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1. 发明申请

WO1998009332A1 SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS AND PROCESS FOR PRODUCING SAME 审中-公开
标题翻译：具有低熔点金属气泡的半导体器件及其制造方法
公开(公告)号：WO1998009332A1
公开(公告)日：1998-03-05
申请号：PCT/JP1997002987
申请日：1997-08-27
申请人： NIPPON STEEL CORPORATION , TATSUMI, Kohei , SHIMOKAWA, Kenji , HASHINO, Eiji
发明人： NIPPON STEEL CORPORATION
IPC分类号： H01L23/485
CPC分类号： H01L24/05 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/742 , H01L24/81 , H01L24/94 , H01L2224/0345 , H01L2224/03828 , H01L2224/0401 , H01L2224/05023 , H01L2224/05026 , H01L2224/05027 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05111 , H01L2224/05116 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05184 , H01L2224/05554 , H01L2224/05555 , H01L2224/05568 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/11003 , H01L2224/11334 , H01L2224/11849 , H01L2224/13013 , H01L2224/13014 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16227 , H01L2224/81815 , H01L2224/94 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , Y10T29/49222 , H01L2924/00014 , H01L2924/01049 , H01L2224/1308 , H01L2224/13099 , H01L2224/05655 , H01L2224/05664 , H01L2224/05611 , H01L2224/05669 , H01L2224/11 , H01L2924/00012
摘要： A semiconductor device (1) comprising electrodes formed on a semiconductor chip (2) and bumps (3) which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (5). The electrodes (5) are formed from an electrode material of Cu or a Cu alloy, Al or an Al alloy, or Au or a Au alloy. When the electrode material is composed of Al or an Al alloy, the electrodes contain, on the electrode material layer of Al or an Al alloy, at least one layer (6) composed of a metal or metal alloy (preferably a metal selected from Ti, W, Ni, Cr, Au, Pd, Cu, Pt, Ag, Sn or Pb, or an alloy of these metals) having a melting point higher than the electrode material. The low melting point metal balls (3) are adhesive bonded to the electrodes (5) preferably with a flux. The low melting point metal balls (3) adhesive bonded to the respective electrodes (3) may also be reflowed to form semispherical bumps (10) before use.
摘要翻译：一种半导体器件（1），包括形成在半导体芯片（2）上的电极和由球形并且具有给定尺寸并且与电极（5）粘合的低熔点金属球组成的凸块（3）。电极（5）由Cu或Cu合金，Al或Al合金或Au或Au合金的电极材料形成。当电极材料由Al或Al合金构成时，电极在Al或Al合金的电极材料层上含有至少一层由金属或金属合金构成的层（6），优选选自Ti ，W，Ni，Cr，Au，Pd，Cu，Pt，Ag，Sn或Pb，或这些金属的合金）。低熔点金属球（3）优选用助焊剂粘合到电极（5）上。粘结到各个电极（3）上的粘合剂的低熔点金属球（3）也可以在使用前被回流以形成半球形凸块（10）。

2. 发明申请

WO1998009487A1 METHOD AND DEVICE FOR SUPPLYING FLUX 审中-公开
标题翻译：用于提供通量的方法和装置
公开(公告)号：WO1998009487A1
公开(公告)日：1998-03-05
申请号：PCT/JP1997003038
申请日：1997-08-29
申请人： NIPPON STEEL CORPORATION , SHIMOKAWA, Kenji , TATSUMI, Kohei , HASHINO, Eiji
发明人： NIPPON STEEL CORPORATION
IPC分类号： H05K03/34
CPC分类号： B23K1/203 , H05K3/3489
摘要： A method and device for supplying flux by which flux (6) can be supplied appropriately to an electrode section (2) of electronic parts (1) containing a semiconductor chip and a printed circuit board. The device is provided with a discharge nozzle (10) having a means which discharges the flux (6) in drops and the flux (6) is discharged in drops from the nozzle (10) and adhered to the electrode section (2) by a required amount. The discharge nozzle (10) of another device of this invention is provided with a continuously exciting means (23) which discharges the flux (6) in a continuous jet while the means (23) excites part of the flux (6), a splitting means (21) which splits the discharged continuous jet into a uniform particle train, and an electrifying means (22) which controls the direction of the jet by electrifying the uniform particle train so as to adhere the flux (6) to the electrode section (2) by a required amount.
摘要翻译：一种用于供给焊剂的方法和装置，通过该焊剂可以将含有半导体芯片和印刷电路板的电子部件（1）的电极部（2）适当地供给焊剂（6）。该装置设置有排出喷嘴（10），该喷嘴具有将液滴（6）以液滴的形式排出的装置，并且焊剂（6）从喷嘴（10）以液滴的形式排出，并通过一个所需金额本发明另一装置的排放喷嘴（10）设置有连续激励装置（23），其以连续喷射的方式排放焊剂（6），同时装置（23）激发焊剂（6）的一部分，分裂将排出的连续射流分成均匀的粒子列的装置（21）和通过使均匀的粒子列通过控制喷射方向以使焊剂（6）附着到电极部（22）的通电装置（22） 2）所需数量。

