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1. 发明申请

WO02084587B1 INTELLIGENT PORTABLE OBJECT WITH HIGH STORAGE CAPACITY AND LOCALLY CONTROLLED FLEXURE 审中-公开
标题翻译：具有高存储容量和本地控制灵活性的智能便携式对象
公开(公告)号：WO02084587B1
公开(公告)日：2003-03-27
申请号：PCT/FR0201249
申请日：2002-04-10
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE , AUDOUARD LAURENT
发明人： PATRICE PHILIPPE , AUDOUARD LAURENT
IPC分类号： G06K19/077
CPC分类号： G06K19/07732 , G06K19/077 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： The invention concerns an intelligent portable object of ISO 7816 format comprising a communication interface (25) and a laminate card body wherein is housed a chip (28). Said card comprises at least a data storage unit (29) co-operating with the chip (28), the storage unit (29) being physically separate from the chip (28) and housed in the card body at a site located at some distance from the main flexural lines of the card and in the neutral fibre of the card, and spacers providing proximate to the components including the chip (28) and the storage unit (29) local control of the bending of the card.
摘要翻译：本发明涉及一种ISO 7816格式的智能便携式物体，其包括通信接口（25）和容纳芯片（28）的层叠卡体。所述卡至少包括与芯片（28）配合的数据存储单元（29），所述存储单元（29）与所述芯片（28）物理分离并且容纳在所述卡体中位于距离从卡的主弯曲线和卡的中性纤维中提供的靠近包括芯片（28）和存储单元（29）的部件的间隔件对卡的弯曲进行局部控制。

2. 发明申请

WO2004054341A8 ADAPTER FOR ELECTRICALLY CONNECTING A MINIATURE INTEGRATED CIRCUIT CARD IN A MEMORY CARD CONNECTOR 审中-公开
标题翻译：用于将微型集成电路电气连接到存储卡连接器中的适配器
公开(公告)号：WO2004054341A8
公开(公告)日：2005-04-07
申请号：PCT/FR0303533
申请日：2003-12-01
申请人： GEMPLUS CARD INT , CALVAS BERNARD , CHOMETTE MICHEL , ELBAZ DIDIER , PATRICE PHILIPPE
发明人： CALVAS BERNARD , CHOMETTE MICHEL , ELBAZ DIDIER , PATRICE PHILIPPE
IPC分类号： G06K7/00 , H05K5/02
CPC分类号： G06K7/0021 , G06K19/07741
摘要： The invention concerns an adapter (10) for electrically connecting a integrated circuit mini-card (12) in a main electronic integrated circuit memory card connector with contact having greater space requirement than the mini-card (12), the mini-card (12) comprising surface contact strips (14) and said adapter (10) comprising a main body (22) capable of being connected to the main connector and a housing (32) for receiving the mini-card (12) emerging at the surface of the main body (22) and including inside bond pads (36) for connection to the electric contacts (14) of the mini-card (12). The invention is characterized in that it comprises a mobile cover (52) which is capable of taking up a position wherein it closes at least partly the housing (32) while maintaining the mini-card (12) in electrically connecting position in the housing (32) and stiffening the structure of the adapter (10).
摘要翻译：本发明涉及一种适配器（10），用于将主电子集成电路存储卡连接器中的集成电路微型卡（12）电连接到具有比微型卡（12），小型卡（12））包括表面接触条（14）和所述适配器（10），所述适配器（10）包括能够连接到所述主连接器的主体（22）和用于接收在所述主连接器的表面处出现的所述微型卡（12）的壳体（32）主体（22）并且包括用于连接到微型卡（12）的电触点（14）的内部接合焊盘（36）。本发明的特征在于它包括一个移动盖（52），该活动盖能够占据一个位置，其中至少部分地关闭壳体（32），同时保持小型卡（12）在壳体中的电连接位置 32）并加强适配器（10）的结构。

