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    • 4. 发明申请
    • DOUBLE PATTERNING FOR LITHOGRAPHY TO INCREASE FEATURE SPATIAL DENSITY
    • 用于光刻的双重图案增加特征空间密度
    • WO2008059440A3
    • 2008-08-21
    • PCT/IB2007054604
    • 2007-11-13
    • NXP BVVANLEENHOVE ANJA MONIQUEDIRKSEN PETERVAN STEENWINCKEL DAVIDVAN DAL MARKDOORNBOS GERBENJUFFERMANS CASPER
    • VANLEENHOVE ANJA MONIQUEDIRKSEN PETERVAN STEENWINCKEL DAVIDVAN DAL MARKDOORNBOS GERBENJUFFERMANS CASPER
    • G03F7/00G03F7/11
    • G03F7/0035G03F7/11H01L21/0271H01L21/0273H01L21/823821H01L29/66795H01L29/6681H01L29/785
    • A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and / or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spatial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools.
    • 一种在衬底中或衬底上的至少一个器件层中形成图案的方法包括:用第一光刻胶层涂覆器件层; 使用第一掩模来暴露第一光致抗蚀剂; 显影第一光致抗蚀剂层以在衬底上形成第一图案; 用保护层涂覆衬底; 处理所述保护层以在其中与所述第一光刻胶接触的地方引起其中的变化,以使所述变化的保护层基本上不受后续曝光和/或显影步骤的影响; 用第二光致抗蚀剂层涂覆衬底; 使用第二掩模曝光第二光致抗蚀剂层; 以及显影所述第二光致抗蚀剂层以在所述衬底上形成第二图案而不显着影响所述第一光致抗蚀剂层中的所述第一图案,其中所述第一图案和所述第二图案一起限定具有大于每个图案中限定的特征的空间频率的散布特征 第一和第二图案分开。 该工艺在定义finFET器件的源极,漏极和鳍片特征方面具有特别的实用性,其特征尺寸小于通用光刻工具所能实现的特征尺寸。
    • 6. 发明申请
    • LITHOGRAPHIC METHOD
    • 光刻方法
    • WO2006056905A3
    • 2007-08-30
    • PCT/IB2005053700
    • 2005-11-10
    • KONINKL PHILIPS ELECTRONICS NVVAN STEENWINCKEL DAVIDZANDBERGEN PETER
    • VAN STEENWINCKEL DAVIDZANDBERGEN PETER
    • G03F7/30G03F7/32
    • G03F7/30G03F7/095G03F7/32
    • A method of achieving frequency doubled lithographic patterning is described. An optical pattern (16) having a first period (p 1 ) is used to expose conventional acid-catalysed photoresist (18) on substrate (20), leaving regions of high exposure (24), regions of low exposure (26) and intermediate regions (22). Processing proceeds leaving regions (24) which received high exposure very polar, i.e. hydrophilic, regions (26) of low exposure very apolar, i.e. hydrophobic, and the intermediate regions having intermediate polarity. A developer of intermediate polarity such as propylene glycol methyl ether acetate is then used to dissolve only the intermediate regions (22) leaving photoresist patterned to have a pitch (p 2 ) half that of the optical period (p 1 ). Alternatively, the photoresist is removed from the apolar and polar regions leaving only the intermediate regions (22) again with the same pitch (p 2 ) half that of the optical period (p 1 ).
    • 描述了实现倍频光刻图案化的方法。 使用具有第一周期(p <1> 1)的光学图案(16)来曝光基底(20)上的常规酸催化光致抗蚀剂(18),留下高曝光区域(24) 低暴露(26)和中间区域(22)。 处理进行离开区域(24),其接收高暴露非常极性,即亲水性低暴露非极性,即疏水性的区域(26),并且具有中等极性的中间区域。 然后使用中等极性的显影剂,例如丙二醇甲基醚乙酸酯,仅溶解中间区域(22),使光致抗蚀剂图案化成具有光学周期(p)的一半的间距(p <2> 2) 1 )。 或者,光致抗蚀剂从非极性区域和极性区域移除,仅使中间区域(22)再次以光学周期(p 1 )。