3. 发明申请

WO1998034273A1 BALL ARRANGING SUBSTRATE FOR FORMING BUMP, BALL ARRANGING HEAD, BALL ARRANGING DEVICE, AND BALL ARRANGING METHOD 审中-公开
标题翻译：球形安装基座用于形成BUMP，球安装头，球安装装置和球安装方法
公开(公告)号：WO1998034273A1
公开(公告)日：1998-08-06
申请号：PCT/JP1997003011
申请日：1997-08-28
申请人： NIPPON STEEL CORPORATION , SHIMOKAWA, Kenji , HASHINO, Eiji , TATSUMI, Kohei
发明人： NIPPON STEEL CORPORATION
IPC分类号： H01L21/321
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/11 , H01L2224/05624 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01054 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15788 , H05K1/0269 , H05K2201/0108 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , H01L2924/00 , H01L2924/00014
摘要： A ball arranging substrate is provided with a substrate having a main surface and a plurality of arranging holes for holding fine conductive balls by suction formed on the main surface at the positions corresponding to the electrodes of a semiconductor element, circuit board, etc. At the time of optically discriminating the normal/abnormal condition of the arranging state of the fine conductive balls from the light reflected from the ball arranging surface of the substrate on which the balls are held by suction by irradiating the ball arranging surface with light, the wavelength of the irradiating light is set within the range of 300-900 nm and, at the same time, the reflectance of the ball arranging surface to the light is set at
摘要翻译：球排列基板具有基板，该基板具有主表面和多个用于在与半导体元件，电路板等的电极对应的位置处的主表面上形成的吸引保持微小导电球的排列孔。在通过用光照射球排列表面，通过抽吸来光学地鉴别导电球的布置状态的正常/异常状况与通过吸力保持球的基底的球排列表面反射的光，波长将照射光设定在300-900nm的范围内，同时将球排列面对光的反射率设定为<50％。然而，当布置基板具有透光性时，通过将反射镜定位在与基板相反的一侧上的光源来测量反射率。

4. 发明申请

WO1998009328A1 METHOD OF PARTIALLY PLATING ELECTRONIC COMPONENT BOARD 审中-公开
标题翻译：部分电子元件板的方法
公开(公告)号：WO1998009328A1
公开(公告)日：1998-03-05
申请号：PCT/JP1997002988
申请日：1997-08-27
申请人： NIPPON STEEL CORPORATION , TATSUMI, Kohei , SHIMOKAWA, Kenji , HASHINO, Eiji
发明人： NIPPON STEEL CORPORATION
IPC分类号： H01L23/12
CPC分类号： H01L23/49582 , H01L21/4821 , H01L21/4846 , H01L2924/0002 , Y10T29/49142 , Y10T29/49144 , H01L2924/00
摘要： Specific portions to be plated are easily selected and the plating material quantity is arbitrarily controlled with a high precision. After minute metal balls (24) are arranged in a via-hole part (22) of a TAB tape (21) and bonded or joined to it, the minute metal balls (24) are melted to coat a copper wiring (23) which is exposed from the via-hole part of the TAB tape (21) with different type of metal selectively. With this constitution, the specific portions of an electronic component board can be partially plated easily with a high precision.
摘要翻译：容易选择要镀覆的特定部分，并且以高精度任意地控制电镀材料量。在TAB带（21）的通孔部分（22）中配置微小金属球（24）并将其接合或接合之后，微小金属球（24）熔化以覆盖铜布线（23），铜线从具有不同类型金属的TAB带（21）的通孔部分露出。利用这种结构，电子部件板的特定部分可以以高精度容易地部分地镀覆。

