is disposed within said lower groove for sealing against the base plate. The first and second sealing elements seal between the jar and the base plate to prevent the deposition composition from escaping the chamber.
摘要翻译：垫圈密封制造设备的室，其将材料沉积在载体上。制造装置包括限定腔室的壳体。壳体还包括用于与罐接合的罐和底板。壳体限定用于将包括该材料或其前体的沉积组合物引入该腔室的入口。垫圈包括主体部分，其限定用于定位在罐附近的上槽。主体部分还限定与所述上槽相对的下槽，用于邻近基板定位。第一密封元件设置在所述上槽内，用于密封罐。第二密封元件设置在所述下槽内，用于密封基板。第一和第二密封元件在罐和基板之间密封，以防止沉积组合物逸出室。

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