基本信息:
- 专利标题： APPARATUS FOR DEPOSITION INCLUDING A SOCKET
- 专利标题（中）：用于沉积的装置，包括插座
- 申请号：PCT/US2013/049690 申请日：2013-07-09
- 公开(公告)号：WO2014011617A1 公开(公告)日：2014-01-16
- 发明人： DEEG, Matthew , HILGER, Grant , HILLABRAND, David
- 申请人： HEMLOCK SEMICONDUCTOR CORPORATION
- 申请人地址： 12334 Geddes Road Hemlock, MI 48626 US
- 专利权人： HEMLOCK SEMICONDUCTOR CORPORATION
- 当前专利权人： HEMLOCK SEMICONDUCTOR CORPORATION
- 当前专利权人地址： 12334 Geddes Road Hemlock, MI 48626 US
- 代理机构： LAPRAIRIE, David, M. et al.
- 优先权： US61/669,856 20120710
- 主分类号： C23C16/44
- IPC分类号： C23C16/44
摘要：
A manufacturing apparatus (10) deposits material on a carrier body (14). The manufacturing apparatus includes a housing (16) defining a chamber. The housing defines an inlet (32) for introducing a deposition composition, which comprises the material or a precursor thereof, into the chamber. The housing also defines an outlet (34) through the housing for exhausting the deposition composition from the chamber. An electrode (46) is disposed through the housing with the electrode at least partially disposed within the chamber. A socket (52) has an exterior surface with a surface roughness RA value of less than or equal to 100 microns is connected to the electrode within the chamber for receiving the carrier body. A polishing the exterior surface of the socket is disposed on the exterior surface of the socket for promoting release of the material deposited on the carrier body from the socket to harvest the material from the socket.
摘要（中）：
制造装置（10）将材料沉积在载体（14）上。 制造装置包括限定腔室的壳体（16）。 壳体限定用于将包含材料或其前体的沉积组合物引入腔室的入口（32）。 壳体还限定了通过壳体的出口（34），用于从腔室排出沉积组合物。 电极（46）穿过壳体设置，电极至少部分地设置在腔室内。 具有小于或等于100微米的表面粗糙度RA值的外表面的插座（52）连接到用于容纳载体的腔室内的电极。 抛光插座的外表面设置在插座的外表面上，以促进从插座上沉积在载体主体上的材料以从插座收获材料。