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1. 发明申请

WO2006121486A2 HIGH CAPACITY THIN MODULE SYSTEM AND METHOD 审中-公开
标题翻译：高容量薄模块系统和方法
公开(公告)号：WO2006121486A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/006921
申请日：2006-02-28
申请人： STAKTEK GROUP L.P. , WEHRLY, JR, James Douglas , WILDER, James , GOODWIN, Paul , WOLFE, Mark
发明人： WEHRLY, JR, James Douglas , WILDER, James , GOODWIN, Paul , WOLFE, Mark
IPC分类号： G06F11/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路装有集成电路，沿其主要一侧或两侧布置。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域底物。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

2. 发明申请

WO2006121487A2 CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS 审中-公开
标题翻译：具有热壳系统和方法的电路模块
公开(公告)号：WO2006121487A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/007004
申请日：2006-02-28
申请人： STAKTEK GROUP L.P. , WEHRLY, James, Douglas, Jr. , WILDER, James , WOLFE, Mark , GOODWIN, Paul
发明人： WEHRLY, James, Douglas, Jr. , WILDER, James , WOLFE, Mark , GOODWIN, Paul
IPC分类号： G06F11/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

3. 发明申请

WO2006121488A2 OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：优化安装区域电路模块系统及方法
公开(公告)号：WO2006121488A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/007192
申请日：2006-02-28
申请人： STAKTEK GROUP L.P. , WEHRLY, James, Douglas, Jr. , WOLFE, Mark , GOODWIN, Paul
发明人： WEHRLY, James, Douglas, Jr. , WOLFE, Mark , GOODWIN, Paul
IPC分类号： G06F11/00
CPC分类号： H05K1/189 , H01L25/0652 , H01L25/105 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。刚性基板被配置为在其上布置有人造弹性体的一侧上提供空间，而在一些实施例中，热管理或冷却结构布置在模块的一侧以减轻模块中的热积聚。

4. 发明申请

WO2007044368A2 MINIMIZED PROFILE CIRCUIT MODULE SYSTEMS AND METHODS 审中-公开
标题翻译：最小化型式电路模块系统和方法
公开(公告)号：WO2007044368A2
公开(公告)日：2007-04-19
申请号：PCT/US2006/038720
申请日：2006-10-03
申请人： STAKTEK GROUP L.P. , CADY, James, W. , WEHRLY, James, Douglas , GOODWIN, Paul
发明人： CADY, James, W. , WEHRLY, James, Douglas , GOODWIN, Paul
IPC分类号： H01R43/02
CPC分类号： G11C5/143 , G11C5/04 , H01L23/5387 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K1/189 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , Y10T29/4913 , Y10T29/49179 , H01L2924/00
摘要： Flexible circuitry is populated on one or both sides with integrated circuits (ICs) each of which ICs has an IC profile (height). A substantially flat, windowed fixture with a fixture profile less than the IC profiles of the ICs is applied over an IC-populated side of the flexible circuitry causing at least a part of the ICs to emerge from respective fixture windows. Material is removed simultaneously from that portion of the ICs that emerge from the windows to result in lower-profile ICs which, in a preferred embodiment exhibit profiles substantially coincident with the fixture profile established by the upper surface of the fixture. The method is used to advantage in devising circuit modules by disposing the flexible circuitry about a rigid substrate to form the circuit module with a low profile. Some embodiments use substrates that are windowed or have inset areas into which the lower profile CSPs may be set to reach profile requirements.
摘要翻译：灵活的电路在一侧或两侧安装集成电路（IC），每个IC都具有IC配置文件（高度）。具有小于IC的IC配置文件的夹具型材的基本平坦的窗口固定件被施加在柔性电路的IC填充侧上，导致至少一部分IC从相应的固定窗口露出。与从窗户出现的IC的那部分同时移除材料以产生下轮廓的IC，其在优选实施例中表现出与由固定装置的上表面确定的夹具轮廓基本一致的轮廓。该方法用于通过将柔性电路围绕刚性基板布置以形成具有低轮廓的电路模块来设计电路模块。一些实施例使用被窗口化或具有插入区域的衬底，下部轮廓CSP可被设置到其中以达到轮廓要求。

5. 发明申请

WO2006121489A2 COMPACT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：紧凑型模块系统和方法
公开(公告)号：WO2006121489A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/007193
申请日：2006-02-28
申请人： STAKTEK GROUP L.P. , CADY, James, W. , WEHRLY, James, Douglas, Jr. , GOODWIN, Paul
发明人： CADY, James, W. , WEHRLY, James, Douglas, Jr. , GOODWIN, Paul
IPC分类号： G06F11/00
CPC分类号： H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
摘要： A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
摘要翻译：柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境。