5. 发明申请

WO1998009323A1 METHOD AND DEVICE FOR FORMING VERY SMALL BALL BUMP 审中-公开
标题翻译：用于形成非常小的小球的方法和装置
公开(公告)号：WO1998009323A1
公开(公告)日：1998-03-05
申请号：PCT/JP1997002996
申请日：1997-08-28
申请人： NIPPON STEEL CORPORATION , SHIMOKAWA, Kenji , TATSUMI, Kohei , HASHINO, Eiji , YAMAMOTO, Toshio , KIKUCHI, Toshiharu
发明人： NIPPON STEEL CORPORATION
IPC分类号： H01L21/60
CPC分类号： H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099
摘要： A method and device for forming bumps composed of very small metallic balls on electrodes of semiconductor chips, printed board, etc. A first invention is such that a vacuum chamber for vacuum clamping is divided into a plurality of divisions and the clamping/releasing are controlled for each division so as to prevent balls from being clamped to an array board in aggregates. Partition walls are provided in the vacuum chamber. A second invention is such that cut-off sections are provided in an edge portion of the array board so as to prevent bumps already formed from being pressed against the board again. A third invention is such that a bump forming device which hold only one ball is disclosed. A forth invention is such that bumps are formed at once on two or more diced semiconductor chips. A fifth invention is such that an optimum amount range of very small metallic balls are accurately supplied to a container. A sixth invention is such that two or more balls excessively arranged on one suction hole of the array board are reliably detected.
摘要翻译：一种用于在半导体芯片，印刷电路板等的电极上形成由非常小的金属球构成的凸块的方法和装置。第一个发明是将真空夹紧的真空室分成多个分段，并且夹紧/释放被控制对于每个部分，以防止球被聚集在阵列板上。真空室内设有分隔壁。第二发明是在阵列板的边缘部分设置切断部分，以防止已经形成的凸起再次被压在基板上。第三发明是公开了仅保持一个球的凸块形成装置。第四发明是在两个或多个切割的半导体芯片上一次形成凸块。第五发明是将极小金属球的最佳量范围精确地供给到容器。第六发明是能够可靠地检测出排列在阵列基板的一个吸孔上的两个以上的球。

6. 发明申请

WO1994024322A1 GOLD ALLOY WIRE FOR BONDING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于焊接半导体器件的金合金线
公开(公告)号：WO1994024322A1
公开(公告)日：1994-10-27
申请号：PCT/JP1994000599
申请日：1994-04-08
申请人： NIPPON STEEL CORPORATION , UNO, Tomohiro , KITAMURA, Osamu , OHNO, Yasuhide Nippon Steel Corporation Advanced Materials & Technology Research Laboratorie
发明人： NIPPON STEEL CORPORATION
IPC分类号： C22C05/02
CPC分类号： H01L24/48 , C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48624 , H01L2224/48724 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01066 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/20752 , H01L2924/01081 , H01L2924/01004 , H01L2924/01049 , H01L2924/00014 , H01L2924/00 , H01L2924/013
摘要： This invention provides a gold alloy wire for bonding a semiconductor device to improve long term reliability of wire bonds to electrodes, reduce wire bending, increase the resistance against the flow of molding resin, and form a high wire loop. The gold alloy wire comprises 50 to 3,000 ppm by weight of Mn and the balance of gold and unavoidable impurities. Groups of elements to be added to the thin wire may be (1) 1 to 20 ppm by weight of at least one of Be and B, in total; (2) 1 to 30 ppm by weight of at least one of Ca, Sr and rare earth elements, in total; and (3) 1 to 50 ppm by weight of at least one of In and Tl, in total; a preferable combination is (1), (2), (1)+(2), (2)+(3) or (1)+(2)+(3). The gold alloy wire according to the present invention provides wire bonds on a semiconductor device, which are reliable even under a high temperature condition and further the gold alloy wire can cope with high density packaging of semiconductors.
摘要翻译：本发明提供了一种用于接合半导体器件的金合金线，以提高与电极的引线键合的长期可靠性，减少线弯曲，增加对模制树脂流动的阻力，并形成高线环。金合金丝包含50至3,000重量ppm的Mn，余量为金和不可避免的杂质。要添加到细丝中的元件组可以是（1）总共为1至20重量ppm的Be和B中的至少一个; （2）总计1〜30重量ppm的Ca，Sr和稀土元素中的至少一种; 和（3）1至50重量ppm的In和T1中的至少一个; 优选组合为（1），（2），（1）+（2），（2）+（3）或（1）+（2）+（3）。根据本发明的金合金丝线在半导体器件上提供引线键合，甚至在高温条件下也是可靠的，而且金合金线材可以应付半导体的高密度封装。

