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1. 发明申请

WO02097145B1 COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 审中-公开
标题翻译：用于高温无铅焊料的组合物，方法和装置
公开(公告)号：WO02097145B1
公开(公告)日：2004-05-27
申请号：PCT/US0117491
申请日：2001-05-28
申请人： HONEYWELL INT INC , LALENA JOHN , DEAN NANCY , WEISER MARTIN
发明人： LALENA JOHN , DEAN NANCY , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/26 , C22C5/02 , C22C12/00 , C22C13/00 , C22C13/02 , H01L21/60
CPC分类号： B23K35/264 , B23K35/00 , B23K2035/008 , C22C5/02 , C22C12/00 , C22C13/02 , H01L24/29 , H01L24/31 , H01L24/83 , H01L2224/04026 , H01L2224/29 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/29298 , H01L2224/8319 , H01L2224/83801 , H01L2224/83805 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01058 , H01L2924/0106 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A lead-free solder (130) comprises an alloy of silver and bismuth in amounts of 2wt% to 18wt% and 98wt% to 82wt%, respectively. Contemplated alloys have a solidus of no lower than 262.5 DEG C and a liquidus of no higher than 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of the alloy.
摘要翻译：无铅焊料（130）分别含有2重量％至18重量％和98重量％至82重量％的银和铋合金。沉积的合金具有不低于262.5℃的固相线和不高于400℃的液相线。考虑的合金可以进一步包含具有高于合金的氧亲和力的氧亲和力的化学元素。

2. 发明申请

WO03026828A3 IMPROVED COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER 审中-公开
标题翻译：改进的用于高温无铅焊料的组合物，方法和装置
公开(公告)号：WO03026828A3
公开(公告)日：2003-06-19
申请号：PCT/US0230608
申请日：2002-09-25
申请人： HONEYWELL INT INC , DEAN NANCY , LALENA JOHN , WEISER MARTIN
发明人： DEAN NANCY , LALENA JOHN , WEISER MARTIN
IPC分类号： B23K35/00 , B23K35/22 , B23K35/26 , C22C1/02 , C22C12/00 , C22C13/00
CPC分类号： B23K35/264 , B23K35/007 , B23K2201/40 , H01L24/29 , H01L24/32 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： A lead-free (130) solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppmy and have a solidus of no lower than about 262.5 DEG C and a liquidus of no higher than about 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.
摘要翻译：无铅（130）焊料包含量分别为约2重量％至约18重量％和约98重量％至约82重量％的银和铋的合金。考虑的合金进一步包含至多约1000ppmy的锌，镍，锗或其组合中的至少一种，并具有不低于约262.5℃的固相线和不高于约400℃的液相线考虑的合金可以进一步包含具有比合金的至少一种成分的氧亲和力更高的氧亲和力的化学元素，并且特别考虑的元素是磷和锗。

3. 发明申请

WO2005027198A2 DOPED ALLOYS FOR ELECTRICAL INTERCONNECTS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：用于电气互连的合金，生产方法及其用途
公开(公告)号：WO2005027198A2
公开(公告)日：2005-03-24
申请号：PCT/US2004028837
申请日：2004-09-07
申请人： HONEYWELL INT INC , DEAN NANCY , FLINT JAMES
发明人： DEAN NANCY , FLINT JAMES
IPC分类号： B23K35/24 , B23K35/26 , H01L20060101 , H01L21/78 , H01L23/48 , H01L23/485 , H01L23/52 , H01L29/40 , H01L
CPC分类号： H01L24/10 , B23K35/24 , B23K35/262 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/00014
摘要： Solder materials and dopants described herein comprise at least one solder material, at least one phosphorus-based dopant and at least one copper-based dopant. Methods of forming doped solder materials include: a) providing at least one solder material; b) providing at least one phosphorus-based dopant; c) providing at least one copper-based dopant, and d) blending the at least one solder material, the at least one phosphorus-based dopant and the at least one copper-based dopant to form a doped solder material. Layered materials are also described herein that comprise: a) a surface or substrate; b) an electrical interconnect; c) a solder material comprising at least one phosphorus-based dopant and at least one copper-based dopant, such as those described herein, and d) a semiconductor die or package. Electronic and semiconductor components that comprise solder materials and/or layered materials described herein are also contemplated.
摘要翻译：本文所述的焊料和掺杂剂包括至少一种焊料材料，至少一种磷基掺杂剂和至少一种铜基掺杂剂。形成掺杂焊料的方法包括：a）提供至少一种焊料; b）提供至少一种磷基掺杂剂; c）提供至少一种铜基掺杂剂，以及d）将所述至少一种焊料材料，所述至少一种磷基掺杂剂和所述至少一种铜基掺杂剂共混以形成掺杂的焊料材料。本文还描述了分层材料，其包括：a）表面或基底; b）电互连; c）包含至少一种磷基掺杂剂和至少一种铜基掺杂剂的焊料材料，例如本文所述的那些，以及d）半导体管芯或封装。包括本文所述的焊料材料和/或层状材料的电子和半导体部件也被考虑。

