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1. 发明申请

WO2012053728A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：WO2012053728A1
公开(公告)日：2012-04-26
申请号：PCT/KR2011/004870
申请日：2011-07-01
申请人： LG INNOTEK CO., LTD. , KIM, Hyung Jong , YOO, Jae Hyoun , JEON, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
发明人： KIM, Hyung Jong , YOO, Jae Hyoun , JEON, Jin Goo , PARK, Jun Soo , LEE, Ki Yong
IPC分类号： H05K3/46 , H05K1/18
CPC分类号： H05K1/02 , H05K3/0035 , H05K3/4697 , H05K2201/09127
摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes forming a base circuit board including a cavity circuit pattern in a cavity region on upper and lower portions of a substrate and internal circuit layers outside the cavity region, forming a cavity separation layer on the cavity circuit pattern, forming at least one pair of an insulating layer and a circuit layer on the base circuit board, cutting the insulating layer and the cavity separation layer provided on an etch stop pattern by controlling a focal length of a laser beam such that the laser beam reaches a surface of the base circuit board, and removing the insulating layer by separating the cavity separation layer to form the cavity. The cavity separation layer is formed on the cavity circuit pattern, and the resultant structure is cut to the cavity separation layer by using a laser so that the insulating layer is separated. Accordingly, the insulating layer in the cavity is easily removed.
摘要翻译：公开了一种印刷电路板及其制造方法。制造印刷电路板的方法包括在基板的上部和下部的空腔区域中形成包括空腔电路图案的基底电路板和在腔区域外部的内部电路层，在空腔电路图案上形成空腔分离层在所述基底电路板上形成至少一对绝缘层和电路层，通过控制所述激光束的焦距来切割设置在所述蚀刻停止图案上的所述绝缘层和所述腔分离层，使得所述激光束到达基底电路板的表面，并且通过分离空腔分离层以形成空腔来去除绝缘层。空腔分离层形成在空腔电路图案上，并且通过使用激光将所得结构切割到空腔分离层，使得绝缘层被分离。因此，容易去除空腔中的绝缘层。

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