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1. 发明申请

WO0247161A3 BARRIER AGAINST OVERFLOW FOR FIXING ADHESIVE OF A SEMICONDUCTOR CHIP 审中-公开
标题翻译：挡板用于固定半导体芯片的粘合剂
公开(公告)号：WO0247161A3
公开(公告)日：2003-04-24
申请号：PCT/FR0103834
申请日：2001-12-05
申请人： GEMPLUS CARD INT , PATRICE PHILIPPE , FIDALGO JEAN-CHRISTOPHE , BRUNET OLIVIER , CUENOT YVES-PIERRE
发明人： PATRICE PHILIPPE , FIDALGO JEAN-CHRISTOPHE , BRUNET OLIVIER , CUENOT YVES-PIERRE
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/3157 , H01L23/49855 , H01L24/24 , H01L24/82 , H01L2224/24011 , H01L2224/24051 , H01L2224/24105 , H01L2224/24225 , H01L2224/24226 , H01L2224/24992 , H01L2224/24998 , H01L2224/27013 , H01L2224/274 , H01L2224/32225 , H01L2224/45144 , H01L2224/73267 , H01L2224/76155 , H01L2224/82007 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01073 , H01L2924/01079 , H01L2924/01087 , H01L2924/07802 , H01L2924/19042 , H01L2924/3512 , H01L2924/00
摘要： The invention concerns electrical insulation of assembled chips (2), before being bonded into a single unit (9, 13). It comprises steps which consist in: applying a protective dielectric layer on at least an active surface (6) of a chip (3) of the wafer; placing then fixing on its substrate (8) the chip (3), by bonding its rear surface, a periphery of the protective layer (14) forming a barrier (15); and connecting after protecting, at least a contact pad (10) to the corresponding pad (7). The invention is useful for making portable smart objects, such as chip cards or labels.
摘要翻译：本发明涉及在组合的芯片（2）的电绝缘之前，其被结合成单个单元（9,13）。它包括以下步骤：在晶片的芯片（3）的至少活性表面（6）上施加保护介电层; 然后通过粘合其后表面将形成屏障（15）的保护层（14）的周边固定在其基板（8）上的芯片（3）上。并且在保护之后连接至少一个接触垫（10）到相应的垫（7）。本发明对于制造便携式智能对象如芯片卡或标签是有用的。

2. 发明申请

WO2008015317A3 SECURE DOCUMENT, IN PARTICULAR ELECTRONIC PASSPORT WITH ENHANCED SECURITY 审中-公开
标题翻译：安全文件，特别是具有增强安全性的电子护照
公开(公告)号：WO2008015317A3
公开(公告)日：2008-03-20
申请号：PCT/FR2006001920
申请日：2006-08-03
申请人： SMART PACKAGING SOLUTIONS SPS , BRUNET OLIVIER , ARTIGUE OLIVIER , BOCCIA HENRI , PATRICE PHILIPPE , PEYTAVIN IVAN
发明人： BRUNET OLIVIER , ARTIGUE OLIVIER , BOCCIA HENRI , PATRICE PHILIPPE , PEYTAVIN IVAN
IPC分类号： G06K19/073 , G06K19/077 , B42D25/29 , G06K19/08
CPC分类号： G06K19/07749 , G06K7/10178
摘要： The invention relates to a secure document (13), in particular an electronic passport, comprising a support provided on the one hand with active security means (3) comprising a microcircuit linked to an antenna (5) capable of producing an electromagnetic response when it passes through the electromagnetic field of a contactless reader designed to interrogate the identity document (13). The identity document is characterized in that said support is provided on the other hand with passive security means (11, 15) chosen in such a way as to exhibit electrical characteristics, in particular inductive, capacitive and resistive (R, L, C) characteristics suitable for amplifying the electromagnetic response of the active security means (3) so as to take it beyond a threshold allowing the identification of the secure document (13), when the latter is placed in the electromagnetic field of a contactless reader. The invention finds its application in particular in national programmes for issuing passports with enhanced security.
摘要翻译：本发明涉及一种安全文件（13），特别是电子护照，其包括一个支撑件，该支撑件一方面具有主动安全装置（3），主动安全装置（3）包括连接到天线（5）的微电路，该微电路能够产生电磁响应通过旨在询问身份证件（13）的非接触式读取器的电磁场。身份证件的特征在于，所述支承件另一方面具有被动安全装置（11,15），其被选择为表现出电特性，特别是电感性，电容性和电阻性（R，L，C）特性适用于放大主动安全装置（3）的电磁响应，以使其超过允许识别安全文件（13）的阈值，当安全文件被放置在非接触式读取器的电磁场中时。本发明特别适用于国家发行加强安全护照的计划。

3. 发明申请

WO2007026077B1 DOUBLE INTERFACE COMMUNICATION ELECTRONIC MODULE, IN PARTICULAR FOR A CHIP CARD 审中-公开
标题翻译：双接口通信电子模块，特别是芯片卡
公开(公告)号：WO2007026077B1
公开(公告)日：2007-05-31
申请号：PCT/FR2006002012
申请日：2006-08-28
申请人： SMART PACKAGING SOLUTIONS SPS , ARTIGUE OLIVIER , BOCCIA HENRI , BRUNET OLIVIER
发明人： ARTIGUE OLIVIER , BOCCIA HENRI , BRUNET OLIVIER
IPC分类号： G06K19/077
CPC分类号： G06K19/07769 , G06K19/07743 , G06K19/07745 , G06K19/07749 , G06K19/07775 , G06K19/07779 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49109 , H01L2924/00011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/01015
摘要： The invention relates to a double interface communication electronic module (11), in particular for a chip card, comprising a substrate (27) provided with an electric contact terminal (17) which makes it possible to operationally contacting the reading device contacts, is provided with an antenna which has at least one spire (13) and whose terminals are connected to the terminals of an electronic chip positioned on the module (11) face. Said module is characterised in that the antenna spires (13) are arranged substantially outside the area covered with electric contacts (17) in such a way that said electric contacts of the terminal are unable to form an electromagnetic armour to signals receivable by the antenna. Said invention is particularly suitable for producing double interface communication contact and contactless chip cards.
摘要翻译：本发明涉及一种双接口通信电子模块（11），特别是用于芯片卡的双接口通信电子模块（11），其包括设有电触点端子（17）的基板（27），所述电触点端子使得可以在操作上接触读设备触点具有至少一个尖顶（13）并且其端子连接到位于模块（11）面上的电子芯片的端子的天线。所述模块的特征在于，天线尖顶（13）基本上布置在覆盖有电触点（17）的区域的外部，使得终端的所述电触点不能够形成对天线可接收的信号的电磁装甲。本发明特别适用于生产双接口通信接触和非接触芯片卡。

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