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1. 发明申请

WO2017034483A1 OPTICAL ASSEMBLIES INCLUDING A SPACER ADHERING DIRECTLY TO A SUBSTRATE 审中-公开
标题翻译：光学组件，包括直接连接到基板的间隔器
公开(公告)号：WO2017034483A1
公开(公告)日：2017-03-02
申请号：PCT/SG2016/050411
申请日：2016-08-25
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： YU, Qi Chuan , LEONG, Kam Wah , WANG, Ji
IPC分类号： H01L31/18 , H01L31/0232 , H01L27/146 , G02B6/43
CPC分类号： G02B6/43 , H01L27/14625
摘要： This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.
摘要翻译：本公开描述了可以例如使用晶片级工艺制造的光学组件。该方法可以包括提供包括光学晶片的晶片堆叠，以及将间隔件直接模制在光学晶片的表面上。间隔件可以例如使用真空注射技术来模制，使得它们粘附到光学晶片而没有粘合剂。

2. 发明申请

WO2015016776A2 OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开
标题翻译：具有屏蔽以减少漏光或散射光的光电子模块以及用于这种模块的制造方法
公开(公告)号：WO2015016776A2
公开(公告)日：2015-02-05
申请号：PCT/SG2014/000352
申请日：2014-07-25
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： RUDMANN, Hartmut , GUBSER, Simon , WESTENHOFER, Susanne , HEIMGARTNER, Stephan , GEIGER, Jens , YI, Xu , KIM, Thng Chong , VIDALLON, John A. , WANG, Ji , YU, Qi Chuan , LEONG, Kam Wah
IPC分类号： H01L27/00
CPC分类号： H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
摘要： Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
摘要翻译：光电子模块包括光电子器件和透明盖子。在透明盖的侧壁上提供不透明材料，这可以帮助减少来自透明盖的侧面的光泄漏，或者可以帮助减少杂散光进入模块。例如，可以在晶圆级工艺中制造模块。在一些实施方式中，诸如沟槽的开口形成在透明晶片中。然后可以使用例如真空注入工具将沟槽填充不透明材料。当随后将包括沟槽填充的透明晶片的晶片堆分离成单独的模块时，结果是每个模块可以包括具有由不透明材料覆盖的侧壁的透明盖。

3. 发明申请

WO2018147808A1 LIGHT GUIDES AND MANUFACTURE OF LIGHT GUIDES 审中-公开
公开(公告)号：WO2018147808A1
公开(公告)日：2018-08-16
申请号：PCT/SG2018/050059
申请日：2018-02-09
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： GUBSER, Simon , YU, Qichuan , LAW, Choon Hein , WANG, Ji
IPC分类号： G02B6/00 , G02B6/10
摘要： The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.

4. 发明申请

WO2015016775A1 OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开
标题翻译：具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法
公开(公告)号：WO2015016775A1
公开(公告)日：2015-02-05
申请号：PCT/SG2014/000351
申请日：2014-07-25
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： RUDMANN, Hartmut , GUBSER, Simon , WESTENHOFER, Susanne , HEIMGARTNER, Stephan , GEIGER, Jens , HANSELMANN, Sonja , FRIESE, Christoph , YI, Xu , KIM, Thng Chong , VIDALLON, John A. , WANG, Ji , YU, Qi Chuan , LEONG, Kam Wah
IPC分类号： H01L27/00 , H01L33/00
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
摘要： Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
摘要翻译：描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。还描述了制造模块的制造技术。

5. 发明申请

WO2018004460A1 OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME 审中-公开
标题翻译：光电子模块包括光电子器件子系统和制造同样的方法
公开(公告)号：WO2018004460A1
公开(公告)日：2018-01-04
申请号：PCT/SG2017/050319
申请日：2017-06-28
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： RUDMANN, Hartmut , YU, Qichuan , GUBSER, Simon , TESANOVIC, Bojan , YI, Xu , ONG, Eunice Ho , LIU, Hongyuan , WANG, Ji , LUA, Edmund Koon , PAING, Myo , TANG, Jian , LEE, Ming Jie
IPC分类号： H01L25/16 , H05K3/34 , H01L21/78 , H01L21/56 , G02B6/42
CPC分类号： H01L33/486 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/02325 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
摘要翻译：本公开描述了用于制造光电子器件子组件的晶片级工艺，所述光电子器件子组件例如可以安装到电路衬底（例如柔性电缆或印刷电路板）上，并集成到光电子模块中，包括堆叠在光电子器件子组件上的一个或多个光学子组件。即使光学子组件由不兼容回流的材料构成，也可以使用回流焊技术将光电子器件子组件安装到电路基板上。