3. 发明申请

WO0247151A3 METHOD FOR MAKING A SEMICONDUCTOR CHIP USING AN INTEGRATED RIGIDITY LAYER 审中-公开
标题翻译：使用集成刚性层制造半导体芯片的方法
公开(公告)号：WO0247151A3
公开(公告)日：2003-02-13
申请号：PCT/FR0103846
申请日：2001-12-05
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE
发明人： PATRICE PHILIPPE
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498 , H01L21/68 , H01L21/31 , H01L21/78
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/3157 , H01L23/49855 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24105 , H01L2224/24225 , H01L2224/24226 , H01L2224/24992 , H01L2224/24998 , H01L2224/27013 , H01L2224/274 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01073 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/19042 , H01L2924/3512 , H01L2924/00
摘要： The invention concerns an electronic device (1) comprising the following steps: permanently fixing by calendering on the side of a wafer defining active surfaces, a rigid dielectric layer (8), thereby forming an assembly (8, 9) capable of being handled; forming perpendicular to the bond pad (6) at least a recess for access (11) to said pad (6); handling said rigid assembly by means of said dielectric layer (8); cutting out the rigid assembly jointly through the dielectric layer (8) and the wafer (9); then connecting after transferring the chip (2), the bond pad (6) to the contact pad (7) above at least part (17) of the dielectric layer.
摘要翻译：本发明涉及一种电子设备（1），包括以下步骤：通过压延永久固定在限定活性表面的晶片的侧面上，刚性介电层（8），从而形成能够被处理的组件（8,9）形成垂直于所述接合焊盘（6）的至少一个用于进入（11）到所述焊盘（6）的凹部; 通过所述介电层（8）处理所述刚性组件; 通过介电层（8）和晶片（9）共同切割刚性组件; 然后将芯片（2），接合焊盘（6）转移到电介质层的至少部分（17）上方的接触焊盘（7）之后连接。

4. 发明申请

WO0145040A3 DISPOSABLE SMART CARD 审中-公开
标题翻译：可疑智能卡
公开(公告)号：WO0145040A3
公开(公告)日：2001-11-08
申请号：PCT/FR0003513
申请日：2000-12-13
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE , TURIN JOEL , FIDALGO JEAN CHRISTOPHE
发明人： PATRICE PHILIPPE , TURIN JOEL , FIDALGO JEAN-CHRISTOPHE
IPC分类号： G06K19/077
CPC分类号： G06K19/07745 , G06K19/07743 , G06K19/07749 , H01L24/24 , H01L24/82 , H01L2224/24051 , H01L2224/24225 , H01L2224/24227 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/82007 , H01L2224/92244 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01087 , H01L2924/14 , H01L2924/15153 , H01L2924/15165
摘要： The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.
摘要翻译：本发明涉及一种集成电路芯片器件，其包括具有全局平面（15）的支撑件（14），其中露出空腔（16）的边缘（19），具有天线和/或接触垫的通信接口（13），其具有由所述平面，至少一个集成电路芯片（11）布置在所述空腔中，其有源表面向外并且通过互连元件（9）连接到所述接口，所述芯片具有设置有连接引脚（21）的有源表面（20）并由周边脊（24）限定。本发明的特征在于，所述芯片周边脊（24）与所述腔边缘（19）间隔开，并且每个互连元件由从芯片引脚（21）延伸到导电材料的导电材料的连续凸珠（9）支援飞机本发明还涉及制造所述装置的方法。

