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1. 发明申请

WO02100594A8 IMPROVED METHOD AND APPARATUS FOR BI-DIRECTIONALLY POLISHING A WORKPIECE 审中-公开
标题翻译：改进方法和设备，用于双向抛光工作
公开(公告)号：WO02100594A8
公开(公告)日：2003-02-20
申请号：PCT/US0218827
申请日：2002-06-12
申请人： NUTOOL INC
发明人： TALIEH HOMAYOUN , VOLODARSKY KONSTANTIN , ASHJAEE JALAL , YOUNG DOUGLAS W , PERLOV VULF , VELAZQUEZ EFRAIN , HENDERSON MARK , FREY BERNARD M
IPC分类号： B24B21/04 , B24B21/22 , B24B37/04 , H01L21/304 , B24B21/00
CPC分类号： B24B37/04 , B24B21/04 , B24B21/22
摘要： A chemical mechanical polishing apparatus and method uses a portion of a polishing pad (130) that is disposed under tension between a supply spool (160) and a receive spool (162) such that it will not degrade, a single drive system that allows for efficient bi-directional linear motion, and a mechanism that provides tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor (770) that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism (fig 8) is used to ensure that the tension of the polishing pad is consistently maintained.
摘要翻译：化学机械抛光装置和方法使用抛光垫（130）的设置在供应卷轴（160）和接收卷轴（162）之间的张力使其不会劣化的部分，单个驱动系统允许高效的双向直线运动，以及向供应卷轴或接收卷轴提供张力的机构，而另一个卷轴在加工期间被锁定。如果需要抛光垫的新部分，则使用提供张力的相同马达（770）将抛光垫推进确定的量。此外，在处理期间，使用反馈机构（图8）来确保抛光垫的张力一直保持。

2. 发明申请

WO0152307A9 SEMICONDUCTOR WORKPIECE PROXIMITY PLATING METHODS AND APPARATUS 审中-公开
标题翻译：半导体工件临近镀层方法和装置
公开(公告)号：WO0152307A9
公开(公告)日：2002-08-15
申请号：PCT/US0100958
申请日：2001-01-10
申请人： NUTOOL INC
发明人： UZOH CYPRIAN E , TALIEH HOMAYOUN , BASOL BULENT , YOUNG DOUGLAS W
IPC分类号： B24B37/04 , C25D5/06 , C25D7/12 , C25D17/14 , C25F7/00 , H01L21/288 , H01L21/768
CPC分类号： B24B37/20 , B24B37/046 , B24B37/24 , B24B37/26 , C25D5/06 , C25D17/001 , C25D17/14 , C25F7/00 , H01L21/2885 , H01L21/76877
摘要： The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.
摘要翻译：本发明涉及通过旋转靠近基板的垫片或刀片型物体来在半导体衬底上镀覆导电材料的方法和装置，从而消除/减少凹陷和空隙。这通过提供安装在圆柱形阳极或辊子上的垫片或刀片型物体，并使用设置在垫片上或穿过垫片上的电解质溶液将导电材料施加到衬底来实现。在本发明的一个实施例中，衬垫或刀片型物体安装在圆柱形阳极上并围绕第一轴线旋转，同时工件可以是静止的或围绕第二轴线旋转，并且来自电解质溶液的金属沉积在工件上，在工件和阳极之间施加电位差。在本发明的另一实施例中，电镀装置包括与阴极工件间隔开的阳极板。在向阳极板和阴极工件施加电力时，使用设置在电镀装置中的电解液将导电材料沉积在工件表面上，使用具有焊盘或刀片型物体的圆柱形辊。

3. 发明申请

WO0152307A2 SEMICONDUCTOR WORKPIECE PROXIMITY PLATING METHODS AND APPARATUS 审中-公开
标题翻译：半导体工件临近镀层方法和装置
公开(公告)号：WO0152307A2
公开(公告)日：2001-07-19
申请号：PCT/US0100958
申请日：2001-01-10
申请人： NUTOOL INC
发明人： UZOH CYPRIAN E , TALIEH HOMAYOUN , BASOL BULENT , YOUNG DOUGLAS W
IPC分类号： B24B37/04 , C25D5/06 , C25D7/12 , C25D17/14 , C25F7/00 , H01L21/288 , H01L21/768 , H01L
CPC分类号： B24B37/20 , B24B37/046 , B24B37/24 , B24B37/26 , C25D5/06 , C25D17/001 , C25D17/14 , C25F7/00 , H01L21/2885 , H01L21/76877
摘要： The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.
摘要翻译：本发明涉及通过旋转靠近基板的垫片或刀片型物体来在半导体衬底上镀覆导电材料的方法和装置，从而消除/减少凹陷和空隙。这通过提供安装在圆柱形阳极或辊子上的垫片或刀片型物体，并使用设置在垫片上或穿过垫片上的电解质溶液将导电材料施加到衬底来实现。在本发明的一个实施例中，衬垫或刀片型物体安装在圆柱形阳极上并围绕第一轴线旋转，同时工件可以是静止的或围绕第二轴线旋转，并且来自电解质溶液的金属沉积在工件上，在工件和阳极之间施加电位差。在本发明的另一实施例中，电镀装置包括与阴极工件间隔开的阳极板。在向阳极板和阴极工件施加电力时，使用设置在电镀装置中的电解液将导电材料沉积在工件表面上，使用具有焊盘或刀片型物体的圆柱形辊。

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