6. 发明申请

WO2017146645A1 THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE 审中-公开
标题翻译：薄型光电子模块及其制造
公开(公告)号：WO2017146645A1
公开(公告)日：2017-08-31
申请号：PCT/SG2017/050078
申请日：2017-02-21
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： YU, Qichuan , RUDMANN, Hartmut , WANG, Ji , NG, Kian Siang , GUBSER, Simon , EILERTSEN, James , GNANA SAMBANDAM, Sundar Raman
IPC分类号： G01S7/481 , H01L31/00 , H01L51/44 , H01L23/28 , H01L33/52 , H01L25/16
CPC分类号： G01S7/481 , G01S17/02 , G01S17/026 , H01L25/16 , H01L31/00 , H01L33/54 , H01L33/58 , H01L51/44 , H01L2224/48091 , H01L2224/97 , H01L2924/1815 , H01L2933/005 , H01L2924/00014
摘要： The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
摘要翻译：晶圆级制造方法使得可以制造诸如光电模块的超薄光学装置。对包括有源光学元件和晶圆尺寸衬底的初始晶圆进行清晰的封装。其中，产生包括孔的可光结构化不透明涂层。然后，产生穿过透明封装并建立中间产品侧壁的沟槽。然后，将不透明封装施加到中间产品上，从而填充沟槽。通过切割存在于沟槽中的不透明封装材料，产生经分割的光学模块，其中中间产品的侧壁被不透明封装材料覆盖。在大多数工艺步骤中，晶圆尺寸的基板可以连接到刚性载体晶圆上。

7. 发明申请

WO2017176213A1 THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE 审中-公开
标题翻译：薄型光电子模块及其制造
公开(公告)号：WO2017176213A1
公开(公告)日：2017-10-12
申请号：PCT/SG2017/050194
申请日：2017-04-05
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： YU, Qichuan , RUDMANN, Hartmut , WANG, Ji , NG, Kian Siang , GUBSER, Simon , EILERTSEN, James , GNANA SAMBANDAM, Sundar Raman
IPC分类号： H01L21/56 , H01L23/31 , H01L27/14 , H01L21/76 , H01L21/673 , H01L25/00 , H01S5/02 , G03F7/00 , H01L33/50
CPC分类号： H01L31/0203 , H01L21/76 , H01L27/14 , H01L31/02162 , H01L31/02164 , H01L31/02327 , H01L31/16 , H01L31/1876 , H01L33/0095 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01S5/02228 , H01S5/02288 , H01L2924/00014 , H01L2924/00012
摘要： The wafer-level manufacturing method makes possible to manufacture ultrathin opticaldevices such as opto-electronic modules. A clear encapsulation is applied to an intialwafer including active optical components and a wafer-size substrate. Thereon, aphotostructurable spectral filter layer is produced which defines apertures. Then,trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to theintermediate products, thus filling the trenches and producing aperture stops. Cuttingthrough the opaque encapsulation material present in the trenches, singulated opticalmodules are produced, wherein side walls of the intermediate products are covered bythe opaque encapsulation material. The wafer-size substrate can be attached to a rigidcarrier wafer during most process steps.
摘要翻译：晶圆级制造方法使得可以制造诸如光电模块的超薄光学器件。对包括有源光学组件和晶圆尺寸衬底的初始晶圆进行清晰的封装。其上，产生一个定义孔的可结构光谱过滤层。然后，产生穿过透明封装并建立中间产品侧壁的沟槽。然后，将不透明封装应用于中间产品，从而填充沟槽并产生孔径光阑。切割存在于沟槽中的不透明封装材料，产生经分割的光学模块，其中中间产品的侧壁被不透明封装材料覆盖。在大多数工艺步骤中，晶圆尺寸的基板可以连接到刚性载体晶圆上。

8. 发明申请

WO2017086878A1 THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE 审中-公开
标题翻译：薄型光电子模块及其制造
公开(公告)号：WO2017086878A1
公开(公告)日：2017-05-26
申请号：PCT/SG2016/050564
申请日：2016-11-15
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： YU, Qichuan , RUDMANN, Hartmut , WANG, Ji , NG, Kian Siang , GUBSER, Simon , EILERTSEN, James , GNANA SAMBANDAM, Sundar Raman
IPC分类号： H01L23/29 , H01L21/56 , H01L21/58 , H01L21/782 , H01L21/82 , H01L23/31 , H01L31/0203 , H01L31/0216 , H01L31/0232 , H01L31/18 , H01L33/54 , H01L33/56
CPC分类号： H01L31/0203 , H01L31/0216 , H01L31/0232 , H01L31/18 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/1815 , H01L2933/005 , H01L2924/00012 , H01L2924/00014
摘要： The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.
摘要翻译：晶圆级制造方法使得可以制造诸如光电模块的超薄光学装置。对包括有源光学部件和晶片尺寸衬底的初始晶片施加透明封装，在其上产生包括孔的可光结构化不透明涂层。然后，产生穿过透明封装并建立中间产品侧壁的沟槽。然后，将不透明封装施加到中间产品上，从而填充沟槽。通过切割存在于沟槽中的不透明封装材料，产生单片化光学模块，其中中间产品的侧壁被不透明封装材料覆盖。

