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    • 3. 发明申请
    • AN ELECTROMECHANICAL SWITCH AND METHOD OF FABRICATION
    • 机电开关及制造方法
    • WO2003015128A2
    • 2003-02-20
    • PCT/US2002/024927
    • 2002-08-07
    • CORPORATION FOR NATIONAL RESEARCH INITIATIVES
    • PEDERSEN, MichaelOZGUR, Mehmet
    • H01L
    • H01H59/0009H01G5/18H01G5/40H01H2059/0018H01H2059/0072
    • A micro-electro-mechanical (MEM) switch formed on a substrate allows switching of various types of electrical conductor structures, depending on the desired frequency range of switch transmission and isolation. The switch contains a tilting cantilever arm, which tilts around central points of attachment. At least two conducting electrodes on the cantilever arm and the substrate form at least two air gap capacitors, which when electrically charged provide electrostatic attraction forces that cause the cantilever arm to deflect and tilt until conducting electrodes near the tips of the cantilever arm make electrical contact with fixed electrodes on the underlying substrate. The air gap capacitors on either side of the cantilever points of attachment allow the switch to be driven into both ON and OFF states, thereby eliminating dependence on cantilever mechanical restoring forces One or more holes in the cantilever arm near the air gap capacitors allow air within the gap to escape, thereby reducing the squeeze film damping and increasing the mechanical bandwidth of the switch. Low-temperature, IC compatible processing allows the switch structure to be fabricated directly on substrates containing pre-processed circuits, such as monolithic microwave integrated circuits (MMICs), and on low-cost substrates, such as low temperature co-fired ceramic (LTCC), for the realization of low-cost vertical integration of complex switching circuits, such as RF phase shifter networks.
    • 形成在基板上的微机电(MEM)开关允许根据所需的开关传输和隔离的频率范围来切换各种类型的电导体结构。 开关包含一个倾斜的悬臂,它围绕中心点倾斜。 悬臂和基板上的至少两个导电电极形成至少两个气隙电容器,当电荷充电时,静电吸引力使悬臂臂偏转和倾斜,直到靠近悬臂臂顶端的电极进行电接触 在底层基板上固定电极。 悬臂连接点两侧的气隙电容允许开关被驱动到ON和OFF状态,从而消除对悬臂机械恢复力的依赖性气隙电容器附近的悬臂中的一个或多个孔允许空气内的空气 间隙逃脱,从而减少挤压膜阻尼并增加开关的机械带宽。 低温,IC兼容处理允许开关结构直接在包含预处理电路的基板上制造,例如单片微波集成电路(MMIC),以及低成本基板,如低温共烧陶瓷(LTCC) ),用于实现复杂开关电路(如RF移相器网络)的低成本垂直整合。