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1. 发明申请

WO2004007628A1 SILICONE-BASED ADHESIVE SHEET, METHOD OF BONDING A SEMICONDUCTOR CHIP TO A CHIP ATTACHMENT COMPONENT, AND A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：基于硅胶的粘合片，将半导体芯片连接到芯片连接部件的方法和半导体器件
公开(公告)号：WO2004007628A1
公开(公告)日：2004-01-22
申请号：PCT/JP2003/008936
申请日：2003-07-14
申请人： DOW CORNING TORAY SILICONE CO., LTD. , SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
发明人： SUTOH, Manabu , USHIO, Yoshito , FUJISAWA, Toyohiko , MINE, Katsutoshi
IPC分类号： C09J7/02
CPC分类号： H01L21/6836 , C08L83/00 , C09J5/06 , C09J7/35 , C09J183/04 , C09J2201/128 , C09J2203/326 , C09J2483/00 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/85207 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01043 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01052 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20753
摘要： A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding a semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.
摘要翻译：硅酮类粘合片在一侧具有一层粘土状可固化硅酮组合物，另一侧具有比另一侧的第一组合物层更慢的固化粘土状可固化硅氧烷组合物层，或者一侧的固化的硅氧烷层和另一侧的粘土状可固化硅氧烷组合物层。硅酮类粘合片可以用于将半导体芯片和芯片安装部件接合的方法。可以通过该方法制备半导体器件。

2. 发明申请

WO2005062374A1 DICING/DIE BONDING FILM AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：定影/贴合胶片及其制造方法
公开(公告)号：WO2005062374A1
公开(公告)日：2005-07-07
申请号：PCT/JP2004/018531
申请日：2004-12-07
申请人： DOW CORNING TORAY SILICONE CO., LTD. , SUTOH, Manabu , USHIO, Yoshito
发明人： SUTOH, Manabu , USHIO, Yoshito
IPC分类号： H01L21/68
CPC分类号： H01L21/6835 , C09J2203/326 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/68331 , H01L2224/274 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/1471 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2924/00012
摘要： A dicing/die bonding sheet is made by joining a base film (1) and a silicone based adhesive agent layer (3) through the medium of an undercoat layer (2). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing.
摘要翻译：通过底涂层（2）的介质将基膜（1）和硅酮类粘合剂层（3）接合而制成切割/芯片接合片。这种一体式切割/芯片粘合片表现出优异的长期储存稳定性并防止切割期间的芯片分层。

3. 发明申请

WO2003031528A1 ADHESIVE SHEET OF CROSS-LINKED SILICONE, METHOD OF MANUFACTURING THEREOF, AND DEVICE_COMPRISING THE SHEET 审中-公开
标题翻译：交联硅胶的粘合片，其制造方法和装置 - 组合片
公开(公告)号：WO2003031528A1
公开(公告)日：2003-04-17
申请号：PCT/JP2002/010200
申请日：2002-09-30
申请人： DOW CORNING TORAY SILICONE CO., LTD. , USHIO, Yoshito , NAKAYAMA, Katsuyuki , FUJISAWA, Toyohiko
发明人： USHIO, Yoshito , NAKAYAMA, Katsuyuki , FUJISAWA, Toyohiko
IPC分类号： C09J7/00
CPC分类号： H01L24/83 , C09J7/10 , C09J7/40 , C09J183/04 , C09J2483/00 , H01L23/3121 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01059 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01092 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/1301 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10T428/31663 , H01L2924/00014 , H01L2924/0715 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012
摘要： A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 μm or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 μm or less between two protective films of different materials and then cross-linking the composition.
摘要翻译：交联的硅氧烷粘合片在从片材的两侧剥离保护膜时具有剥离表面的稳定性。交联硅树脂的粘合片在片材的两侧具有保护膜。保护膜的厚度为100μm以下。保护膜从片材剥离的力等于或低于5.0N / m。膜的剥离力之差等于或超过0.2N / m。制造交联硅氧烷粘合片的方法包括以下步骤：通过将可交联的硅氧烷组合物放置在不同材料的两个保护膜之间的厚度为100μm以下的层中，形成膜状体，以及然后交联组合物。

