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1. 发明申请

WO1998019217A1 METHOD TO PREPARE THE PRODUCTION OF STRUCTURED METAL COATINGS USING PROTEINS 审中-公开
标题翻译：备PRODUCING结构的金属涂层的由蛋白的方式方法
公开(公告)号：WO1998019217A1
公开(公告)日：1998-05-07
申请号：PCT/DE1997002494
申请日：1997-10-27
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , FIEDLER, Stefan , OESTERHELT, Dieter , MEYER, Heinrich , SCHEEL, Wolfgang , REICHL, Herbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G03C05/58
CPC分类号： G03C5/58 , G03C1/731
摘要： The aim of the invention is to produce thin metal coatings and such structures on substrate supports of different structures. The lateral expansion of a metallic coating on each support can be predetermined with micrometer and submicrometer precision. The disclosed method enables flat and three-dimensional structures to be produced on smooth, planar or curved surfaces such as those required to reproduce letters or drawings. The method does not use any stamp printing techniques.
摘要翻译：本发明涉及生产薄金属层，并在衬底载体结构，例如differenter的结构。所讨论的基片上的金属层的横向范围可以在微米和亚微米范围的精度来设置。利用所描述的方法中，在平滑的平面或曲面平的和空间的金属结构的制造是可能的，根据需要，例如用于文字或附图中的成像。该工艺采用无印记技术。

2. 发明申请

WO1997000598A1 CONNECTION SUBSTRATE 审中-公开
标题翻译：连接衬底
公开(公告)号：WO1997000598A1
公开(公告)日：1997-01-03
申请号：PCT/CH1996000218
申请日：1996-06-06
申请人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN , BARTE, Hans-Jürg , LOSERT, Ewald , MEYER, Heinrich , RÖHRS, Günter , RUDOLF, Frank , SCHEEL, Wolfgang , SCHMIDT, Walter , ZUR NIEDEN, Theis
发明人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN
IPC分类号： H05K01/00
CPC分类号： H05K3/284 , H01L23/50 , H01L23/5385 , H01L25/065 , H01L25/162 , H01L2224/16225 , H05K1/0203 , H05K1/189 , H05K3/0058 , H05K2201/0209 , H05K2201/042 , H05K2201/046 , H05K2201/2009 , H05K2203/1316 , Y10S428/901 , Y10T29/49128 , Y10T29/49155
摘要： The proposed method of producing multifunctional multilayered connection substrates involves the following: the connection substrate is built up function by function from the various components, i.e. signal conducting substrate components (19), power supply substrate components (2), thermal substrate components (20), mechanical substrate components (7), and the arrangement of the components (4) and component-bearing substrate components as interdependent functions or modules, are designed and optimised separately before finally being assigned to spatially separated functional areas (inner/outer) of the circuit. The construction process involves connecting the modules to a circuit which forms the connection substrate. The substrate components with fine, compact, flexible and cool elements are assigned to the inner areas of the circuit, while those substrate components with coarse, rigid and warm elements and/or components are assigned to the outer areas of the circuit; a stiffening support material is applied in the outer area in such a way as to give the circuit a mechanical support structure which is designed to have rigid sections which merge into flexible sections. The circuit can be folded and/or wound according to the rigid and flexible sections. The mechanical support structure can be formed by separately manufactured device housing components or by the device housing.
摘要翻译：对于生产具有多种功能的多层互连衬底的方法，是使连接基板的功能的结构通过信号导电基底部件（19），stromversorgende基板份（2），热基底部件（20），机械基底部件（7），以及各部件的布置分开进行（4）或支撑基板份组分分开规划为相互依赖的功能或单独优化模块和最后空间上分开的功能区域（内部/外部）由模块在连接到所述互连衬底体现整体电路中发生分配给整个电路，该结构。基板的与细的，致密的，灵活的和冷却元件的片被分配给整个电路的内部区域，与粗，刚性和温暖的元件和/或与整个电路的外部区域相关联的部件，和一种硬化的载体材料的衬底部分是在外部区域可以被设计，使得电路被赋予机械载体结构，所述载体结构被局部地在越过，总电路根据折叠和/或缠绕在刚性和柔性部分的设计刚性和柔性的区域。机械支撑结构可以通过单独制造设备壳体部件或由装置壳体而形成。

