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1. 发明申请

WO2007098077A3 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A3
公开(公告)日：2008-09-18
申请号：PCT/US2007004236
申请日：2007-02-16
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
发明人： UPADHYA GIRISH , MUNCH MARK , CHOW NORMAN , TSAO PAUL , WERNER DOUGLAS E , MCMASTER MARK , LANDRY FREDERIC , SPEARING IAN , SCHRADER TIM
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

2. 发明申请

WO2007120530A3 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A3
公开(公告)日：2008-08-21
申请号：PCT/US2007008190
申请日：2007-03-30
申请人： COOLIGY INC , HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
发明人： HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
IPC分类号： F28F27/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。

3. 发明申请

WO2007114913A3 MULTI DEVICE COOLING 审中-公开
标题翻译：多设备冷却
公开(公告)号：WO2007114913A3
公开(公告)日：2008-11-20
申请号：PCT/US2007008281
申请日：2007-03-30
申请人： COOLIGY INC , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK
发明人： UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK
IPC分类号： F28F7/00 , F24H3/02 , F28D15/00 , H05K7/20
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger (120) thermally coupled to a first heat source (115). The cooling system also has a second heat exchanger (130) thermally coupled to a second heat source ( 125) and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump (150) for driving the fluid. The cooling system further includes a first radiator (160) and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure.
摘要翻译：微型冷却系统包括热耦合到第一热源（115）的第一热交换器（120）。冷却系统还具有热耦合到第二热源（125）的第二热交换器（130）和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵（150）。冷却系统还包括第一散热器（160）和连接第一热交换器，第二热交换器，第一泵和第一散热器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。

4. 发明申请

WO2006074353A3 HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS 审中-公开
标题翻译：高表面积比例结构及其在MICROHEAT交换器中的集成
公开(公告)号：WO2006074353A3
公开(公告)日：2007-10-18
申请号：PCT/US2006000434
申请日：2006-01-06
申请人： COOLIGY INC , DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
发明人： DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
IPC分类号： F28F3/14 , B21D39/06 , B21D53/00 , B23P15/26
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

5. 发明申请

WO2005122662A2 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
标题翻译：半导体冷却应用的半合金接合机理
公开(公告)号：WO2005122662A2
公开(公告)日：2005-12-22
申请号：PCT/US2005016879
申请日：2005-05-12
申请人： COOLIGY INC , BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
发明人： BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
IPC分类号： H01L23/40 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：热收集装置使用包括万向接头的万向板安装在热源上。万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点载荷。保持力沿着与热源的热界面的面心法线向量共线的矢量施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向接头到集热装置的配合力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

6. 发明申请

WO2005121681A3 COUNTER FLOW MICRO HEAT EXCHANGER FOR OPTIMAL PERFORMANCE 审中-公开
标题翻译：计数器流量微热交换器，实现最佳性能
公开(公告)号：WO2005121681A3
公开(公告)日：2008-06-05
申请号：PCT/US2005016875
申请日：2005-05-12
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/473 , F28F3/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
摘要翻译：微型热交换器和集成电路根据逆流方向定向。为了确定这个方向，确定集成电路的温度梯度。温度梯度用于确定温度向量，该温度向量优选地表示从集成电路的热部分到冷部分的方向取向。微型热交换器循环冷却流体以接收从集成电路传递的热量。确定该冷却液体的定向流动。定向流量被测量为从微型热交换器的入口到出口的方向矢量。逆流方向定义为与方向流相反的温度矢量。

7. 发明申请

WO2007056599A2 LIQUID COOLING FOR BACKLIT DISPLAYS 审中-公开
标题翻译：背板显示液体冷却
公开(公告)号：WO2007056599A2
公开(公告)日：2007-05-18
申请号：PCT/US2006043999
申请日：2006-11-09
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/467
CPC分类号： G06F1/20 , G02F1/133603 , G02F2001/133628 , G06F1/1601 , G06F2200/1612 , G06F2200/201
摘要： The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.
摘要翻译：本发明提供了一种用于背光装置的冷却系统。冷却系统具有包括微管的第一集热器。第一集热器用于保持与背光装置的接触。冷却系统还具有第一散热器，第一泵，互连管，流体以及可选的风扇和/或储存器。第一散热器用于分配和/或分散热量，第一泵用于驱动流体流动，并且储存器用于储存流体。互连管插入在第一集热器，第一散热器和第一泵之间以形成封闭的冷却回路。一些实施例还提供了通过使用这种冷却系统来冷却背光装置的方法。

