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    • 1. 发明申请
    • EXTENDED REACTOR ASSEMBLY WITH MULTIPLE SECTIONS FOR PERFORMING ATOMIC LAYER DEPOSITION ON LARGE SUBSTRATE
    • 扩展的反应堆组件,用于在大型基板上执行原子层沉积的多个部分
    • WO2012071195A1
    • 2012-05-31
    • PCT/US2011/060474
    • 2011-11-11
    • SYNOS TECHNOLOGY, INC.LEE, Sang, In
    • LEE, Sang, In
    • C23C16/00
    • C23C16/45551C23C16/45536H01J37/32376H01J37/32449H01J37/32568H01J37/32752H01J37/32807
    • An elongated reactor assembly in a deposition device for performing atomic layer deposition (ALD) on a large substrate. The elongated reactor assembly includes one or more injectors and/or radical reactors. Each injector or radical reactor injects a gas or radicals onto the substrate as the substrate passes the injector or radical reactor as part of the ALD process. Each injector or radical reactor includes a plurality of sections where at least two sections have different cross sectional configurations. By providing different sections in the injector or radical reactor, the injector or radical reactor may inject the gas or the radicals more uniformly over the substrate. Each injector or radical reactor may include more than one outlet for discharging excess gas or radicals outside the deposition device.
    • 在用于在大衬底上进行原子层沉积(ALD)的沉积装置中的细长反应器组件。 细长的反应器组件包括一个或多个注射器和/或自由基反应器。 当基片作为ALD过程的一部分通过注射器或自由基反应器时,每个注射器或自由基反应器将气体或基团注入到基底上。 每个喷射器或自由基反应器包括多个部分,其中至少两个部分具有不同的横截面构造。 通过在注射器或自由基反应器中提供不同的部分,注射器或自由基反应器可以将气体或自由基更均匀地注入基底上。 每个注射器或自由基反应器可以包括用于排出沉积装置外部的多余气体或自由基的多于一个的出口。
    • 4. 发明申请
    • PROTECTIVE STRUCTURE ENCLOSING DEVICE ON FLEXIBLE SUBSTRATE
    • 保护结构在柔性基板上封装设备
    • WO2011149690A1
    • 2011-12-01
    • PCT/US2011/036523
    • 2011-05-13
    • SYNOS TECHNOLOGY, INC.LEE, Sang, In
    • LEE, Sang, In
    • H05B33/10H01J1/62
    • H01L51/5253H01L51/0096H01L2251/5338H01L2251/5369Y02E10/549
    • A structure for protecting a device includes a first layer, one or more first microstructures on the first layer, and a second layer disposed on the first layer. The second layer is disposed on a surface of the first layer on which one or more microstructures are provided. The microstructure may have a hemispheric shape or other random shapes having a curved surface. Since the area of the interface surface between layers is increased due to the at least one microstructure, the stress per unit area of the interface surface is reduced. Further, the microstructure increases the length of the path that ambient species need to travel in order to reach a device or other active components, thereby reducing the amount of infiltrating ambient species.
    • 用于保护装置的结构包括第一层,第一层上的一个或多个第一微结构和设置在第一层上的第二层。 第二层设置在其上设置有一个或多个微结构的第一层的表面上。 微结构可以具有半球形状或具有弯曲表面的其它随机形状。 由于至少一个微结构,由于层间界面的面积增加,因此界面表面的每单位面积的应力减小。 此外,微结构增加环境物质需要行进的路径的长度以便到达装置或其它活性组分,从而减少渗透环境物质的量。
    • 10. 发明申请
    • COMBINED INJECTION MODULE FOR SEQUENTIALLY INJECTING SOURCE PRECURSOR AND REACTANT PRECURSOR
    • 用于连续注射源前体和反应物前体的组合注射模块
    • WO2012112373A1
    • 2012-08-23
    • PCT/US2012/024451
    • 2012-02-09
    • SYNOS TECHNOLOGY, INC.LEE, Sang, In
    • LEE, Sang, In
    • H01L21/31
    • C23C16/45548C23C16/403C23C16/4412
    • Performing atomic layer deposition using a combined injector that sequentially injects source precursor and reactant precursor onto a substrate. The source precursor is injected into the injector via a first channel, injected onto the substrate and then discharged through a first exhaust portion. The reactant precursor is then injected into the injector via a second channel separate from the first channel, injected onto the substrate and then discharged through a second exhaust portion separate from the first exhaust portion. After injecting the source precursor or the reactant precursor, a purge gas may be injected into the injector and discharged to remove any source precursor or reactant precursor remaining in paths from the first or second channel to the first or second exhaust portion.
    • 使用将源前体和反应物前体依次注入到基底上的组合注射器进行原子层沉积。 源前体经由第一通道注入注射器,注射到基底上,然后通过第一排气部分排出。 然后将反应物前体经由与第一通道分离的第二通道注入到注射器中,注入到基底上,然后通过与第一排气部分分离的第二排气部分排出。 在注入源前体或反应物前体之后,可将吹扫气体注入到喷射器中并排出以除去保留在从第一或第二通道到第一或第二排气部分的路径中的任何源前体或反应物前体。