3. 发明申请

WO1996024162A1 CHIP HOUSING AND PROCESS FOR PRODUCING IT 审中-公开
标题翻译： CHIPGEHÄUSUNG及其制造方法芯片GEHÄUSUNG
公开(公告)号：WO1996024162A1
公开(公告)日：1996-08-08
申请号：PCT/DE1996000058
申请日：1996-01-12
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , AZDASHT, Ghassem , ZAKEL, Elke , REICHL, Herbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L23/057
CPC分类号： H01L23/057 , B23K26/009 , B23K26/18 , H01L25/105 , H01L2224/50 , H01L2225/1005 , H01L2225/1023 , H01L2225/1076 , H01L2924/01079
摘要： A housing to accept at least one electronic component, e.g. a chip (1) or the like, and a process for producing such a housing with a cover (12) and a counter-cover (13) accepting the electronic component between them, in which there are conductive tracks (15, 16 or 24, 25) on the inner surfaces of the cover (12) and the counter-cover (13) in such a way that the tracks (15, 16) on the cover (12) connect terminal areas (21, 22) of the component (11) to the tracks (24, 25) on the counter-cover (13) and the tracks (24, 25) on the counter-cover (13) open into external terminals (32, 33) of the housing (10). The cover (12) and/or the counter-cover (13) has/have a flexible substrate layer (14) and are interconnected in the cover connecting regions (73) which surrounds the component (11).
摘要翻译：用于接收至少一个电子元件，诸如芯片（11）或类似物，以及用于Hersteellung这样Gehäusung过程有衬垫（12）和一个反覆盖层（13），其接收所述电子部件之间，其中所述顶片Gehäusung（12 ）和对置的覆盖层（提供这样的具有条带导体（15，16和24，25）的内表面上13）的顶片（12）焊盘的导体轨（15，16）（21，（22）的装置11的）至Gehäusung的柜台顶部层（13）（在外部端子32，33）的计数器顶部层（13）连接的导体轨（24，25），和导体轨道（24，25）（10）打开，其中所述顶片（12）和/ 或计数器顶片（13）包括柔性背衬层（14）和具有与周围的连接部分（73）连接在一起，覆盖层的成分（11）。

4. 发明申请

WO1996025263A3 PROCESS FOR BONDING A FLEXIBLE SUBSTRATE TO A CHIP 审中-公开
公开(公告)号：WO1996025263A3
公开(公告)日：1996-08-22
申请号：PCT/DE1996000228
申请日：1996-02-14
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , AZDASHT, Ghassem , ZAKEL, Elke , REICHL, Herbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： B23K01/005

5. 发明申请

WO1996027691A1 PALLADIUM-CONTAINING PRECURSOR MATERIAL AND PROCESS FOR PRODUCING METALLIC MICROSTRUCTURES ON DIELECTRIC SUBSTRATES WITH A PALLADIUM-CONTAINING PRECURSOR MATERIAL 审中-公开
标题翻译：钯含前驱和工艺制备金属微结构ON介质基板使用钯，含前驱
公开(公告)号：WO1996027691A1
公开(公告)日：1996-09-12
申请号：PCT/DE1996000433
申请日：1996-03-06
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TÖPPER, Michael , STOLLE, Thomas , KRABE, Detlef , CHMIEL, Gerhard , SCHAMMLER, Gisela , REICHL, Herbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： C23C18/30
CPC分类号： H05K3/185 , C23C18/30
摘要： A precursor material that contains a palladium compound in an organic solvent is useful to produce metallic microstructures on dielectric substrates by a full addition process. The solution used to form the various layers contains at least one additive that undergoes an irreversible photochemical reaction in its individual absorption range.
摘要翻译：本发明涉及一种通过全添加法包含在用于生产在介电基片的金属微结构的有机溶剂中的钯化合物的前体，其中，作为用于成膜溶液的至少一种另外的物质的存在，显示出他的自吸收区域的不可逆光化学反应。