9. 发明申请

WO2017082820A1 OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开
标题翻译：光学元件组件
公开(公告)号：WO2017082820A1
公开(公告)日：2017-05-18
申请号：PCT/SG2016/050545
申请日：2016-11-04
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： WANG, Ji , LEONG, Kam Wah , TESANOVIC, Bojan , YU, Qichuan , SENN, Tobias , SPRING, Nicola , LENART, Robert
IPC分类号： G02B7/00 , B29C33/00 , B29C64/106 , G02B3/00 , G02B7/02 , G02B9/04 , G02B11/02
CPC分类号： G02B9/04 , B29C39/10 , B29C39/42 , B29K2995/0031 , B29L2011/00 , G02B7/021
摘要： Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬ structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.
摘要翻译：光学堆叠组件及其制造技术。光学堆叠组件包括第一和第二子组件，其中的每一个包括基底和固定到相应基底的子结构。每个子结构包括相应的第一边缘特征和从该子结构的基板突出的相应的第二边缘特征，每个第二边缘特征侧向地比第一边缘更靠近相应子结构的外周布置具有相同子结构的特征。第一子结构的第一边缘特征与第二子结构的第一边缘特征直接接触，结构，而第一子结构的第二边缘特征和第二子结构的第二边缘特征通过粘合剂彼此附接。第一或第二子结构中的至少一个包括在子结构的与该子结构的第一和第二边缘特征相同的一侧上的光学元件。光学元件叠层组件还包括侧向围绕第一和第二子组件的并且模制到第一和第二子组件的隔离件。

10. 发明申请

WO2017023211A1 OPTICAL MODULES INCLUDING CUSTOMIZABLE SPACERS FOR FOCAL LENGTH ADJUSTMENT AND/OR REDUCTION OF TILT, AND FABRICATION OF THE OPTICAL MODULES 审中-公开
标题翻译：光学模块，包括定制间距调整和/或减少倾斜，以及光学模块的制造
公开(公告)号：WO2017023211A1
公开(公告)日：2017-02-09
申请号：PCT/SG2016/050378
申请日：2016-08-04
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： YU, Qi Chuan , WANG, Ji , HWANG, Kyu Won , ALASIRNIÖ, Jukka
IPC分类号： G02B7/00 , G02B3/00 , G02B5/00 , G02B5/20 , G02B7/04 , G03B3/00 , G03B17/00 , G03B19/00 , H01L27/146 , H01L31/0232
CPC分类号： G02B7/025 , G03B3/02 , G03B5/06 , G03B2205/0092 , G03B2217/002 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2224/48091 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H01L2924/00014
摘要： An optical module comprising: a plurality of active optoelectronic components each one mounted on a respective printed circuit board (PCB), wherein each active optoelectronic component is associated with a respective different optical channel; a plurality of optical assemblies, each one is substantially aligned over a different respective optical channel; and a spacer separating the active optoelectronic components and PCBs from the optical assemblies, wherein the optical assemblies are attached by adhesive directly to an optical assembly-side surface of the spacer. A first active optoelectronic component is separated, by the spacer, from a first optical assembly by a first distance and a second active optoelectronic component is separated, by the spacer, from a second optical assembly by a different second distance. Also contemplated is a method for fabricating an optical module that comprises: modifying a height of one or more extensions on a spacer to adjust for at least one of a focal length or tilt of at least one optical channel.
摘要翻译：一种光学模块，包括：多个有源光电子部件，各自安装在相应的印刷电路板（PCB）上，其中每个有源光电子部件与相应的不同光学信道相关联; 多个光学组件，每个光学组件基本上在不同的相应光学通道上对准; 以及将活性光电子部件和PCB与光学组件分隔开的间隔件，其中光学组件通过粘合剂直接附接到间隔件的光学组件侧表面。第一有源光电子部件通过间隔件从第一光学组件分离第一距离，并且第二有源光电子部件通过间隔件从第二光学组件分离不同的第二距离。还设想了一种用于制造光学模块的方法，其包括：修改间隔物上的一个或多个延伸部分的高度，以调整至少一个光学通道的焦距或倾斜中的至少一个。

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