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    • 2. 发明申请
    • HIGH THICKNESS UNIFORMITY VAPORIZATION SOURCE
    • 高浓度均匀蒸发源
    • WO2005098079A1
    • 2005-10-20
    • PCT/US2005/008252
    • 2005-03-11
    • EASTMAN KODAK COMPANYLONG, MichaelGRACE, Jeremy, MatthewKOPPE, Bruce, EdwardFREEMAN, Dennis, RayREDDEN, Neil, PeterZWAAP, Robert, Ferdinand
    • LONG, MichaelGRACE, Jeremy, MatthewKOPPE, Bruce, EdwardFREEMAN, Dennis, RayREDDEN, Neil, PeterZWAAP, Robert, Ferdinand
    • C23C14/24
    • C23C14/24C23C14/12C23C14/243C23C14/26
    • A vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifold(60) including side and bo ttom walls defining a chamber for receiving organic material, and an aperture pl ate(40) disposed between the side walls, the aperture plate having a plurality of spaced apart apertures(90) for emitting vaporized organic material; the apertu re plate including conductive material which in response to an electrical current produces heat; means for heating the organic material to a temperature which c auses its vaporization, and heating the side walls of the manifold; and an elect rical insulator(120) coupling the aperture plate to the side walls for concentra ting heat in the unsupported region of the aperture plate adjacent to the apertu res, whereby the distance between the aperture plate and the substrate can be re duced to provide high coatA vapor deposition source for use in vacuum chamber for coating an organic layer on a substrate of an OLED device, includes a manifoldincluding side and bottom walls defining a chamber for receiving organic materi al, and an aperture plate disposed between the side walls, the aperture plate ving a plurality of spaced apart apertures for emitting vaporized organic materi al; the aperture plate including conductive material which in response to an ele ctrical current produces heat; means for heating the organic material to a tempe rature which causes its vaporization, and heating the side walls of the manifold and an electrical insulator coupling the aperture plate to the side walls for concentrating heat in the unsupported region of the aperture plate adjacent to t he apertures, whereby the distance between the aperture plate and the substrate can be reduced to provide high coating thickness uniformity on the substrate.
    • 一种用于在OLED器件的衬底上涂覆有机层的真空室中的气相沉积源,包括歧管(60),其包括限定用于接收有机材料的室的侧壁和底壁,以及孔(40) 设置在所述侧壁之间,所述孔板具有用于发射蒸发的有机材料的多个间隔开的孔(90) 包括响应于电流的导电材料的印模板产生热量; 用于将有机材料加热到使其蒸发的温度并加热歧管的侧壁的装置; 以及将孔板连接到侧壁上的电绝缘体(120),用于在孔板的邻近孔径区域的未支撑区域内集中热量,由此可以减小孔板和衬底之间的距离以提供 高涂层用于在OLED器件的衬底上涂覆有机层的真空室中的气相沉积源包括限定用于接收有机物的室的侧面和底壁以及设置在侧壁之间的孔板, 孔板,其具有多个间隔开的孔,用于发射蒸发的有机物质; 包括响应于电流电流的导电材料的孔板产生热量; 用于将有机材料加热到导致其蒸发的温度的装置,以及加热歧管的侧壁和将孔板耦合到侧壁的电绝缘体,用于将热量集中在邻近的孔板的未支撑区域 孔,从而可以减小孔板和基底之间的距离,以在基底上提供高的涂层厚度均匀性。
    • 7. 发明申请
    • TWO-DIMENSIONAL APERTURE ARRAY FOR VAPOR DEPOSITION
    • 用于蒸气沉积的二维孔径阵列
    • WO2007084275A1
    • 2007-07-26
    • PCT/US2007/000425
    • 2007-01-05
    • EASTMAN KODAK COMPANYGRACE, Jeremy MathewLONG, Michael
    • GRACE, Jeremy MathewLONG, Michael
    • C23C16/455C23C14/04
    • C23C16/45565C23C14/044
    • A method for forming a layer on a surface in making a device, including providing a distribution member for receiving vaporized material, the distribution member having one or more walls defining a polygonal two-dimensional pattern of apertures is formed in a wall, which deliver vaporized material in a molecular flow onto the surface; providing the polygonal two-dimensional pattern of apertures to have at least four vertices, with a first set of apertures (80) disposed at the vertices, a second set of edge apertures (78) disposed between the apertures of the first set and defining the edges of the polygonal two-dimensional pattern, and a third set of interior apertures (74) disposed within the periphery of the polygonal two-dimensional pattern defined by the first and second sets of apertures; and dimensioning the apertures to obtain a desired flow rate.
    • 一种用于在制造装置中在表面上形成层的方法,包括提供用于接收气化材料的分配构件,所述分配构件具有限定孔的多边形二维图案的一个或多个壁,壁中将蒸发的 表面分子流中的物质; 提供孔的多边形二维图案以具有至少四个顶点,其中设置在顶点处的第一组孔(80),设置在第一组的孔之间的第二组边缘孔(78) 多边形二维图案的边缘和设置在由第一组和第二组孔限定的多边形二维图案的周边内的第三组内孔(74); 并确定孔径以获得所需的流速。