6. 发明申请

WO1995027307A1 PROCESS AND DEVICE FOR PRODUCING SOLDER HUMPS 审中-公开
标题翻译：方法和制造装置中颠簸
公开(公告)号：WO1995027307A1
公开(公告)日：1995-10-12
申请号：PCT/DE1995000420
申请日：1995-03-28
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , KRABE, Detlef , REICHL, Herbert , WOLF, Jürgen
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： H01L21/60
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/0106 , H01L2924/01061 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H05K3/3436 , H05K3/3484 , H05K3/3494 , H05K2201/10734 , H05K2203/043 , H05K2203/107 , H01L2924/00 , H01L2924/00014
摘要： The invention describes a process for producing solder humps on one or more predetermined solderable or non-solderable regions of a surface, especially electrical connection surfaces, in which solder material for the humps to be made is applied in the immediate vicinity of the surface regions to be provided with solder humps, said solder material is melted by high-energy radiation in one or more spatially limited regions and the solder material melted at a spatially limited region and contracted into a solder bead wets a predetermined surface region, whereby a solder hump is formed, the shape of which is particularly suitable for making a soldered connection. The process of the invention can in particular be used in the same manner to provide non-solderable or difficultly solderable layers with a solderable coating on which the solder layer can be applied. According to the invention, preparing the solder material for a solder hump and melting it takes place in a single step, i.e. by melting the solder material in the laser beam and forming a solder bead. It is thus possible to make accurately shaped, extremely uniform solder humps rapidly and in selected locations. The selectivity of the process of the invention ensures that the temperature stress on neighbouring components or the substrates is comparatively very low.
摘要翻译：本发明描述了一种用于在表面上的一个或多个预定的，可焊接的或不可焊接区制作的焊料凸块的方法，特别是电连接面，所述用于在靠近所制造的焊锡凸块的焊料材料与焊料凸块接触是提供表面区域，并进一步用高能量的该焊料材料辐射在一个熔化或多个局部区域，并且还以局部区域上以及到焊料球收缩焊料润湿的预定表面区域，其中形成有焊料凸块，其形状特别适合用于制造焊接接头融合。具体地，以相同的方式本发明的方法可以用来提供硬或不可软焊层与在其上的焊料层随后施加可焊接的或容易焊接的层。在本发明中，钎焊材料的焊锡凸块与在单个工艺步骤中再熔融的提供进行，即通过在激光束的焊接材料的熔融和焊料球的形成。这允许定义很大程度上匀浆凸块形状的迅速也本地制造和选择性。因为本发明方法的选择性的相邻部件或基板的温度负荷比较非常低。

