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    • 4. 发明申请
    • TUNNELING TRANSISTORS INCLUDING SOURCE/DRAIN REGIONS EMPLOYING CONTACT RESISTANCE REDUCING LAYER
    • 隧道晶体管,包括源/漏区,使用接触电阻降低层
    • WO2018063315A1
    • 2018-04-05
    • PCT/US2016/054732
    • 2016-09-30
    • INTEL CORPORATION
    • GLASS, Glenn A.MURTHY, Anand S.YOUNG, Ian A.AVCI, Uygar E.
    • H01L29/78H01L29/73H01L29/66H01L21/8238H01L29/423
    • H01L27/0886H01L21/823418H01L21/823481H01L29/165H01L29/205H01L29/66795H01L29/7391H01L29/7851
    • Techniques are disclosed for forming tunneling transistors including source and drain (S/D) regions employing a contact resistance reducing layer. The contact resistance reducing layer may be formed between at least one of the S/D regions and its corresponding contact to improve the transistor performance. In addition, in some cases, material bandgap engineering may be used to enhance the ability of tunneling transistor devices, such as tunnel field-effect transistors (TFETs) and Fermi filter FETs (FFFETs), to resist off-state leakage currents from source to drain (through the channel) and from source to ground/substrate. Such material bandgap engineering can incorporate a material-based band offset component by using different material in the S/D regions to control off-state leakage, to expand upon the limited energy band offset achievable using single-composition material configurations. Increasing the band offset can increase the barrier that carriers must overcome to reach the channel region, thereby reducing off-state leakage.
    • 公开了用于形成包括采用接触电阻降低层的源极和漏极(S / D)区域的隧穿晶体管的技术。 接触电阻降低层可以形成在S / D区域中的至少一个与其相应的接触之间以改善晶体管性能。 另外,在一些情况下,可以使用材料带隙工程来增强诸如隧道场效应晶体管(TFET)和费米滤波器FET(FFFET)之类的隧道晶体管器件的能力以抵抗来自源的截止状态漏电流到 漏极(通过通道)和从源极到地/基板。 这种材料带隙工程可以通过使用S / D区域中的不同材料来控制截止状态泄漏,从而在使用单组分材料构造可实现的有限能带偏移时扩展基于材料的带偏移分量。 增加频带偏移可以增加载波必须克服的到达信道区域的屏障,从而减少关闭状态泄漏。
    • 5. 发明申请
    • MEMORY CELL WITH ASYMMETRIC CONDUCTION TO REDUCE WRITE MINIMUM OPERATING VOLTAGE (WVMIN) AND POWER CONSUMPTION
    • 具有不对称导通的存储器单元以减少写入最小工作电压(WVMIN)和功耗
    • WO2017052621A1
    • 2017-03-30
    • PCT/US2015/052352
    • 2015-09-25
    • INTEL CORPORATIONMORRIS, Daniel H.AVCI, Uygar E.YOUNG, Ian A.
    • MORRIS, Daniel H.AVCI, Uygar E.YOUNG, Ian A.
    • H01L27/11
    • H01L27/1104G11C7/02G11C11/412G11C11/419
    • Techniques for providing asymmetric conduction within an SRAM bit cell are provided and may substantially reduce energy consumption during write operations, and may also reduce the write minimum operation voltage (WVmin) for an SRAM device. In particular, some aspects disclosed herein include modifying or otherwise providing pull-up transistors configured to asymmetrically conduct to prevent current flow in a reverse direction, and more particularly, to prevent or otherwise mitigate current flowing back to Vcc during write operations. This can reduce voltage swings that would otherwise occur as internal bit cell nodes Q/Q# discharge, and thus, may reduce overall power consumption. The asymmetrical conducting characteristics may further reduce the magnitude of disturb currents within unselected cells (e.g., cells not selected for writes) and thus prevent the loss of data through inadvertent writes.
    • 提供了用于在SRAM位单元内提供不对称传导的技术,并且可以显着降低写入操作期间的能量消耗,并且还可以降低SRAM器件的写入最小工作电压(WVmin)。 特别地,本文公开的一些方面包括修改或以其他方式提供被配置为不对称地导通的上拉晶体管,以防止在相反方向上的电流流动,更具体地,涉及防止或以其它方式缓解在写入操作期间流向Vcc的电流。 这可以减少当内部位单元节点Q / Q#放电时会发生的电压摆幅,从而可能降低总功耗。 不对称导电特性可以进一步减小未选择的单元(例如,未被选择用于写入的单元)内的干扰电流的大小,从而通过无意写入来防止数据丢失。