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1. 发明申请

WO2014164966A1 COMPOSITE END EFFECTORS 审中-公开
标题翻译：复合终止效应
公开(公告)号：WO2014164966A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/023955
申请日：2014-03-12
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： PERGANDE, Paul E. , FORDERHASE, Paul
IPC分类号： H01L21/677 , H01L21/68
CPC分类号： B25J15/0014 , B25J9/0012 , H01L21/67742 , H01L21/67766
摘要： An end effector includes a base, a plurality of fingers extending from the base, and a plurality of pads disposed on each of said fingers to support a substrate. The fingers comprise a carbon fiber material and taper from a first diameter and first wall thickness proximate said base to a second diameter smaller than said first diameter and second wall thickness smaller than said first wall thickness distal said base. A method includes adhering a plurality of pads along a plurality of tapered fingers, and adhering proximal ends of the plurality of tapered fingers with corresponding recesses of a base. The assembled pads, tapered fingers and base are placed on a fixture such that top surfaces of the plurality of pads rest on a top surface of the fixture and the assembly is held in place on the fixture until the adhesive has cured at room temperature.
摘要翻译：末端执行器包括基部，从基部延伸的多个指状物，以及设置在每个所述指状物上以支撑基底的多个垫。指状物包括碳纤维材料，并且从第一直径和接近所述基部的第一壁厚度变小至小于所述第一直径的第二直径，并且小于所述基部远端的所述第一壁厚度的第二壁厚度。一种方法包括沿着多个锥形指状物粘附多个焊盘，并且使多个锥形指状物的基端部与基部的相应凹部粘合。组装的垫，锥形指状物和底座放置在固定装置上，使得多个垫的顶表面搁置在固定装置的顶表面上，并将组件保持在夹具上的适当位置，直到粘合剂在室温下固化。

2. 发明申请

WO2014093527A1 TRANSFER CHAMBER AND METHOD OF USING TRANSFER CHAMBER 审中-公开
标题翻译：传送室和使用传送室的方法
公开(公告)号：WO2014093527A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/074462
申请日：2013-12-11
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： WEBB, Aaron P. , CARLSON, Charles T. , FORDERHASE, Paul , WEAVER, William T. , VOPAT, Robert B.
IPC分类号： H01L21/67 , H01J37/317
CPC分类号： H01L31/18 , H01J37/3171 , H01J37/3178 , H01J37/32412 , H01L21/67155 , H01L21/67173 , H01L21/67184 , H01L31/1804 , Y02E10/547 , Y02P70/521 , Y10T29/49718
摘要： An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.
摘要翻译：一种离子注入机和方法，用于以减少停机时间同时提高离子注入机的产量的方式促进对离子注入机部件的维护的快速性能。离子注入机包括处理室，连接到处理室的传送室，构造成可以将传送室从处理室可控地密封的第一隔离栅和被配置为可控制地将传送室与大气环境密封的第二隔离栅，其中所述离子注入机的部件可以在所述处理室和所述传送室之间传送，以对所述处理室外的部件执行维护。对离子注入机的部件执行维护包括将部件从处理室传送到传送室，密封传送室，将传送室排出到大气压力，将传送室打开到大气环境的步骤。

3. 发明申请

WO2013122779A1 TECHNIQUES FOR HANDLING MEDIA ARRAYS 审中-公开
标题翻译：处理媒体阵列的技术
公开(公告)号：WO2013122779A1
公开(公告)日：2013-08-22
申请号：PCT/US2013/024754
申请日：2013-02-05
申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
发明人： FORDERHASE, Paul , BLAKE, Julian , WEAVER, William
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67046 , H01L21/67333 , H01L21/67706 , H01L21/67712 , H01L21/67748 , H01L21/67754 , H01L21/67781
摘要： Techniques for handling media arrays are disclosed. The techniques may be realized as a system for handling a plurality of substrates. The system may comprise a plurality of row elements for supporting the plurality of substrates, wherein the plurality of row elements may be operable to change configuration of the substrates from open configuration to a high-density configuration, where a distance between adjacent substrates in the open configuration may be greater than a distance between the adjacent substrates in the high-density configuration.
摘要翻译：公开了处理介质阵列的技术。这些技术可以被实现为用于处理多个基板的系统。所述系统可以包括用于支撑多个基板的多个行元件，其中所述多个行元件可操作以将所述基板的构型从开放构型改变为高密度配置，其中所述开放配置可以大于高密度配置中的相邻基板之间的距离。

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