8. 发明申请

WO2005121681B1 COUNTER FLOW MICRO HEAT EXCHANGER FOR OPTIMAL PERFORMANCE 审中-公开
标题翻译：逆流微型热交换器的最佳性能
公开(公告)号：WO2005121681B1
公开(公告)日：2008-07-31
申请号：PCT/US2005016875
申请日：2005-05-12
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/473 , F28F3/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
摘要翻译：微型热交换器和集成电路根据逆流取向。为了确定该取向，确定集成电路的温度梯度。温度梯度用于确定优选地表示从集成电路的热部分到冷部分的方向定向的温度矢量。微型热交换器循环冷却流体以接收从集成电路传递的热量。确定该冷却液的定向流动。定向流量作为从微型热交换器的入口到出口的方向矢量进行测量。逆流方向被定义为与定向流相反的温度矢量。

9. 发明申请

WO2004070304A2 REMOVEABLE HEAT SPREADER SUPPORT MECHANISM AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：可拆卸散热器支撑机构及其制造方法
公开(公告)号：WO2004070304A2
公开(公告)日：2004-08-19
申请号：PCT/US2004001044
申请日：2004-01-14
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
发明人： UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
IPC分类号： F28F20060101 , F28F7/00 , H05K7/20 , F28F
CPC分类号： H01L23/36 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly comprises a rigid support bracket configured to substantially surround a heat source. The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid that is coupled to the rigid support bracket and configured to provide selective access to the heat source. The mounting assembly further comprises a heat exchanger coupled to the heat source, wherein the heat exchanger is positioned between the heat source and the removable lid. The removable lid is preferably configured and has a desired stiffness to urge the heat exchanger in contact by a substantially constant force with the heat source and prevents unwanted movement of the heat source. Further, the support bracket structure is configured to transfer the substantially constant force over a relatively large surface area on the circuit board thereby protecting the heat source from bending, breaking or collapsing from the substantially constant force. The removable lid is preferably made of a material, including but not limited to copper, which accommodates a desired amount of heat transfer from an area within the support bracket.
摘要翻译：安装组件包括构造成基本上围绕热源的刚性支撑支架。刚性支撑托架连接到电路板。安装组件还包括可拆卸盖，其被连接到刚性支撑托架并且构造成提供对热源的选择性接近。安装组件还包括耦合到热源的热交换器，其中热交换器位于热源和可移除盖之间。可移动盖优选地构造并且具有期望的刚度，以通过与热源的基本上恒定的力来促使热交换器接触，并且防止热源的不期望的移动。此外，支撑托架结构构造成在电路板上相对较大的表面积上传递基本上恒定的力，从而保护热源免受基本恒定的力的弯曲，破坏或塌陷。可移除盖优选地由包括但不限于铜的材料制成，其适应从支撑托架内的区域的期望量的热传递。

10. 发明申请

WO2006026460A3 PUMPED FLUID COOLING SYSTEM AND METHOD 审中-公开
标题翻译：泵送流体冷却系统及方法
公开(公告)号：WO2006026460A3
公开(公告)日：2007-11-29
申请号：PCT/US2005030465
申请日：2005-08-24
申请人： COOLIGY INC , WERNER DOUGLAS , GOODSON KENNETH , MUNCH MARK , UPADHYA GIRISH
发明人： WERNER DOUGLAS , GOODSON KENNETH , MUNCH MARK , UPADHYA GIRISH
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： F28F9/0263 , F28F3/12 , F28F2260/02
摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
摘要翻译：本发明是一种泵送流体冷却系统和方法。泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

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