5. 发明申请

WO9966445A8 METHOD FOR PRODUCING AN INTEGRATED CIRCUIT CARD AND CARD PRODUCED ACCORDING TO SAID METHOD 审中-公开
标题翻译：用于生产集成电路卡的方法和根据该方法生产的卡
公开(公告)号：WO9966445A8
公开(公告)日：2000-02-10
申请号：PCT/FR9901268
申请日：1999-05-31
申请人： GEMPLUS CARD INT , FIDALGO JEAN CHRISTOPHE , ELBAZ DIDIER , ZAFRANY MICHAEL , PATRICE PHILIPPE
发明人： FIDALGO JEAN CHRISTOPHE , ELBAZ DIDIER , ZAFRANY MICHAEL , PATRICE PHILIPPE
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L23/31 , H01L23/498
CPC分类号： G06K19/07747 , G06K19/07743 , G06K19/07745 , H01L21/56 , H01L23/3121 , H01L23/3135 , H01L23/49855 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/16227 , H01L2224/24226 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.
摘要翻译：本发明涉及一种用于制造集成电路的方法，包括一个步骤，由此模块（12）被创建并固定在卡（20）的主体上并且设置有集成电路（14）和接触垫（16）。本发明的特征在于，其中产生模块（12）的步骤包括在由导电材料制成的板元件（26）中形成槽的阶段，由此所述槽至少部分地限定将形成接触垫的板元件（20）。本发明的特征还在于随后的步骤，其特征在于至少部分地用粘合剂（30）涂覆板状元件的下表面（32），以使模块（12）能够固定到卡片（20）的主体）。

6. 发明申请

WO0247151B1 METHOD FOR MAKING A SEMICONDUCTOR CHIP USING AN INTEGRATED RIGIDITY LAYER 审中-公开
标题翻译：使用集成刚性层制造半导体芯片的方法
公开(公告)号：WO0247151B1
公开(公告)日：2004-02-26
申请号：PCT/FR0103846
申请日：2001-12-05
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE
发明人： PATRICE PHILIPPE
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498 , H01L21/68 , H01L21/31 , H01L21/78
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/3157 , H01L23/49855 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24105 , H01L2224/24225 , H01L2224/24226 , H01L2224/24992 , H01L2224/24998 , H01L2224/27013 , H01L2224/274 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01073 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/19042 , H01L2924/3512 , H01L2924/00
摘要： The invention concerns an electronic device (1) comprising the following steps: permanently fixing by calendering on the side of a wafer defining active surfaces, a rigid dielectric layer (8), thereby forming an assembly (8, 9) capable of being handled; forming perpendicular to the bond pad (6) at least a recess for access (11) to said pad (6); handling said rigid assembly by means of said dielectric layer (8); cutting out the rigid assembly jointly through the dielectric layer (8) and the wafer (9); then connecting after transferring the chip (2), the bond pad (6) to the contact pad (7) above at least part (17) of the dielectric layer.
摘要翻译：本发明涉及一种电子设备（1），包括以下步骤：通过压延永久固定在限定活性表面的晶片的侧面上，刚性介电层（8），从而形成能够被处理的组件（8,9）形成垂直于所述接合焊盘（6）的至少一个用于进入（11）到所述焊盘（6）的凹部; 通过所述介电层（8）处理所述刚性组件; 通过介电层（8）和晶片（9）共同切割刚性组件; 然后将芯片（2），接合焊盘（6）转移到电介质层的至少部分（17）上方的接触焊盘（7）之后连接。

