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1. 发明申请

WO2009114102A2 DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR 审中-公开
标题翻译：通过安装在门上的换热器将设备机架上的热量去除的装置和方法
公开(公告)号：WO2009114102A2
公开(公告)日：2009-09-17
申请号：PCT/US2009001423
申请日：2009-03-03
申请人： COOLIGY INC , CORREA ADRIAN , LIN TIEN CHIH ERIC , HOM JAMES , SHIOMOTO GREGORY , CHOW NORMAN , LEONG BRANDON , BREWER RICHARD GRANT , WERNER DOUGLAS E , MCMASTER MARK
发明人： CORREA ADRIAN , LIN TIEN CHIH ERIC , HOM JAMES , SHIOMOTO GREGORY , CHOW NORMAN , LEONG BRANDON , BREWER RICHARD GRANT , WERNER DOUGLAS E , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

2. 发明申请

WO2007098078A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098078A2
公开(公告)日：2007-08-30
申请号：PCT/US2007004237
申请日：2007-02-16
申请人： COOLIGY INC , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , UPADHYA GIRISH , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
发明人： CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , UPADHYA GIRISH , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
IPC分类号： F28F1/08
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要翻译：安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

3. 发明申请

WO2007098077A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A3
公开(公告)日：2008-09-18
申请号：PCT/US2007004236
申请日：2007-02-16
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
发明人： UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

4. 发明申请

WO2005122661A2 APPARATUS AND METHOD OF EFFICIENT FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效流体输送装置和方法
公开(公告)号：WO2005122661A2
公开(公告)日：2005-12-22
申请号：PCT/US2005016680
申请日：2005-05-12
申请人： COOLIGY INC , BREWER RICHARD G , UPADHYA GINSH , ZHOU PENG , MCMASTER MARK , TSAO PAUL
发明人： BREWER RICHARD G , UPADHYA GINSH , ZHOU PENG , MCMASTER MARK , TSAO PAUL
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

5. 发明申请

WO2007089865A2 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
标题翻译：有效热交换器的可重用金属时刻
公开(公告)号：WO2007089865A2
公开(公告)日：2007-08-09
申请号：PCT/US2007002689
申请日：2007-01-30
申请人： COOLIGY INC , MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
发明人： MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果将金属TlM沉积在热交换器上，则拆卸产生也可再生的热交换子组件。

6. 发明申请

WO2006074353A3 HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS 审中-公开
标题翻译：高表面积比例结构及其在MICROHEAT交换器中的集成
公开(公告)号：WO2006074353A3
公开(公告)日：2007-10-18
申请号：PCT/US2006000434
申请日：2006-01-06
申请人： COOLIGY INC , DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
发明人： DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
IPC分类号： F28F3/14 , B21D39/06 , B21D53/00 , B23P15/26
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

7. 发明申请

WO2005120238A3 METHOD AND APPARATUS FOR CONTROLLING FREEZING NUCLEATION AND PROPAGATION 审中-公开
标题翻译：用于控制冷冻核和传播的方法和装置
公开(公告)号：WO2005120238A3
公开(公告)日：2007-05-24
申请号：PCT/US2005016883
申请日：2005-05-12
申请人： COOLIGY INC , UPADHYA GIRISH , BREWER RICHARD G , MCMASTER MARK
发明人： UPADHYA GIRISH , BREWER RICHARD G , MCMASTER MARK
IPC分类号： F25D21/00 , A21D2/00 , A21D8/02 , F28F3/12
CPC分类号： F28F3/12 , F28F2265/14
摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.
摘要翻译：公开了一种在液体系统中控制冷冻的装置和方法。该装置包括具有以表面积与体积比为特征的初始区的热交换器。该设备还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向上的冷冻期间促进体积膨胀。该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。优选地，最终的冷冻区具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

8. 发明申请

WO2005122662A2 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
标题翻译：半导体冷却应用的半合金接合机理
公开(公告)号：WO2005122662A2
公开(公告)日：2005-12-22
申请号：PCT/US2005016879
申请日：2005-05-12
申请人： COOLIGY INC , BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
发明人： BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
IPC分类号： H01L23/40 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：热收集装置使用包括万向接头的万向板安装在热源上。万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点载荷。保持力沿着与热源的热界面的面心法线向量共线的矢量施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向接头到集热装置的配合力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

9. 发明申请

WO2004042306A3 METHOD AND APPARATUS FOR ACHIEVING TEMPERATURE UNIFORMITY AND HOT SPOT COOLING IN A HEAT PRODUCING DEVICE 审中-公开
标题翻译：在制热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：WO2004042306A3
公开(公告)日：2004-11-11
申请号：PCT/US0334874
申请日：2003-10-30
申请人： COOLIGY INC
发明人： GOODSON KENNETH , KENNY THOMAS , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES
IPC分类号： B21D53/02 , F04B19/00 , F28F7/00 , F28F13/18 , F28F19/02 , G05D23/00 , H01L23/427 , H01L23/473
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

10. 发明申请

WO2004042304A3 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042304A3
公开(公告)日：2004-08-12
申请号：PCT/US0334742
申请日：2003-10-30
申请人： COOLIGY INC
发明人： KENNETH GOODSON E , KENNY THOMAS WILLIAM JR , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES , SHOOK JAMES GILL , CORBIN DAVID , LOVETTE JAMES
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/20 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a heat source configured along a plane. The heat exchanger comprising an interface layer (102) that perform thermal exchange with the heat source and configured to pass fluid from a first side to a second side. The manifold layer (106) comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer coupled to the first layer and in contact with the second side to the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着平面配置的热源的方法和装置。所述热交换器包括界面层（102），所述界面层与所述热源进行热交换，并被配置为将流体从第一侧传递到第二侧。歧管层（106）包括与热源接触的第一层，并具有适当的导热性以将热量传递到界面层。歧管层还包括耦合到第一层并与第二侧接触到界面层的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

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