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    • 1. 发明申请
    • III-NITRIDE MATERIALS INCLUDING LOW DISLOCATION DENSITIES AND METHODS ASSOCIATED WITH THE SAME
    • 三氮化物材料包括低偏差密度和与之相关的方法
    • WO2006014472A1
    • 2006-02-09
    • PCT/US2005/023934
    • 2005-07-06
    • NITRONEX CORPORATIONPINER, Edwin, L.ROBERTS, John, ClaassenRAJAGOPAL, Pradeep
    • PINER, Edwin, L.ROBERTS, John, ClaassenRAJAGOPAL, Pradeep
    • C30B29/40
    • C30B29/403C30B25/02H01L21/02381H01L21/02458H01L21/02488H01L21/02505H01L21/0251H01L21/02513H01L21/0254H01L21/02543
    • Semiconductor structures including one, or more, III-nitride material regions (e.g., gallium nitride material region) and methods associated with such structures are provided. The III-nitride material regions) advantageously have a low dislocation density and, in particular, a low screw dislocation density. In some embodiments, the presence of screw dislocations in the III-nitride material regions) may be essentially eliminated. The presence of a strain-absorbing layer underlying the III-nitride material regions) and/or processing conditions can contribute to achieving the low screw dislocation densities. In some embodiments, the III-nitride material regions) having low dislocation densities include a gallium nitride material region which functions as the active region of the device. The low screw dislocation densities of the active device region (e.g., gallium nitride material region) can lead to improved properties (e.g., electrical and optical) by increasing electron transport, limiting non-radiative recombination, and increasing compositional/growth uniformity, amongst other effects.
    • 提供包括一个或多个III族氮化物材料区域(例如,氮化镓材料区域)的半导体结构以及与这种结构相关联的方法。 III族氮化物材料区域)有利地具有低位错密度,特别是低螺旋位错密度。 在一些实施例中,可以基本上消除III族氮化物材料区域中的螺旋位错的存在)。 存在III族氮化物材料区域下方的应变吸收层)和/或加工条件可有助于实现低螺旋位错密度。 在一些实施例中,具有低位错密度的III族氮化物材料区域包括用作器件的有源区的氮化镓材料区域。 活性器件区域(例如,氮化镓材料区域)的低螺旋位错密度可以通过增加电子传输,限制非辐射复合和增加组成/生长均匀性等而导致改进的性能(例如电和光学) 效果。
    • 7. 发明申请
    • GALLIUM NITRIDE MATERIAL DEVICES AND METHODS INCLUDING BACKSIDE VIAS
    • 包括背面VIAS的氮化镓材料装置和制造方法
    • WO2002069410A2
    • 2002-09-06
    • PCT/US2002/005182
    • 2002-02-22
    • NITRONEX CORPORATION
    • WEEKS, T., WarrenPINER, Edwin, L.BORGES, Ricardo, M.LINTHICUM, Kevin, M.
    • H01L33/00
    • H01L33/38H01L29/0657H01L29/2003H01L29/417H01L29/802H01L29/861H01L33/0079H01L33/32H01L33/382H01L47/026H01L2924/10155
    • The invention includes providing gallium nitride material devices having backside vias and methods to form the devices. The devices include a gallium nitride material formed over a substrate, such as silicon. The device also may include one or more non-conducting layers between the substrate and the gallium nitride material which can aid in the deposition of the gallium nitride material. A via is provided which extends from the backside of the device through the non-conducting layer(s) to enable electrical conduction between an electrical contact deposited within the via and, for example, an electrical contact on the topside of the device. Thus, devices of the invention may be vertically conducting. In other cases, the vias may be free of electrical contacts, for example, to enhance light extraction. Exemplary devices include laser diodes (LDs), light emitting diodes (LEDs), power rectifier diodes, FETs(e.g., HFETs), Gunn-effect diodes, and varactor diodes, amongst others.
    • 本发明包括提供具有背面通孔的氮化镓材料器件和形成器件的方法。 这些器件包括形成在诸如硅的衬底(12)之上的氮化镓材料(14)。 该装置还可以包括在衬底(12)和氮化镓材料(14)之间的一个或多个非导电层(15),其可帮助氮化镓材料的沉积。 提供了一种通孔(24),其从器件的背面(22)穿过非导电层(15)延伸,以使得能够在沉积在通孔(21)内的电触头(20)之间进行导电, 例如,设备顶部上的电触点(16)。 因此,本发明的装置可以是垂直导电的。 在其他情况下,通孔可以没有电接触,例如,以增强光提取。 示例性器件包括激光二极管(LD),发光二极管(LED),功率整流二极管,FET(例如,HFET),耿氏效应二极管和变容二极管等。