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    • 3. 发明申请
    • EXTENDED REACTOR ASSEMBLY WITH MULTIPLE SECTIONS FOR PERFORMING ATOMIC LAYER DEPOSITION ON LARGE SUBSTRATE
    • 扩展的反应堆组件,用于在大型基板上执行原子层沉积的多个部分
    • WO2012071195A1
    • 2012-05-31
    • PCT/US2011/060474
    • 2011-11-11
    • SYNOS TECHNOLOGY, INC.LEE, Sang, In
    • LEE, Sang, In
    • C23C16/00
    • C23C16/45551C23C16/45536H01J37/32376H01J37/32449H01J37/32568H01J37/32752H01J37/32807
    • An elongated reactor assembly in a deposition device for performing atomic layer deposition (ALD) on a large substrate. The elongated reactor assembly includes one or more injectors and/or radical reactors. Each injector or radical reactor injects a gas or radicals onto the substrate as the substrate passes the injector or radical reactor as part of the ALD process. Each injector or radical reactor includes a plurality of sections where at least two sections have different cross sectional configurations. By providing different sections in the injector or radical reactor, the injector or radical reactor may inject the gas or the radicals more uniformly over the substrate. Each injector or radical reactor may include more than one outlet for discharging excess gas or radicals outside the deposition device.
    • 在用于在大衬底上进行原子层沉积(ALD)的沉积装置中的细长反应器组件。 细长的反应器组件包括一个或多个注射器和/或自由基反应器。 当基片作为ALD过程的一部分通过注射器或自由基反应器时,每个注射器或自由基反应器将气体或基团注入到基底上。 每个喷射器或自由基反应器包括多个部分,其中至少两个部分具有不同的横截面构造。 通过在注射器或自由基反应器中提供不同的部分,注射器或自由基反应器可以将气体或自由基更均匀地注入基底上。 每个注射器或自由基反应器可以包括用于排出沉积装置外部的多余气体或自由基的多于一个的出口。
    • 5. 发明申请
    • ELECTRODE STRUCTURE, DEVICE COMPRISING THE SAME AND METHOD FOR FORMING ELECTRODE STRUCTURE
    • 电极结构,包含该结构的器件和形成电极结构的方法
    • WO2010085081A2
    • 2010-07-29
    • PCT/KR2010000360
    • 2010-01-20
    • SYNOS TECHNOLOGY INCLEE SANG IN
    • LEE SANG IN
    • H01L31/042
    • H01L21/02554H01L21/02565H01L21/02576H01L21/02579H01L21/0262H01L31/022466H01L31/022475H01L31/022483H01L31/075H01L31/078H01L31/1884Y02E10/50
    • An electrode structure comprises a semiconductor junction comprising an n-type semiconductor layer and a p-type semiconductor layer; a hole exnihilation layer on the p-type semiconductor layer; and a transparent electrode layer on the hole exnihilation layer. The electrode structure further comprises a conductive layer between the hole exnihilation layer and the transparent electrode layer. In the electrode structure, one or more of the hole exnihilation layer, the conductive layer and the transparent electrode layer may be formed by an atomic layer deposition. In the electrode structure, a transparent electrode formed of a degenerated n-type oxide semiconductor does not come in direct contact with a p-type semiconductor, and thus, annihilation or recombination of holes generated in the p-type semiconductor cam be reduced, which increases the carrier generation efficiency. Further, the electric conductivity of the transparent electrode is increased by the conductive layer, which improves electrical characteristics of a device.
    • 一种电极结构,包括:半导体结,包括n型半导体层和p型半导体层; 在p型半导体层上的空穴溢出层; 以及在孔ex层上的透明电极层。 该电极结构进一步包括位于孔外绝缘层和透明电极层之间的导电层。 在电极结构中,空穴散发层,导电层和透明电极层中的一个或多个可以通过原子层沉积形成。 在电极结构中,由退化的n型氧化物半导体形成的透明电极不会与p型半导体直接接触,并且因此可以减少在p型半导体凸轮中产生的空穴的湮灭或复合, 提高载波生成效率。 此外,透明电极的电导率通​​过导电层而增加,这提高了器件的电特性。
    • 7. 发明申请
    • PROTECTIVE STRUCTURE ENCLOSING DEVICE ON FLEXIBLE SUBSTRATE
    • 保护结构在柔性基板上封装设备
    • WO2011149690A1
    • 2011-12-01
    • PCT/US2011/036523
    • 2011-05-13
    • SYNOS TECHNOLOGY, INC.LEE, Sang, In
    • LEE, Sang, In
    • H05B33/10H01J1/62
    • H01L51/5253H01L51/0096H01L2251/5338H01L2251/5369Y02E10/549
    • A structure for protecting a device includes a first layer, one or more first microstructures on the first layer, and a second layer disposed on the first layer. The second layer is disposed on a surface of the first layer on which one or more microstructures are provided. The microstructure may have a hemispheric shape or other random shapes having a curved surface. Since the area of the interface surface between layers is increased due to the at least one microstructure, the stress per unit area of the interface surface is reduced. Further, the microstructure increases the length of the path that ambient species need to travel in order to reach a device or other active components, thereby reducing the amount of infiltrating ambient species.
    • 用于保护装置的结构包括第一层,第一层上的一个或多个第一微结构和设置在第一层上的第二层。 第二层设置在其上设置有一个或多个微结构的第一层的表面上。 微结构可以具有半球形状或具有弯曲表面的其它随机形状。 由于至少一个微结构,由于层间界面的面积增加,因此界面表面的每单位面积的应力减小。 此外,微结构增加环境物质需要行进的路径的长度以便到达装置或其它活性组分,从而减少渗透环境物质的量。
    • 10. 发明申请
    • VAPOR DEPOSITION REACTOR FOR FORMING THIN FILM
    • 用于形成薄膜的蒸气沉积反应器
    • WO2010019007A2
    • 2010-02-18
    • PCT/KR2009/004528
    • 2009-08-13
    • SYNOS TECHNOLOGY, INC.LEE, Sang In
    • LEE, Sang In
    • H01L21/205
    • C23C16/45551C23C16/4412
    • A vapor deposition reactor includes a chamber filled with a first material, and at least one reaction module in the chamber. The reaction module may be configured to make a substrate pass the reaction module through a relative motion between the substrate and the reaction module. The reaction module may include an injection unit for injecting a second material to the substrate. A method for forming thin film includes positioning a substrate in a chamber, filling a first material in the chamber, moving the substrate relative to a reaction module in the chamber, and injecting a second material to the substrate while the substrate passes the reaction module.
    • 气相沉积反应器包括填充有第一材料的腔室和腔室中的至少一个反应模块。 反应模块可以被配置为使得基板通过反应模块通过基板和反应模块之间的相对运动。 反应模块可以包括用于将第二材料注入基底的注射单元。 一种形成薄膜的方法包括将基板定位在室中,填充室中的第一材料,相对于室中的反应模块移动基板,以及在基板通过反应模块时将第二材料注入到基板。