7. 发明申请

WO1996037330A1 PROCESS AND DEVICE FOR THE WAVE OR VAPOUR-PHASE SOLDERING OF ELECTRONIC UNITS 审中-公开
标题翻译： METHOD AND APPARATUS FOR波和/或电子部件汽相焊接
公开(公告)号：WO1996037330A1
公开(公告)日：1996-11-28
申请号：PCT/DE1996000968
申请日：1996-05-24
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , SCHEEL, Wolfgang , RING, Karl , HAFNER, Willi , LEICHT, Helmut
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： B23K01/015
CPC分类号： B23K1/015 , B23K2101/40 , H05K3/3415 , H05K3/3468 , H05K3/3494 , H05K2203/088
摘要： The invention describes a process and a device for wave and/or reflow soldering in the form of vapour-phase soldering for electronic units. In prior art processes and devices, either wave soldering or vapour-phase soldering alone can be performed in a single chamber. For electronic units which contain both components which are to be wave soldered and those to be reflow soldered, at least two soldering devices and two process steps are necessary. There is the further drawback that temperature-sensitive components impose either a limitation on the soldering temperature and hence the solders which can be used or laborious post-fitting. The invention performs wave soldering and vapour-phase soldering as a form of reflow soldering in a single chamber, in which an electronic unit can be placed and/or the portion of the volume of the chamber filled with the saturated vapour of a primary fluid can be controlled in such a way that, at the worst, temperature-sensitive components of the unit lie only partly in the saturated vapour and the connections of the electronic components of the unit are in the saturated vapour during soldering. The invention permits the soldering of surface-fitted, penetrating and temperature-sensitive components, e.g. large electrolytic capacitors, in a single chamber and in a single process stage and is therefore eminently suitable for economical mass production with high soldering quality.
摘要翻译：本发明描述的方法和在用于电子组件汽相焊接的形式波和/或回流焊接的装置。在在一个单一的室中仅波峰焊或仅气相焊接已知方法和装置或者是可行的。对于包含于波峰焊和回流焊接两个部件的电子组件，从而至少两个焊接设备，因此需要两个工艺步骤。还存在温度敏感设备或者需要在钎焊温度的限制，因此为所述可选择的焊接材料，或进行复杂的改造必要的缺点。本发明实现了波峰焊和汽相焊接作为在单一腔室回流焊接的形式中，电子组件可被放置成和/或填充有所述室的主液体体积分数的饱和蒸汽被如此调节使得组件中的温度敏感元件至多部分地位于饱和蒸汽，并且该连接被焊接模块的电子部件的软钎焊过程中位于饱和蒸汽。本发明允许安装面的焊接，通过配合和温度敏感的组分，例如大电解电容器，在一个单一的腔室，并在单一的工艺步骤，并且因此非常适合于廉价的大量生产具有非常好的焊接质量。

8. 发明申请

WO1999022252A1 DEVICE AND METHOD FOR PRODUCING IMAGES IN DIGITAL DENTAL RADIOGRAPHY 审中-公开
标题翻译： DEVICE AND METHOD FOR成像技术数字化口腔RADIOGRAPHY
公开(公告)号：WO1999022252A1
公开(公告)日：1999-05-06
申请号：PCT/EP1997005871
申请日：1997-10-23
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , SCHMITT, Peter , KOSTKA, Günther , SCHOLZ, Oliver , HANKE, Randolf , BAUER, Norbert
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G01T01/00
CPC分类号： H04N5/361 , H04N5/32 , H04N5/325 , H04N5/365
摘要： The inventive device for digital dental radiography has a source of X-radiation, a detector device, a correcting device and a temperature control device. Said detector device consists of a CCD array on which a scintillator layer is arranged and the radiation geometry of the detector device is constant in relation to the source of X-radiation. The correcting device corrects the electrical signals generated by the CCD array by compensating fluctuations in the electrical signals of the individual elements of the CCD array caused by a dark current of said array elements, by the array elements having different degrees of conversion efficiency and by the inhomogeneity of the scintillator layer. The temperature control device ensures that the detector device remains at a constant temperature during the detection of reference signals and image signals.
摘要翻译：一种用于数字射线照相术的牙科装置具有X射线源，一个传感器装置，校正装置和温度控制装置。所述传感器装置包括在其上施加的闪烁体层的CCD阵列，其中所述传感器装置包括相对于所述X射线源的恒定照射几何形状。校正装置，用于在CCD阵列的各个元件的电信号的变化，由于相同的暗电流补偿由于为了校正由CCD阵列产生的电信号不同的转换效率，以及它们的由于在闪烁体层的不均匀性。所述温度控制装置用于在恒定的温度的检测的参考信号和图像信号期间保持传感器设备。