7. 发明申请

WO1998024633A1 ELECTROSTATIC RECORDING HEAD UNIT 审中-公开
标题翻译：静电记录头单元
公开(公告)号：WO1998024633A1
公开(公告)日：1998-06-11
申请号：PCT/JP1997004400
申请日：1997-12-02
申请人： NIPPON STEEL CORPORATION , SATO, Hitoshi , HORIKAWA, Takashi , UENO, Noboru
发明人： NIPPON STEEL CORPORATION
IPC分类号： B41J02/41
CPC分类号： G06K15/14
摘要： An electrostatic recording head unit and a method for detecting a fault caused in the electrostatic recording head provided with a device for detecting a head fault of the unit due to a short circuit between main electrodes, which is so structured that a main electrode current to be supplied to at least one group of main electrodes out of a plurality of the electrodes may be detected by a current detector, a value corresponding to a peak value of the main electrode current may be held, and the held value and the value corresponding to the main electrode current detected by the current detector may be compared to determine if the main electrode current is a short-circuit one or not. The electrostatic recording head is constituted with a plurality of main electrodes for discharging, a head assembly including a plurality of auxiliary electrodes located face to face with the main electrodes, connecting sections to be connected to the main electrodes respectively, connection boards connected via signal lines which are connected to the connecting sections, a main electrode driving board provided with a main electrode driving circuit for driving the main electrodes, an auxiliary electrode driving board provided with an auxiliary electrode driving circuit for driving the auxiliary electrodes, and a means for connecting the main electrode driving board and the auxiliary electrode driving board to the connection boards.
摘要翻译：一种静电记录头单元和用于检测在静电记录头中引起的故障的方法，该静电记录头设置有用于检测由于主电极之间的短路而导致的单元的头部故障的装置，其被构造成使得主电极电流为提供给多个电极中的至少一组主电极的电流可以由电流检测器检测，可以保持与主电极电流的峰值相对应的值，并且保持值和对应于可以比较由电流检测器检测的主电极电流，以确定主电极电流是否是短路的。静电记录头由多个用于放电的主电极构成，头组件包括分别与主电极面对面设置的多个辅助电极，分别连接到主电极的连接部分，经由信号线连接的连接板连接到连接部分的主电极驱动板，设置有用于驱动主电极的主电极驱动电路的主电极驱动板，设置有用于驱动辅助电极的辅助电极驱动电路的辅助电极驱动板，以及用于连接主电极驱动板和辅助电极驱动板连接到连接板。

8. 发明申请

WO1997049954A1 BURNING/MELTING METHOD OF WASTE MELTING FURNACE 审中-公开
标题翻译：燃烧熔融炉的熔融/熔融方法
公开(公告)号：WO1997049954A1
公开(公告)日：1997-12-31
申请号：PCT/JP1997002149
申请日：1997-06-23
申请人： NIPPON STEEL CORPORATION , ISHIDA, Yoshihiro , TAWARA, Youichi , KATO, Yasuhiko , ONO, Yoshihiro , KURIBAYASHI, Kazuhiro , FUKINAKA, Norio , HARAJIRI, Hachiro , MURAHASHI, Kazuki
发明人： NIPPON STEEL CORPORATION
IPC分类号： F23G05/24
CPC分类号： F23G5/085 , F23G5/24 , F23L2900/07007 , Y02E20/344
摘要： Sinking of a charge in a cross-sectional direction of a melting furnace is made uniform, poor heat-exchange between the charge and a gas due to improper sinking of the charge and local concentration of a gas flow is reduced to minimum, a melting condition of wastes is stabilized irrespective of the composition of the wastes, and a charge of a treating speed of the wastes is restricted, too. A plurality of lower stage tuyeres are disposed vertically in a burning/melting zone, carbonaceous mass-like inflammable matters are mainly burnt by supplying a combustion support gas, a plurality of upper stage tuyeres are disposed vertically in a plurality of stages at the positions above the tuyeres, and a part of the wastes is burnt by supplying the combustion support gas. In this instance, the combustion support gas equivalent to oxygen content of 130 to 600 Nm /t of wastes is supplied, and the combustion support gas is supplied from the upper stage tuyeres so that the proportion of the oxygen content from the upper tuyeres is 0.2 to 0.8 of the sum of those of the lower and upper stages. Further, the supply quantity is controlled so that the oxygen content supplied from the lower stage tuyeres is at least 0.8 times the theoretical oxygen content of the carbonaceous mass-like inflammable matters, and the exhaust gas temperature on the packing layer of the wastes is set to 150 to 700 DEG C.
摘要翻译：使熔融炉的横截面方向的电荷沉降均匀，由于电荷的不适当的下降和气流的局部浓缩，电荷与气体之间的热交换差降低到最小，熔融条件废物的成分不管废物的组成是否稳定，并且废物的处理速度受到限制。多个下级风口垂直设置在燃烧/熔化区域，主要通过供给燃烧载体气体来燃烧碳质物质的易燃物质，多个上级风口在上述位置处以多级垂直设置风口和一部分废物通过供给燃烧载体气而燃烧。在这种情况下，供给相当于氧含量为130〜600Nm 3 / t废弃物的燃烧载体气体，并且从上级风口供给燃烧载体气体，使得来自上层的氧含量的比例风口是下段和上段总和的0.2〜0.8。此外，控制供给量使得从下级风口供给的氧含量为碳质物质状易燃物的理论氧含量的0.8倍以上，废弃物的包装层上的废气温度设定为至150〜700℃