4. 发明申请

WO2004090938A3 THERMAL INTERCONNECT AND INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和接口系统，生产方法及其用途
公开(公告)号：WO2004090938A3
公开(公告)日：2005-11-03
申请号：PCT/US2004010094
申请日：2004-03-31
申请人： HONEYWELL INT INC , DEAN NANCY , TOWNSEND RICHARD , KNOLL PAULA , EDIE COLIN , NGUYEN MY , CURRAN DAN , RASIAH IGNATIUS JOSEPH
发明人： DEAN NANCY , TOWNSEND RICHARD , KNOLL PAULA , EDIE COLIN , NGUYEN MY , CURRAN DAN , RASIAH IGNATIUS JOSEPH
IPC分类号： H01L21/56 , H01L23/10 , H01L23/373 , H01L23/42 , H01L23/427 , H01B1/04 , H01L21/48
CPC分类号： H01L23/4275 , H01L21/563 , H01L23/10 , H01L23/3736 , H01L23/3737 , H01L23/42 , H01L23/427 , H01L2224/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/16152 , H01L2924/163 , H01L2924/3011 , H01L2924/00 , H01L2224/0401
摘要： Components and materials, including thermal transfer materials (320), contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material (325). The heat spreader component (310) comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component. Methods of forming a thermal solution/package and/or IC package includes: a) providing the thermal transfer material described herein; b) providing at least one adhesive component; c) providing at least one surface or substrate; d) coupling the at least one thermal transfer material and/or material with the at least one adhesive component to form an adhesive unit; e) coupling the adhesive unit to the at least one surface or substrate to form a thermal package; f) optionally coupling an additional layer or component to the thermal package.
摘要翻译：包括本文所涵盖的热转印材料（320）的组件和材料包括至少一个散热器部件，至少一个热界面材料，并且在一些预期的实施例中包括至少一个粘合剂材料（325）。散热器部件（310）包括顶表面，底表面和至少一个散热器材料。热界面材料直接沉积在散热器部件的底表面的至少一部分上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种热界面材料，其中所述热界面材料直接沉积到所述散热器部件的底表面上; 以及c）将所述至少一种热界面材料沉积到所述散热器部件的底表面上。形成热溶液/包装和/或IC封装的方法包括：a）提供本文所述的热转印材料; b）提供至少一种粘合剂组分; c）提供至少一个表面或基底; d）将所述至少一种热转印材料和/或材料与所述至少一种粘合剂组分结合以形成粘合剂单元; e）将所述粘合单元耦合到所述至少一个表面或基底以形成热封装; f）可选地将附加层或组件耦合到热封装。

5. 发明申请

WO2004109795A3 THERMAL INTERCONNECT SYSTEM AND METHOD OF PRODUCTION THEREOF 审中-公开
标题翻译：热互连系统及其生产方法
公开(公告)号：WO2004109795A3
公开(公告)日：2005-02-24
申请号：PCT/US2004017906
申请日：2004-06-04
申请人： HONEYWELL INT INC , DEAN NANCY , FERY MARK
发明人： DEAN NANCY , FERY MARK
IPC分类号： H01L23/42 , H01L23/373
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

6. 发明申请

WO2004008497B1 THERMAL INTERCONNECT AND INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
公开(公告)号：WO2004008497B1
公开(公告)日：2004-05-06
申请号：PCT/US0322710
申请日：2003-07-15
申请人： HONEYWELL INT INC , DEAN NANCY , KNOLL PAULA , TOWNSEND ROBERT , NGUYEN MY , EDIE COLIN , CURRAN DAN
发明人： DEAN NANCY , KNOLL PAULA , TOWNSEND ROBERT , NGUYEN MY , EDIE COLIN , CURRAN DAN
IPC分类号： H01L23/373 , B32B15/06 , B32B15/16 , B32B15/20 , B32B25/02 , B32B25/04 , B32B25/20 , B32B31/00 , H05K7/20
CPC分类号： H01L23/3735 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K7/20481 , Y10T428/31663 , Y10T428/31678 , H01L2924/00
摘要： Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component. A method for forming the thermal interface components disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the thermal interface component. A suitable interface material can also be produced that comprises at least one solder material. Additionally, a suitable interface material can be produced that comprises at least one solder material and at least one resin component.

7. 发明申请

WO2004008497A3 THERMAL INTERCONNECT AND INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
标题翻译：热互连和界面系统，生产方法及其用途
公开(公告)号：WO2004008497A3
公开(公告)日：2004-04-01
申请号：PCT/US0322710
申请日：2003-07-15
申请人： HONEYWELL INT INC , DEAN NANCY , KNOLL PAULA , TOWNSEND ROBERT , NGUYEN MY , EDIE COLIN , CURRAN DAN
发明人： DEAN NANCY , KNOLL PAULA , TOWNSEND ROBERT , NGUYEN MY , EDIE COLIN , CURRAN DAN
IPC分类号： H01L23/373 , B32B15/06 , B32B15/16 , B32B15/20 , B32B25/02 , B32B25/04 , B32B25/20 , B32B31/00 , H05K7/20
CPC分类号： H01L23/3735 , H01L23/3737 , H01L23/4275 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K7/20481 , Y10T428/31663 , Y10T428/31678 , H01L2924/00
摘要： Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component. A method for forming the thermal interface components disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the thermal interface component. A suitable interface material can also be produced that comprises at least one solder material. Additionally, a suitable interface material can be produced that comprises at least one solder material and at least one resin component.
摘要翻译：这里描述的分层热部件包括至少一个热界面部件和至少一个耦合到热界面部件的散热器部件。本文公开的形成分层热部件的方法包括：a）提供至少一个热界面部件; b）提供至少一个散热器部件; 以及c）物理耦合所述至少一个热接口部件和所述至少一个散热器部件。包括衬底层的至少一个附加层可以耦合到分层热部件。本文公开的用于形成热界面部件的方法包括a）提供至少一种饱和橡胶化合物，b）提供至少一种胺树脂，c）交联至少一种饱和橡胶化合物和至少一种胺树脂以形成交联的橡胶 - 树脂混合物，d）向交联的橡胶 - 树脂混合物中加入至少一种导热填料，和e）向交联的橡胶 - 树脂混合物中加入润湿剂。该方法还可以进一步包括将至少一种相变材料添加到热界面部件。也可以制造包括至少一种焊料材料的合适的界面材料。另外，可以制造包括至少一种焊料材料和至少一种树脂组分的合适的界面材料。

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