9. 发明申请

WO1998037544A1 METHOD AND DEVICES FOR CODING DISCRETE SIGNALS OR FOR DECODING CODED DISCRETE SIGNALS 审中-公开
标题翻译：编码离散信号的方法和装置或 TO地解码编码离散信号
公开(公告)号：WO1998037544A1
公开(公告)日：1998-08-27
申请号：PCT/EP1997006633
申请日：1997-11-28
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , GRILL, Bernhard , EDLER, Bernd , BRANDENBURG, Karlheinz
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： G10L09/14
CPC分类号： G10L19/24 , G10L19/0204
摘要： The invention relates to a method for coding discrete time signals (x1) sampled at a first sampling rate. According to said method second time signals (x2) are generated using the first time signals, the band width of which corresponds to a second sampling rate which is lower than the first. The second time signals are coded in accordance with a first coding algorithm. The coded second time signals (x2c) are decoded again so as to obtain coded/decoded second time signals (x2cd), the band width of which corresponds to the second sampling rate. The first time signals are transformed by frequency range transformation into first spectral values (X1). From the coded/decoded second time signals second spectral values (X2cd) are generated, which are a representation of the coded/decoded second time signals in the frequency range. To obtain weighted spectral values the first spectral values are weighted with the second spectral values, whereby the first and second spectral values have the same frequency and time resolution. The weighted spectral values (Xb) are coded, taking into consideration a psychoacoustic model, in accordance with a second coding algorithm and entered into a bit stream.
摘要翻译：在用于编码的离散在第一抽样时间的信号采样的方法，（X1）产生使用所述第一时间信号，其带宽相应于第二采样率，其中，所述第二采样率小于所述第一取样率的第二时间信号（×2）。第二定时信号是根据第一编码算法进行编码。的经编码的第二信号（X2C）是为了获得编码再次解码/解码后的第二时间信号（X2CD），其带宽相应于第二采样频率。第一时间信号由频域变换到所述第一频谱值（X1）。第二频谱值（X2CD）从编码/解码的第二时间信号产生，所述第二频谱值是在频域中对编码/解码的第二时间信号的表示。为了获得光谱额定第一频谱值在第二频谱值，其中所述第一和所述第二频谱值具有相同的频率和时间分辨率来测量。加权频谱值（XB）根据第二编码算法考虑到心理声学模型的编码，并被写入到比特流中。

10. 发明申请

WO1998031982A1 METHOD FOR DISMANTLING TECHNICAL OBJECTS, AND THE APPROPRIATE TECHNICAL OBJECT FOR THE APPLICATION OF SAME 审中-公开
标题翻译：方法切割技术对象和目的训练有素的技术OBJECT
公开(公告)号：WO1998031982A1
公开(公告)日：1998-07-23
申请号：PCT/DE1997000134
申请日：1997-01-16
申请人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , KEICHER, Thomas , ELSNER, Peter , EYERER, Peter , LOCH, Stefan
发明人： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
IPC分类号： F42D03/00
CPC分类号： F42D3/00
摘要： The suggested method for dismantling technical objects by means of blasting agents for the purposes of depolluting and reallocating said objects is characterized in that hollow pipes are provided on said objects, along selected sectioning points of substantially linear shape, the critical diameter of which is lower than the diameter of the hollow pipe. The ignition of the blasting agent causes the object to break at the sectioning points. The technical objects can be fitted already during the production process with channels designed as pipes at given sectioning points of linear shape. Such channels can fulfil certain functions when the object is operating, and be used, once the design life is over, for the above-mentioned purposes.
摘要翻译：一种用于沿选定的，由爆炸物进行处置或其他用途这样的对象，其特征在于布置在所述对象上的方式分解技术物体的方法线状基本上分离点的中空管，这与可流动的炸药，其临界直径小于所述中空导管的直径要被填充并且对象在分离点炸药的点火后分解。技术对象可能已经被设置在它们的制造在含有线状通道，可以使用或操作期间执行特定功能的预定线形分离点的场合，以及其使用寿命的以上述方式结束之后被使用。

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