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1. 发明申请

WO2011099820A2 PCB WITH CAVITY AND FABRICATING METHOD THEREOF 审中-公开
标题翻译： PCB及其制造方法
公开(公告)号：WO2011099820A2
公开(公告)日：2011-08-18
申请号：PCT/KR2011/000953
申请日：2011-02-11
申请人： LG INNOTEK CO., LTD. , KIM, Hyung Jong , YOO, Jae Hyoun , CHUN, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
发明人： KIM, Hyung Jong , YOO, Jae Hyoun , CHUN, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
IPC分类号： H05K3/04 , H05K3/46
CPC分类号： H05K3/4697 , H05K1/186 , H05K3/0032
摘要： A fabricating method of a printed circuit board (PCB) with a cavity and a structure of the PCB fabricated by the method are provided. The method includes a first step of forming a base circuit board provided with an internal circuit layer having cavity circuit patterns on a surface of a substrate, a second step of forming a laser stopper layer on upper portions of the cavity circuit patterns, a third step of forming at least one external circuit layer on the base circuit board, and a fourth step of forming a cavity region by removing the external circuit layer on an upper portion of the laser stopper layer. Accordingly, in a fabricating method of a multi-layered PCB with a cavity, a laser stopper layer is formed on upper surfaces of cavity circuit patterns, so that it is possible to rapidly and precisely form the cavity, to precisely control the depth of the cavity and to have no influence on a circuit previously formed in the interior of the cavity.
摘要翻译：提供了一种具有通过该方法制造的PCB的空腔和结构的印刷电路板（PCB）的制造方法。该方法包括：第一步骤，在基板的表面上形成设置有具有空腔电路图案的内部电路层的基底电路板，在腔电路图案的上部形成激光停止层的第二步骤;第三步骤在所述基底电路板上形成至少一个外部电路层;以及第四步骤，通过去除所述激光停止层的上部上的所述外部电路层来形成空腔区域。因此，在具有空腔的多层PCB的制造方法中，在空腔电路图案的上表面上形成激光停止层，从而可以快速且精确地形成空腔，以精确地控制并且对先前在腔体内部形成的电路没有影响。

2. 发明申请

WO2011099820A3 PCB WITH CAVITY AND FABRICATING METHOD THEREOF 审中-公开
标题翻译： PCB及其制造方法
公开(公告)号：WO2011099820A3
公开(公告)日：2012-01-12
申请号：PCT/KR2011000953
申请日：2011-02-11
申请人： LG INNOTEK CO LTD , KIM HYUNG JONG , YOO JAE HYOUN , CHUN JIN GOO , PARK JUN SOO , LEE KI YONG
发明人： KIM HYUNG JONG , YOO JAE HYOUN , CHUN JIN GOO , PARK JUN SOO , LEE KI YONG
IPC分类号： H05K3/04 , H05K3/46
CPC分类号： H05K3/4697 , H05K1/186 , H05K3/0032
摘要： A fabricating method of a printed circuit board (PCB) with a cavity and a structure of the PCB fabricated by the method are provided. The method includes a first step of forming a base circuit board provided with an internal circuit layer having cavity circuit patterns on a surface of a substrate, a second step of forming a laser stopper layer on upper portions of the cavity circuit patterns, a third step of forming at least one external circuit layer on the base circuit board, and a fourth step of forming a cavity region by removing the external circuit layer on an upper portion of the laser stopper layer. Accordingly, in a fabricating method of a multi-layered PCB with a cavity, a laser stopper layer is formed on upper surfaces of cavity circuit patterns, so that it is possible to rapidly and precisely form the cavity, to precisely control the depth of the cavity and to have no influence on a circuit previously formed in the interior of the cavity.
摘要翻译：提供了一种具有通过该方法制造的PCB的空腔和结构的印刷电路板（PCB）的制造方法。该方法包括：第一步骤，在基板的表面上形成设置有具有空腔电路图案的内部电路层的基底电路板，在腔电路图案的上部形成激光停止层的第二步骤;第三步骤在所述基底电路板上形成至少一个外部电路层;以及第四步骤，通过去除所述激光停止层上部的所述外部电路层来形成空腔区域。因此，在具有空腔的多层PCB的制造方法中，在空腔电路图案的上表面上形成激光停止层，从而可以快速且精确地形成空腔，以精确地控制并且对先前在腔体内部形成的电路没有影响。

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