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    • 3. 发明申请
    • SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS
    • 半导体器件具有多个闸板
    • WO2017180614A1
    • 2017-10-19
    • PCT/US2017/026992
    • 2017-04-11
    • VISHAY-SILICONIX
    • PARK, ChanhoSHIBIB, AymanTERRILL, Kyle
    • H01L21/66
    • Disclosed are semiconductor devices that include additional gate pads, and methods of fabricating and testing such devices. A device may include a first gate pad, a second gate pad, and a third gate pad. The first gate pad is connected to a gate including a gate oxide layer. The second and third gate pads are part of an electro-static discharge (ESD) protection network for the device. The ESD protection network is initially isolated from the first gate pad and hence from the gate and gate oxide layer. Accordingly, gate oxide integrity (GOI) testing can be effectively performed and the reliability and quality of the gate oxide layer can be checked. The second gate pad can be subsequently connected to the first gate pad to enable the ESD protection network, and the third gate pad can be subsequently connected to an external terminal when the device is packaged.
    • 公开了包括附加栅极焊盘的半导体器件以及制造和测试这种器件的方法。 器件可以包括第一栅极焊盘,第二栅极焊盘和第三栅极焊盘。 第一栅极焊盘连接到包括栅极氧化物层的栅极。 第二和第三栅极焊盘是器件的静电放电(ESD)保护网络的一部分。 ESD保护网络最初与第一栅极焊盘隔离,因此与栅极和栅极氧化层隔离。 因此,可以有效地执行栅极氧化物完整性(GOI)测试,并且可以检查栅极氧化物层的可靠性和质量。 随后可以将第二栅极焊盘连接到第一栅极焊盘以启用ESD保护网络,并且当器件被封装时,第三栅极焊盘随后可以连接到外部端子。