9. 发明申请

WO1997034715A1 COLD TANDEM ROLLING METHOD AND COLD TANDEM ROLLING MILL 审中-公开
标题翻译：冷轧带钢轧制方法和冷轧轧制轧机
公开(公告)号：WO1997034715A1
公开(公告)日：1997-09-25
申请号：PCT/JP1997000883
申请日：1997-03-18
申请人： NIPPON STEEL CORPORATION , SHIRAISHI, Toshiyuki , OGAWA, Shigeru , HAMAUZU, Shyuichi , ISHII, Atsushi
发明人： NIPPON STEEL CORPORATION
IPC分类号： B21B01/28
CPC分类号： B21B37/54 , B21B1/28
摘要： A cold tandem rolling method comprises performing rolling while loading a rolling tension amounting to 30 % or more, preferably 40 % or more of deformation resistance of a rolled material at the last stand when cold rolling is to be performed in a cold tandem rolling mill having four or more stands. A cold tandem rolling mill, in which Jc >/= (0,375 h + 0,275)JM is established where h designates an average product plate thickness on an output side of the last stand, Jc designates an output of one output side coiler or a sum of an output of one output side coiler and an output of an output side bridle roll, and JM designates an output of a main electric motor of a rolling mill at the last stand.
摘要翻译：冷串联轧制方法包括在将冷轧时进行轧制，该轧制张力在最终机架的轧制材料的30％以上，优选为40％以上，优选为40％以上，在具有四个或更多的立场。建立了一个冷串联轧机，其中Jc> / =（0,375℃+ 0,275）JM，其中h o表示最后一个输出侧的平均产品板厚度 Jc表示一个输出侧卷取机的输出或一个输出侧卷取机的输出和输出侧卷取辊的输出之和，JM表示最后一个机架上的轧机的主电动机的输出。

10. 发明申请

WO1997032675A1 CONTINUOUS HOT ROLLING METHOD 审中-公开
标题翻译：连续热轧方法
公开(公告)号：WO1997032675A1
公开(公告)日：1997-09-12
申请号：PCT/JP1996003362
申请日：1996-11-15
申请人： NIPPON STEEL CORPORATION , MATSUO, Shinji , MAEDA, Katsuhiro , ARIZUMI, Seiji , MINAMIDA, Katsuhiro , OHARA, Masahiro , NAKAMURA, Takaaki , KATO, Hiroki , NISHIBAYASHI, Shigeru , ABE, Masakazu
发明人： NIPPON STEEL CORPORATION
IPC分类号： B21B01/26
CPC分类号： B23K26/26 , B21B1/26 , B21B15/0085 , B21B2038/004 , B23K26/211 , B23K26/60 , B23K35/3053 , B23K2103/04
摘要： A continuous hot rolling method which comprises forming abutting surfaces on steel materials to be hot rolled by cutting off a rear end portion of a precedent steel material and a front end portion of a subsequent steel material, determining a scale weight ratio by measuring the thickness of scales occurring on the abutting surfaces, calculating the amount of oxygen dissolving in a fused portion of a weld on the basis of the resultant scale weight ratio, determining a deoxidizable amount to deoxidize the calculated oxygen amount, forming a fused portion of a weld by applying laser beams to an abutted portion in which the abutting surfaces are engaged with each other, impregnating the fused portion of the weld with a deoxidizer of a capacity corresponding to the deoxidizable amount, and subjecting the fusion welded steel material to a continuous hot rooling.
摘要翻译：一种连续热轧方法，包括通过切断先前钢材的后端部分和随后的钢材的前端部分来形成待热轧的钢材上的邻接表面，通过测量尺寸重量比，基于所得到的标尺重量比计算焊接熔融部分中溶解氧的量，确定可脱氧的量以使计算的氧量脱氧，通过施加焊接形成焊接的熔融部分将激光束照射到抵接面彼此接合的邻接部分，用与可脱氧量相对应的容量的脱氧剂浸渍焊缝的熔融部分，并对熔焊钢材进行连续热轧。

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