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    • 2. 发明申请
    • ELECTRONIC DOCUMENT READER
    • 电子文件阅读器
    • WO2010026409A1
    • 2010-03-11
    • PCT/GB2009/051071
    • 2009-08-27
    • PLASTIC LOGIC LIMITEDHAYTON, CarlREEVES, WilliamWATSON, BenFISHER, David
    • HAYTON, CarlREEVES, WilliamWATSON, BenFISHER, David
    • G06F1/18
    • G06F1/181
    • This invention generally relates to an electronic document reading device, that is to a device such as an electronic book which presents a document to a user on a display to enable the user to read the document. An electronic document reading device, the device having a front, display surface and a device rear surface, the device including a connector mounted on an edge of said device, wherein said device comprises a back panel having an exterior surface to provide said rear surface and an interior surface, wherein said back panel is substantially transparent and said interior surface of said back panel is substantially opaque, and wherein said back panel has a cut-out for said connector such that a rear surface of said connector is substantially flush with said device rear surface provided by said exterior of said transparent back panel, such that said opaque interior surface of said transparent back panel gives the impression of a device thinner than a physical thickness of said device defined by said substantially flush connector rear surface and said device rear surface.
    • 本发明一般涉及一种电子文件读取装置,即一种诸如电子书的装置,该装置在显示器上向用户呈现文件以使用户能够阅读该文件。 一种电子文件读取装置,该装置具有前部,显示表面和装置后表面,该装置包括安装在所述装置的边缘上的连接器,其中所述装置包括具有外表面以提供所述后表面的后面板, 内表面,其中所述后面板基本上是透明的,并且所述后面板的所述内表面基本上是不透明的,并且其中所述后面板具有用于所述连接器的切口,使得所述连接器的后表面基本上与所述装置齐平 由所述透明后面板的所述外部提供的后表面,使得所述透明后面板的所述不透明内表面的印象比由所述基本上齐平的连接器后表面和所述装置后表面限定的所述装置的物理厚度薄 。
    • 7. 发明申请
    • DISTORTION-TOLERANT PROCESSING
    • 失败处理
    • WO2008041027A1
    • 2008-04-10
    • PCT/GB2007/050599
    • 2007-10-01
    • PLASTIC LOGIC LIMITEDCAIN, PaulHAYTON, Carl
    • CAIN, PaulHAYTON, Carl
    • H05K3/02H05K1/00H01L21/77H01L27/28H01L27/32H01L51/00
    • H01L27/283G03F7/70791H01L27/124H01L51/0018H01L51/0021H01L51/0097H01L51/0541Y02E10/549Y02P70/521
    • The present invention relates to a distortion-tolerant method of processing an integrated circuit, incorporating a flexible substrate or a substrate that is susceptible to distortion. In particular, the present invention provides a method of manufacturing an integrated circuit (IC) for driving a flexible display, comprising: depositing a pattern of spatially non-repetitive features in a first layer on a flexible substrate, said pattern of spatially non-repetitive features not substantially regularly repeating in both of two orthogonal directions (x,y) in the plane of the substrate; depositing a pattern of spatially repet it ive features in a second layer on said first layer; aligning said second layer and said first layer so as to allow electrical coupling between said non-repetitive features and said repetitive features, wherein distortion compensation is applied during deposition of said repetitive features to enable said alignment.
    • 本发明涉及一种加工容易产生变形的柔性基板或基板的集成电路的变形容忍方法。 特别地,本发明提供一种制造用于驱动柔性显示器的集成电路(IC)的方法,包括:在柔性基板上的第一层中沉积空间非重复特征的图案,所述空间不重复的图案 特征在基板的平面中在两个正交方向(x,y)两者中基本不规则地重复; 在所述第一层上沉积在第二层中的空间重复图案; 对准所述第二层和所述第一层以允许所述非重复特征和所述重复特征之间的电耦合,其中在沉积所述重复特征期间施加失真补偿以使得能够进行对准。
    • 10. 发明申请
    • LASER ABLATION OF ELECTRONIC DEVICES
    • 电子设备的激光消除
    • WO2007029028A1
    • 2007-03-15
    • PCT/GB2006/050265
    • 2006-08-31
    • PLASTIC LOGIC LIMITEDCAIN, Paul AHAYTON, Carl
    • CAIN, Paul AHAYTON, Carl
    • H01L51/40H01L21/3213
    • H01L51/0021B23K26/40B23K2203/172H01L27/283H01L51/0017H01L51/0512
    • The present invention relates to methods of fabricating electronic devices using laser ablation and to devices fabricated thereby. Embodiments of the methods are particularly suitable for defining electrodes within thin film transistor (TFT) structures using laser ablation in a step-and-repeat mode. A method of fabricating an electronic device, the device comprising a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate, the method comprising: patterning said underlying layer; and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns; wherein said successively applied laser patterns overlap one another in an overlap region; and wherein said method further comprises configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.
    • 本发明涉及使用激光烧蚀制造电子器件的方法及其制造的器件。 该方法的实施例特别适合于在步进重复模式中使用激光烧蚀来限定薄膜晶体管(TFT)结构内的电极。 一种制造电子器件的方法,所述器件包括在衬底上的多个层,所述层包括上导电层和在所述导电层和所述衬底之间的至少一个图案化的底层,所述方法包括:图案化所述下层; 以及通过使用逐步过程的激光烧蚀来图案化所述上导电层,其中所述上导电层的连续区域被连续施加的激光图案消融; 其中所述连续施加的激光图案在重叠区域中彼此重叠; 并且其中所述方法还包括相对于彼此配置所述激光图案和所述图案化的下层,使得在所述重叠区域中,所述图案化底层通过所述逐步激光烧蚀基本上未损坏。