7. 发明申请

WO0247161A3 BARRIER AGAINST OVERFLOW FOR FIXING ADHESIVE OF A SEMICONDUCTOR CHIP 审中-公开
标题翻译：挡板用于固定半导体芯片的粘合剂
公开(公告)号：WO0247161A3
公开(公告)日：2003-04-24
申请号：PCT/FR0103834
申请日：2001-12-05
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE , FIDALGO JEAN-CHRISTOPHE , BRUNET OLIVIER , CUENOT YVES-PIERRE
发明人： PATRICE PHILIPPE , FIDALGO JEAN-CHRISTOPHE , BRUNET OLIVIER , CUENOT YVES-PIERRE
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/3157 , H01L23/49855 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24105 , H01L2224/24225 , H01L2224/24226 , H01L2224/24992 , H01L2224/24998 , H01L2224/27013 , H01L2224/274 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01073 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/19042 , H01L2924/3512 , H01L2924/00
摘要： The invention concerns electrical insulation of assembled chips (2), before being bonded into a single unit (9, 13). It comprises steps which consist in: applying a protective dielectric layer on at least an active surface (6) of a chip (3) of the wafer; placing then fixing on its substrate (8) the chip (3), by bonding its rear surface, a periphery of the protective layer (14) forming a barrier (15); and connecting after protecting, at least a contact pad (10) to the corresponding pad (7). The invention is useful for making portable smart objects, such as chip cards or labels.
摘要翻译：本发明涉及在组合的芯片（2）的电绝缘之前，其被结合成单个单元（9,13）。它包括以下步骤：在晶片的芯片（3）的至少活性表面（6）上施加保护介电层; 然后通过粘合其后表面将形成屏障（15）的保护层（14）的周边固定在其基板（8）上的芯片（3）上。并且在保护之后连接至少一个接触垫（10）到相应的垫（7）。本发明对于制造便携式智能对象如芯片卡或标签是有用的。

8. 发明申请

WO0145040B1 DISPOSABLE SMART CARD 审中-公开
标题翻译：可疑智能卡
公开(公告)号：WO0145040B1
公开(公告)日：2002-06-06
申请号：PCT/FR0003513
申请日：2000-12-13
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE , TURIN JOEL , FIDALGO JEAN CHRISTOPHE
发明人： PATRICE PHILIPPE , TURIN JOEL , FIDALGO JEAN-CHRISTOPHE
IPC分类号： G06K19/077
CPC分类号： G06K19/07745 , G06K19/07743 , G06K19/07749 , H01L24/24 , H01L24/82 , H01L2224/24051 , H01L2224/24225 , H01L2224/24227 , H01L2224/24998 , H01L2224/32225 , H01L2224/73267 , H01L2224/82007 , H01L2224/92244 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/01075 , H01L2924/01087 , H01L2924/14 , H01L2924/15153 , H01L2924/15165
摘要： The invention concerns an integrated circuit chip device comprising a support (14) having a global plane (15) wherein emerges an edge (19) of a cavity (16), a communication interface (13) with antenna and/or contact pads borne by said plane, at least an integrated circuit chip (11) arranged in said cavity with its active surface facing outwards and connected to said interface by interconnecting elements (9), said chip having an active surface (20) provided with connection pins (21) and delimited by a peripheral ridge (24). The invention is characterised in that said chip peripheral ridge (24) is spaced away from said cavity edge (19) and each interconnecting element consists of a continuous bead (9) of electrically conductive material extending from the chip pins (21) up to the support plane. The invention also concerns a method for making said device.
摘要翻译：本发明涉及一种集成电路芯片器件，其包括具有全局平面（15）的支撑件（14），其中露出空腔（16）的边缘（19），具有天线和/或接触垫的通信接口（13），其具有由所述平面，至少一个集成电路芯片（11）布置在所述空腔中，其有源表面向外并且通过互连元件（9）连接到所述接口，所述芯片具有设置有连接引脚（21）的有源表面（20）并由周边脊（24）限定。本发明的特征在于，所述芯片周边脊（24）与所述腔边缘（19）间隔开，并且每个互连元件由从芯片引脚（21）延伸到导电材料的导电材料的连续凸珠（9）支援飞机本发明还涉及制造所述装置的方法。

