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1. 发明申请

WO2011099820A2 PCB WITH CAVITY AND FABRICATING METHOD THEREOF 审中-公开
标题翻译： PCB及其制造方法
公开(公告)号：WO2011099820A2
公开(公告)日：2011-08-18
申请号：PCT/KR2011/000953
申请日：2011-02-11
申请人： LG INNOTEK CO., LTD. , KIM, Hyung Jong , YOO, Jae Hyoun , CHUN, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
发明人： KIM, Hyung Jong , YOO, Jae Hyoun , CHUN, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
IPC分类号： H05K3/04 , H05K3/46
CPC分类号： H05K3/4697 , H05K1/186 , H05K3/0032
摘要： A fabricating method of a printed circuit board (PCB) with a cavity and a structure of the PCB fabricated by the method are provided. The method includes a first step of forming a base circuit board provided with an internal circuit layer having cavity circuit patterns on a surface of a substrate, a second step of forming a laser stopper layer on upper portions of the cavity circuit patterns, a third step of forming at least one external circuit layer on the base circuit board, and a fourth step of forming a cavity region by removing the external circuit layer on an upper portion of the laser stopper layer. Accordingly, in a fabricating method of a multi-layered PCB with a cavity, a laser stopper layer is formed on upper surfaces of cavity circuit patterns, so that it is possible to rapidly and precisely form the cavity, to precisely control the depth of the cavity and to have no influence on a circuit previously formed in the interior of the cavity.
摘要翻译：提供了一种具有通过该方法制造的PCB的空腔和结构的印刷电路板（PCB）的制造方法。该方法包括：第一步骤，在基板的表面上形成设置有具有空腔电路图案的内部电路层的基底电路板，在腔电路图案的上部形成激光停止层的第二步骤;第三步骤在所述基底电路板上形成至少一个外部电路层;以及第四步骤，通过去除所述激光停止层的上部上的所述外部电路层来形成空腔区域。因此，在具有空腔的多层PCB的制造方法中，在空腔电路图案的上表面上形成激光停止层，从而可以快速且精确地形成空腔，以精确地控制并且对先前在腔体内部形成的电路没有影响。

2. 发明申请

WO2012053728A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2012053728A1
公开(公告)日：2012-04-26
申请号：PCT/KR2011/004870
申请日：2011-07-01
申请人： LG INNOTEK CO., LTD. , KIM, Hyung Jong , YOO, Jae Hyoun , JEON, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
发明人： KIM, Hyung Jong , YOO, Jae Hyoun , JEON, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
IPC分类号： H05K3/46 , H05K1/18
CPC分类号： H05K1/02 , H05K3/0035 , H05K3/4697 , H05K2201/09127
摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes forming a base circuit board including a cavity circuit pattern in a cavity region on upper and lower portions of a substrate and internal circuit layers outside the cavity region, forming a cavity separation layer on the cavity circuit pattern, forming at least one pair of an insulating layer and a circuit layer on the base circuit board, cutting the insulating layer and the cavity separation layer provided on an etch stop pattern by controlling a focal length of a laser beam such that the laser beam reaches a surface of the base circuit board, and removing the insulating layer by separating the cavity separation layer to form the cavity. The cavity separation layer is formed on the cavity circuit pattern, and the resultant structure is cut to the cavity separation layer by using a laser so that the insulating layer is separated. Accordingly, the insulating layer in the cavity is easily removed.
摘要翻译：公开了一种印刷电路板及其制造方法。制造印刷电路板的方法包括在基板的上部和下部的空腔区域中形成包括空腔电路图案的基底电路板和在腔区域外部的内部电路层，在空腔电路图案上形成空腔分离层在所述基底电路板上形成至少一对绝缘层和电路层，通过控制所述激光束的焦距来切割设置在所述蚀刻停止图案上的所述绝缘层和所述腔分离层，使得所述激光束到达基底电路板的表面，并且通过分离空腔分离层以形成空腔来去除绝缘层。空腔分离层形成在空腔电路图案上，并且通过使用激光将所得结构切割到空腔分离层，使得绝缘层被分离。因此，容易去除空腔中的绝缘层。

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