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1. 发明申请

WO2017069709A1 ELECTRICAL-CONTACT ASSEMBLIES 审中-公开
标题翻译：电接点组件
公开(公告)号：WO2017069709A1
公开(公告)日：2017-04-27
申请号：PCT/SG2016/050517
申请日：2016-10-24
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： TESANOVIC, Bojan , RIEL, Peter
IPC分类号： H05K3/40 , H05K3/46
CPC分类号： H05K3/425 , H05K3/0014 , H05K3/007 , H05K3/284 , H05K2201/09118 , H05K2201/09845 , H05K2201/10121 , H05K2203/0733 , H05K2203/1461 , H05K2203/1476
摘要： An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.
摘要翻译：电触头组件包括在组件的相对侧上具有第一和第二电接触表面的电触点。电触头组件通过可结构化工艺（例如，光致结构化工艺）和电镀来制造。第一和第二电接触表面可以以例如至少5微米的精度相对于彼此定位。此外，电触头组件的厚度在一些情况下可以至多17微米。电接触组件可以包括集成的有源光电元件，包覆模制件，光学元件和不透明的壁。

2. 发明申请

WO2015126328A1 OPTICAL MODULES INCLUDING CUSTOMIZABLE SPACERS FOR FOCAL LENGTH ADJUSTMENT AND/OR REDUCTION OF TILT, AND FABRICATION OF THE OPTICAL MODULES 审中-公开
标题翻译：光学模块，包括定制间距调整和/或减少倾斜，以及光学模块的制造
公开(公告)号：WO2015126328A1
公开(公告)日：2015-08-27
申请号：PCT/SG2015/000050
申请日：2015-02-18
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： RUDMANN, Hartmut , ALASIRNIÖX, Jukka , TESANOVIC, Bojan , SENN, Tobias , KUPUSAMY, Devanraj , BIETSCH, Alexander
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , H01L24/48 , H01L27/1462 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L2224/48091 , H01L2224/48225 , H01L2924/00014 , H01L2924/181 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.
摘要翻译：使用可定制的间隔物制造光学模块，以减少光学通道的焦距的变化，以减少光学通道倾斜的发生，和/或防止粘合剂迁移到图像传感器的有效部分。

3. 发明申请

WO2018004460A1 OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME 审中-公开
标题翻译：光电子模块包括光电子器件子系统和制造同样的方法
公开(公告)号：WO2018004460A1
公开(公告)日：2018-01-04
申请号：PCT/SG2017/050319
申请日：2017-06-28
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： RUDMANN, Hartmut , YU, Qichuan , GUBSER, Simon , TESANOVIC, Bojan , YI, Xu , ONG, Eunice Ho , LIU, Hongyuan , WANG, Ji , LUA, Edmund Koon , PAING, Myo , TANG, Jian , LEE, Ming Jie
IPC分类号： H01L25/16 , H05K3/34 , H01L21/78 , H01L21/56 , G02B6/42
CPC分类号： H01L33/486 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/02325 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
摘要： The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
摘要翻译：本公开描述了用于制造光电子器件子组件的晶片级工艺，所述光电子器件子组件例如可以安装到电路衬底（例如柔性电缆或印刷电路板）上，并集成到光电子模块中，包括堆叠在光电子器件子组件上的一个或多个光学子组件。即使光学子组件由不兼容回流的材料构成，也可以使用回流焊技术将光电子器件子组件安装到电路基板上。

4. 发明申请

WO2013010285A1 METHOD FOR MANUFACTURING PASSIVE OPTICAL COMPONENTS, AND DEVICES COMPRISING THE SAME 审中-公开
标题翻译：用于制造被动光学元件的方法，以及包括其的装置
公开(公告)号：WO2013010285A1
公开(公告)日：2013-01-24
申请号：PCT/CH2012/000160
申请日：2012-07-10
申请人： HEPTAGON MICRO OPTICS PTE. LTD. , RUDMANN, Hartmut , WESTENHOEFER, Susanne , TESANOVIC, Bojan
发明人： RUDMANN, Hartmut , WESTENHOEFER, Susanne , TESANOVIC, Bojan
IPC分类号： H01L27/146 , B29D11/00
CPC分类号： G02B3/0031 , B29D11/00307 , B29D11/00375 , B29D11/0074 , B29D11/00932 , B29K2063/00 , B29L2011/00 , G02B3/00 , G02B5/20 , G02B13/0085 , H01L25/167 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： The device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of said specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing at least approximately flat surfaces substantially perpendicular to a vertical direction in a distance at least approximately equal to a thickness of said at least one blocking portion (b) measured along said vertical direction, and, attached to said transparent element (6), at least one optical structure (5). The method for manufacturing a device comprising at least one passive optical component (L) comprises providing a wafer comprising at least one blocking portion (b) and a multitude of transparent elements (6).
摘要翻译：该装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个对于所述特定光谱范围的光，材料基本上不透明，被称为不透明材料。透明部分（t）包括至少一个无源光学部件（L）。所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有至少近似等于所述至少一个阻挡部分（b）的厚度的距离的两个相对的至少近似平坦的表面，所述至少近似平坦的表面基本上垂直于垂直方向），并且附接到所述透明元件（6）上的至少一个光学结构（5）。用于制造包括至少一个无源光学部件（L）的器件的方法包括提供包括至少一个阻挡部分（b）和多个透明元件（6）的晶片。

5. 发明申请

WO2017082820A1 OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开
标题翻译：光学元件组件
公开(公告)号：WO2017082820A1
公开(公告)日：2017-05-18
申请号：PCT/SG2016/050545
申请日：2016-11-04
申请人： HEPTAGON MICRO OPTICS PTE. LTD.
发明人： WANG, Ji , LEONG, Kam Wah , TESANOVIC, Bojan , YU, Qichuan , SENN, Tobias , SPRING, Nicola , LENART, Robert
IPC分类号： G02B7/00 , B29C33/00 , B29C64/106 , G02B3/00 , G02B7/02 , G02B9/04 , G02B11/02
CPC分类号： G02B9/04 , B29C39/10 , B29C39/42 , B29K2995/0031 , B29L2011/00 , G02B7/021
摘要： Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬ structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.
摘要翻译：光学堆叠组件及其制造技术。光学堆叠组件包括第一和第二子组件，其中的每一个包括基底和固定到相应基底的子结构。每个子结构包括相应的第一边缘特征和从该子结构的基板突出的相应的第二边缘特征，每个第二边缘特征侧向地比第一边缘更靠近相应子结构的外周布置具有相同子结构的特征。第一子结构的第一边缘特征与第二子结构的第一边缘特征直接接触，结构，而第一子结构的第二边缘特征和第二子结构的第二边缘特征通过粘合剂彼此附接。第一或第二子结构中的至少一个包括在子结构的与该子结构的第一和第二边缘特征相同的一侧上的光学元件。光学元件叠层组件还包括侧向围绕第一和第二子组件的并且模制到第一和第二子组件的隔离件。

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