4. 发明申请

WO2003046098A1 ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE FILM, METHOD FOR THE PRODUCTION THEREOF, AND SEMICONDUCTOR DEVICES 审中-公开
标题翻译：各向异性电磁粘合膜，其生产方法和半导体器件
公开(公告)号：WO2003046098A1
公开(公告)日：2003-06-05
申请号：PCT/JP2002/012212
申请日：2002-11-21
申请人： DOW CORNING TORAY SILICONE CO., LTD. , KOBAYASHI, Akihiko , NAKAYOSHI, Kazumi , SHIMA, Ryoto , USHIO, Yoshito , MINE, Katsutoshi
发明人： KOBAYASHI, Akihiko , NAKAYOSHI, Kazumi , SHIMA, Ryoto , USHIO, Yoshito , MINE, Katsutoshi
IPC分类号： C09J9/02
CPC分类号： H01L24/83 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2483/00 , H01L21/486 , H01L23/49827 , H01L24/29 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01058 , H01L2924/01061 , H01L2924/0107 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/12042 , H01L2924/351 , H05K3/321 , H05K2201/0133 , H05K2201/0314 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599
摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150 degrees Celsius that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device is characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.
摘要翻译：各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量在150摄氏度时不大于100MPa。制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体填充通孔。半导体器件的特征在于通过前述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

5. 发明申请

WO2006104236A1 HOT-MELT SILICONE ADHESIVE 审中-公开
标题翻译：热熔硅胶
公开(公告)号：WO2006104236A1
公开(公告)日：2006-10-05
申请号：PCT/JP2006/306996
申请日：2006-03-27
申请人： DOW CORNING TORAY CO., LTD. , FUJISAWA, Toyohiko , USHIO, Yoshito , SUTOH, Manabu , TANIGUCHI, Yoshinori , NAKANISHI, Koji
发明人： FUJISAWA, Toyohiko , USHIO, Yoshito , SUTOH, Manabu , TANIGUCHI, Yoshinori , NAKANISHI, Koji
IPC分类号： C08L83/04 , C09J183/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/70 , C08G2170/20 , Y10T428/1476 , C08L83/00
摘要： A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250°C; (B) an organopolysiloxane that at 25°C is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.
摘要翻译：一种热熔性硅氧烷粘合剂，其包含：（A）软化点在40至250℃范围内的有机聚硅氧烷树脂; （B）在25℃下为液体或呈粗橡胶状态的有机聚硅氧烷，其在一分子中含有至少两个烯基; （C）选自（i）含硅键合的氢原子的有机聚硅氧烷和（ii）含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或（iii）含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; （D）氢化硅烷化催化剂; 和（E）氢化硅烷化反应抑制剂，即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好间隙填充能力，并且在交联后对被粘物提供强粘合性。

6. 发明申请

WO2007026727A1 INSULATING LIQUID DIE-BONDING AGENT AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：绝缘液体粘合剂和半导体器件
公开(公告)号：WO2007026727A1
公开(公告)日：2007-03-08
申请号：PCT/JP2006/317033
申请日：2006-08-23
申请人： DOW CORNING TORAY CO., LTD. , FUJISAWA, Toyohiko , USHIO, Yoshito
发明人： FUJISAWA, Toyohiko , USHIO, Yoshito
IPC分类号： C08L83/04 , C09J183/04 , H01L21/58 , H01L23/373
CPC分类号： H01L23/3114 , C08G77/12 , C08G77/18 , C08G77/20 , C08L83/00 , C08L83/04 , C09J183/04 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/0715 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 µm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.
摘要翻译：一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂，所述试剂包括：（A）（a-1）具有烯基的有机聚硅氧烷树脂和（a- 2）在一个分子中具有至少两个烯基的直链有机聚硅氧烷; （B）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; （D）平均直径为0.1〜50μm且根据JIS K 6253的A型硬度计硬度等于或小于80的绝缘球形硅橡胶颗粒; 和（E）氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面，非常适合于丝网印刷，耐半导体芯片和芯片结合剂之间的界面上形成空隙，以及不会失去其引线接合性能。

7. 发明申请

WO2005021652A1 ADHESIVE SILICONE ELASTOMER SHEET 审中-公开
标题翻译：胶粘剂有机硅弹性体片材
公开(公告)号：WO2005021652A1
公开(公告)日：2005-03-10
申请号：PCT/JP2004/012801
申请日：2004-08-27
申请人： DOW CORNING TORAY CO., LTD. , TAKANAMI, Akiko , USHIO, Yoshito , MITANI, Osamu , ONISHI, Masayuki
发明人： TAKANAMI, Akiko , USHIO, Yoshito , MITANI, Osamu , ONISHI, Masayuki
IPC分类号： C08L83/04
CPC分类号： B32B25/20 , B32B25/08 , B32B2319/00 , B32B2405/00 , B32B2457/202 , C08G77/12 , C08G77/20 , C08G2170/40 , C08L83/00 , C09J7/10 , C09J7/38 , C09J183/04 , C09J2483/00 , G02F2202/28 , Y10T428/31663 , Y10T428/31786
摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R 1 3 SiO 1/2 ) x (SiO 4/2 ) 1.0 in which R 1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.
摘要翻译：通过固化氢化硅烷化固化有机硅弹性体组合物得到的粘合有机硅弹性体片材，其包含：（A）含有至少一个二有机硅氧烷单元并且在其中具有至少两个与硅键合的烯基的有机聚硅氧烷每个分子，（B）具有平均单元式：（R 1 1 SiO 1/2）1/2的有机聚硅氧烷树脂，（SiO 4/2）1/2其中R 1为取代或未取代的一价烃基，x为0.5至0.5的数字。 1.0，（C）在每个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷，和（D）氢化硅烷化催化剂。粘性硅橡胶片是透明的，其表面表现出稳定和永久的粘合性。