6. 发明申请

WO2007001505A3 DIE MODULE SYSTEM AND METHOD 审中-公开
公开(公告)号：WO2007001505A3
公开(公告)日：2007-01-04
申请号：PCT/US2006/006935
申请日：2006-02-27
申请人： STAKTEK GROUP L.P. , CADY, James, W. , GOODWIN, Paul
发明人： CADY, James, W. , GOODWIN, Paul
IPC分类号： H05K1/11 , H01K1/14
摘要： A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

7. 发明申请

WO2006124085A3 MEMORY MODULE SYSTEM AND METHOD 审中-公开
公开(公告)号：WO2006124085A3
公开(公告)日：2006-11-23
申请号：PCT/US2006/004690
申请日：2006-02-09
申请人： STAKTEK GROUP L.P. , RAPPORT, Russell , GOODWIN, Paul , CADY, James W.
发明人： RAPPORT, Russell , GOODWIN, Paul , CADY, James W.
IPC分类号： H01L23/495
摘要： A circuit module is provided in which two secondary substrates (21A, 21B) or cards or the rigid portions (16B) of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector (12). The flexible circuitry (20) is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

8. 发明申请

WO2006028643A2 CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：电路模块系统和方法
公开(公告)号：WO2006028643A2
公开(公告)日：2006-03-16
申请号：PCT/US2005/028547
申请日：2005-08-10
申请人： STAKTEK GROUP L.P. , GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
发明人： GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
IPC分类号： H05K7/06 , H05K7/10
CPC分类号： H05K1/189 , G11C5/04 , H01L25/105 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
摘要： Flexible circuitry is populated with integrated circuits (ICs) disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。沿柔性电路分布的触点提供与IC的连接。优选地，柔性电路围绕刚性的导热基底的边缘设置，因此将集成电路置于衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。优选的衬底由导热材料构成。预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

9. 发明申请

WO2008060816A2 STACKABLE MICROPACKAGES AND STACKED MODULES 审中-公开
标题翻译：可堆叠的微型封装和堆叠模块
公开(公告)号：WO2008060816A2
公开(公告)日：2008-05-22
申请号：PCT/US2007/081931
申请日：2007-10-19
申请人： STAKTEK GROUP L.P. , SZEWERENKO, Leland , GOODWIN, Paul , WEHRLY, James, Douglas, JR.
发明人： SZEWERENKO, Leland , GOODWIN, Paul , WEHRLY, James, Douglas, JR.
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/48 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： The present invention provides a system and method for devising stackable assemblies (70) that may be then stacked to create a stacked circuit module (50). One or more integrated circuit (IC) die (12) are disposed on one or more sides of a redistribution substrate (20) that is preferably flexible circuitry. In some preferred embodiments, the die (12) and redistribution substrate (20) are bonded together and wire-bond (33) connected. Two or more stackable assemblies (70) are interconnected through frame members (30) to create low profile high density stacked circuit modules (50).
摘要翻译：本发明提供了一种用于设计可堆叠组件（70）的系统和方法，所述可堆叠组件可以被堆叠以产生堆叠的电路模块（50）。一个或多个集成电路（IC）管芯（12）设置在重新分布衬底（20）的一个或多个侧面上，其优选地是柔性电路。在一些优选实施例中，将管芯（12）和再分配衬底（20）接合在一起并且引线接合（33）连接。两个或多个可堆叠组件（70）通过框架构件（30）互连，以形成低轮廓的高密度堆叠电路模块（50）。

10. 发明申请

WO2006121478A3 SYSTEM COMPONENT INTERPOSER 审中-公开
公开(公告)号：WO2006121478A3
公开(公告)日：2006-11-16
申请号：PCT/US2006/004676
申请日：2006-02-09
申请人： STAKTEK GROUP L.P. , GOODWIN, Paul
发明人： GOODWIN, Paul
IPC分类号： H05K7/02
摘要： In some embodiments, a high density circuit module is provided having a support frame supporting a flexible circuit. A main integrated circuit and one or more supporting integrated circuit are mounted to the flexible circuit. Electrical connections between the main integrated circuit and the one or more integrated circuits are made on the flexible circuit. In other embodiments, a main integrated circuit such as, for example, a network processor, is mounted to a flexible circuit. Supporting integrated circuits, such as, for example, memory devices used by the network processor, are mounted on side portions of the flexible circuit. The side portions are folded to place the supporting integrated circuits higher than the main integrated circuit. Such placement may direct cooling airflow over the main integrated circuit's heat sink.

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