9. 发明申请

WO2008142245A2 CHIP CARD WITH A DUAL COMMUNICATION INTERFACE 审中-公开
标题翻译：具有双通道接口的芯片卡
公开(公告)号：WO2008142245A2
公开(公告)日：2008-11-27
申请号：PCT/FR2008000435
申请日：2008-03-28
申请人： SMART PACKAGING SOLUTIONS SPS , PATRICE PHILIPPE
发明人： PATRICE PHILIPPE
IPC分类号： G06K19/077 , B42D15/10 , B42D109/00 , G06K19/18
CPC分类号： G06K19/07749 , G06K19/072 , G06K19/07756 , G06K19/07769 , H01L2224/48091 , H01L2224/48111 , H01L2224/48228 , H01L2224/49109 , H01L2924/30107 , H01L2924/3025 , Y10T29/49016 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a chip card with a dual contact and contactless communication interface, including a microelectronic module (11) and a card body (22) provided with a cavity (23) which can receive the microelectronic module, said microelectronic module (11) being formed by a substrate (15), the first face thereof bearing a terminal block of electric contacts (4) and a second face thereof bearing a first microelectronic chip (9) electrically connected to the terminal block of electric contacts (4) and a second chip (10) electrically connected to the terminals of an antenna (13), the coils of which are disposed on the second face of the substrate of the electronic module. The invention is characterised in that the card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11).
摘要翻译：本发明涉及一种具有双接触和非接触通信接口的芯片卡，包括微电子模块（11）和具有可容纳微电子模块的空腔（23）的卡体（22），所述微电子模块（11）由基板（15）形成，其第一面具有电触点（4）的端子块和其第二面，其具有电连接到电触头（4）的端子块的第一微电子芯片（9）和电连接到天线（13）的端子的第二芯片（10），其线圈设置在电子模块的基板的第二面上。本发明的特征在于，卡体（22）包括用于集中和/或放大电磁波的装置（18），该装置可以将接收到的电磁流量特别是从非接触式芯片读卡器传送到天线的线圈（13）的微电子模块（11）。

10. 发明申请

WO2008015317A3 SECURE DOCUMENT, IN PARTICULAR ELECTRONIC PASSPORT WITH ENHANCED SECURITY 审中-公开
标题翻译：安全文件，特别是具有增强安全性的电子护照
公开(公告)号：WO2008015317A3
公开(公告)日：2008-03-20
申请号：PCT/FR2006001920
申请日：2006-08-03
申请人： SMART PACKAGING SOLUTIONS SPS , BRUNET OLIVIER , ARTIGUE OLIVIER , BOCCIA HENRI , PATRICE PHILIPPE , PEYTAVIN IVAN
发明人： BRUNET OLIVIER , ARTIGUE OLIVIER , BOCCIA HENRI , PATRICE PHILIPPE , PEYTAVIN IVAN
IPC分类号： G06K19/073 , G06K19/077 , B42D25/29 , G06K19/08
CPC分类号： G06K19/07749 , G06K7/10178
摘要： The invention relates to a secure document (13), in particular an electronic passport, comprising a support provided on the one hand with active security means (3) comprising a microcircuit linked to an antenna (5) capable of producing an electromagnetic response when it passes through the electromagnetic field of a contactless reader designed to interrogate the identity document (13). The identity document is characterized in that said support is provided on the other hand with passive security means (11, 15) chosen in such a way as to exhibit electrical characteristics, in particular inductive, capacitive and resistive (R, L, C) characteristics suitable for amplifying the electromagnetic response of the active security means (3) so as to take it beyond a threshold allowing the identification of the secure document (13), when the latter is placed in the electromagnetic field of a contactless reader. The invention finds its application in particular in national programmes for issuing passports with enhanced security.
摘要翻译：本发明涉及一种安全文件（13），特别是电子护照，其包括一个支撑件，该支撑件一方面具有主动安全装置（3），主动安全装置（3）包括连接到天线（5）的微电路，该微电路能够产生电磁响应通过旨在询问身份证件（13）的非接触式读取器的电磁场。身份证件的特征在于，所述支承件另一方面具有被动安全装置（11,15），其被选择为表现出电特性，特别是电感性，电容性和电阻性（R，L，C）特性适用于放大主动安全装置（3）的电磁响应，以使其超过允许识别安全文件（13）的阈值，当安全文件被放置在非接触式读取器的电磁场中时。本发明特别适用于国家发行加强安全护照的计划。

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