8. 发明申请

WO2012105669A1 METHOD FOR MANUFACTURING A CARBON SURFACE-COATED SILICON-CONTAINING CARBON-BASED COMPOSITE MATERIAL 审中-公开
标题翻译：含碳表面活性炭基复合材料的制备方法
公开(公告)号：WO2012105669A1
公开(公告)日：2012-08-09
申请号：PCT/JP2012/052440
申请日：2012-01-27
申请人： DOW CORNING TORAY CO., LTD. , HARIMOTO, Yukinari , AKASAKA, Masayasu , FUKUI, Hiroshi , EGUCHI, Katsuya , USHIO, Yoshito , PHAN, Son Thanh
发明人： HARIMOTO, Yukinari , AKASAKA, Masayasu , FUKUI, Hiroshi , EGUCHI, Katsuya , USHIO, Yoshito , PHAN, Son Thanh
IPC分类号： H01M4/133 , H01M4/587 , H01M4/38 , H01M4/134
CPC分类号： H01M4/587 , B82Y30/00 , C04B35/62839 , C04B35/62892 , C04B35/62897 , C04B2235/3826 , C04B2235/3895 , C04B2235/424 , C04B2235/483 , C04B2235/528 , C04B2235/5436 , C04B2235/5454 , C04B2235/5481 , C07F7/0849 , C07F7/1868 , H01M4/133 , H01M4/134 , H01M4/366 , H01M4/386 , H01M10/052
摘要： To provide a composite material suitable for use as an electrode of an electricity storage device, particularly for a lithium or lithium-ion secondary battery, an electrode active material constituted by the composite material, an electrode containing the active material, and an electricity storage device including the electrode. Using a carbon surface-coated silicon-containing carbon-based composite material as an electrode active material, the composite material obtained by: forming a cured product by crosslinking (A) a crosslinkable group-containing organic compound, and (B) a silicon-containing compound capable of crosslinking the crosslinkable group-containing organic compound; and baking a mixture of the cured product and (C) a carbonaceous matter.
摘要翻译：为了提供适合用作蓄电装置的电极，特别是锂或锂离子二次电池的复合材料，由复合材料构成的电极活性材料，含有活性物质的电极和蓄电装置包括电极。使用碳表面涂覆的含硅碳基复合材料作为电极活性材料，所述复合材料通过以下方法获得：通过交联（A）含交联性基团的有机化合物形成固化产物，和（B）能够交联含交联性基团的有机化合物的含氟化合物; 并烘烤固化产物的混合物和（C）碳质物质。

9. 发明申请

WO2009054279A1 ROOM-TEMPERATURE CURABLE ORGANOPOLYSILOXANE COMPOSITION 审中-公开
标题翻译：室温可固化有机硅氧烷组合物
公开(公告)号：WO2009054279A1
公开(公告)日：2009-04-30
申请号：PCT/JP2008/068517
申请日：2008-10-06
申请人： DOW CORNING TORAY CO., LTD. , NABETA, Akiko , ONISHI, Masayuki , USHIO, Yoshito
发明人： NABETA, Akiko , ONISHI, Masayuki , USHIO, Yoshito
IPC分类号： C09D183/06
CPC分类号： C08L83/04 , C08G77/18 , C08K5/0091 , C08K5/5419 , C08L2666/52 , C08L2666/44
摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPa⋅s at 25 °C; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
摘要翻译：一种室温可固化的有机聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下的粘度为100至1,000,000mPa·s; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性上述基材。

10. 发明申请

WO2006135036A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION 审中-公开
标题翻译：可固化的有机硅氧烷组合物
公开(公告)号：WO2006135036A1
公开(公告)日：2006-12-21
申请号：PCT/JP2006/312088
申请日：2006-06-09
申请人： DOW CORNING TORAY CO., LTD. , USHIO, Yoshito , MITANI, Osamu
发明人： USHIO, Yoshito , MITANI, Osamu
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08L83/14 , C08L2666/14 , C08L83/00
摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100°C.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1）或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

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