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1. 发明申请

WO2005121681A3 COUNTER FLOW MICRO HEAT EXCHANGER FOR OPTIMAL PERFORMANCE 审中-公开
标题翻译：计数器流量微热交换器，实现最佳性能
公开(公告)号：WO2005121681A3
公开(公告)日：2008-06-05
申请号：PCT/US2005016875
申请日：2005-05-12
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/473 , F28F3/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
摘要翻译：微型热交换器和集成电路根据逆流方向定向。为了确定这个方向，确定集成电路的温度梯度。温度梯度用于确定温度向量，该温度向量优选地表示从集成电路的热部分到冷部分的方向取向。微型热交换器循环冷却流体以接收从集成电路传递的热量。确定该冷却液体的定向流动。定向流量被测量为从微型热交换器的入口到出口的方向矢量。逆流方向定义为与方向流相反的温度矢量。

2. 发明申请

WO2007114913A3 MULTI DEVICE COOLING 审中-公开
标题翻译：多设备冷却
公开(公告)号：WO2007114913A3
公开(公告)日：2008-11-20
申请号：PCT/US2007008281
申请日：2007-03-30
申请人： COOLIGY INC , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK
发明人： UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK
IPC分类号： F28F7/00 , F24H3/02 , F28D15/00 , H05K7/20
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger (120) thermally coupled to a first heat source (115). The cooling system also has a second heat exchanger (130) thermally coupled to a second heat source ( 125) and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump (150) for driving the fluid. The cooling system further includes a first radiator (160) and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure.
摘要翻译：微型冷却系统包括热耦合到第一热源（115）的第一热交换器（120）。冷却系统还具有热耦合到第二热源（125）的第二热交换器（130）和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵（150）。冷却系统还包括第一散热器（160）和连接第一热交换器，第二热交换器，第一泵和第一散热器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。

3. 发明申请

WO2004071139A3 REMEDIES TO PREVENT CRACKING IN A LIQUID SYSTEM 审中-公开
标题翻译：用于防止液体系统破裂的补救措施
公开(公告)号：WO2004071139A3
公开(公告)日：2005-07-28
申请号：PCT/US2004001047
申请日：2004-01-14
申请人： COOLIGY INC , MUNCH MARK , GOODSON KENNETH , CORBIN DAVE , ZENG SHULIN , KENNY THOMAS W JR , SHOOK JAMES GILL
发明人： MUNCH MARK , GOODSON KENNETH , CORBIN DAVE , ZENG SHULIN , KENNY THOMAS W JR , SHOOK JAMES GILL
IPC分类号： F04B17/00 , F28D15/02 , F28F19/00 , H01L23/473 , H05K7/20 , F25D11/00 , E03B7/10 , F04B43/08 , F25D23/12 , F28D15/00 , H05K5/00
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.
摘要翻译：提供使用最小尺寸和体积的外壳，气穴，可压缩物体和柔性物体的液体冷却系统，以防止冻结时水性溶液的膨胀。在这种系统中，管道，泵和热交换器被设计成防止其外壳和腔室的破裂。还描述了防止液体冷却系统中的裂纹的方法。在所有这些情况下，系统必须设计成在水被冻结时容忍膨胀。

4. 发明申请

WO2006074353A3 HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS 审中-公开
标题翻译：高表面积比例结构及其在MICROHEAT交换器中的集成
公开(公告)号：WO2006074353A3
公开(公告)日：2007-10-18
申请号：PCT/US2006000434
申请日：2006-01-06
申请人： COOLIGY INC , DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
发明人： DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
IPC分类号： F28F3/14 , B21D39/06 , B21D53/00 , B23P15/26
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

5. 发明申请

WO2007056599A2 LIQUID COOLING FOR BACKLIT DISPLAYS 审中-公开
标题翻译：背板显示液体冷却
公开(公告)号：WO2007056599A2
公开(公告)日：2007-05-18
申请号：PCT/US2006043999
申请日：2006-11-09
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/467
CPC分类号： G06F1/20 , G02F1/133603 , G02F2001/133628 , G06F1/1601 , G06F2200/1612 , G06F2200/201
摘要： The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.
摘要翻译：本发明提供了一种用于背光装置的冷却系统。冷却系统具有包括微管的第一集热器。第一集热器用于保持与背光装置的接触。冷却系统还具有第一散热器，第一泵，互连管，流体以及可选的风扇和/或储存器。第一散热器用于分配和/或分散热量，第一泵用于驱动流体流动，并且储存器用于储存流体。互连管插入在第一集热器，第一散热器和第一泵之间以形成封闭的冷却回路。一些实施例还提供了通过使用这种冷却系统来冷却背光装置的方法。

6. 发明申请

WO2005122662A2 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
标题翻译：半导体冷却应用的半合金接合机理
公开(公告)号：WO2005122662A2
公开(公告)日：2005-12-22
申请号：PCT/US2005016879
申请日：2005-05-12
申请人： COOLIGY INC , BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
发明人： BREWER RICHARD G , TSAO PAUL , HERMS RICHARD , MUNCH MARK , MCMASTER MARK , CORBIN DAVE
IPC分类号： H01L23/40 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：热收集装置使用包括万向接头的万向板安装在热源上。万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点载荷。保持力沿着与热源的热界面的面心法线向量共线的矢量施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向接头到集热装置的配合力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

7. 发明申请

WO2004042297A3 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042297A3
公开(公告)日：2004-07-22
申请号：PCT/US0333749
申请日：2003-10-22
申请人： COOLIGY INC
发明人： KENNY THOMAS WILLIAM JR , MUNCH MARK , ZHOU PENG , SHOOK JAMES GILL , UPADHYA GIRISH , KENNETH GOODSON E , CORBIN DAVE , MCMASTER MARK , LOVETTE JAMES
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/20 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer (102) for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer (106) that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes (118B) which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes (118E) which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层（102）。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层（106）。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔（118B），其将流体通过第一组。歧管层包括耦合到第二组个体化孔（118E）的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

8. 发明申请

WO2007130644A3 GIMBALLED ATTACHMENT FOR MULTIPLE HEAT EXCHANGERS 审中-公开
标题翻译：带有多个热交换器的附件
公开(公告)号：WO2007130644A3
公开(公告)日：2008-11-27
申请号：PCT/US2007010956
申请日：2007-05-04
申请人： COOLIGY INC , MUNCH MARK , WERNER DOUGLAS E
发明人： MUNCH MARK , WERNER DOUGLAS E
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/40 , H01L23/433 , H01L23/4338 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： One or more heat exchangers (120,122) are coupled to one of more heat source (140,142)using a single gimbaled joining mechanism (110).
摘要翻译：使用单个万向接合机构（110）将一个或多个热交换器（120,122）联接到更多的热源（140,142）之一。

9. 发明申请

WO2005121681B1 COUNTER FLOW MICRO HEAT EXCHANGER FOR OPTIMAL PERFORMANCE 审中-公开
标题翻译：逆流微型热交换器的最佳性能
公开(公告)号：WO2005121681B1
公开(公告)日：2008-07-31
申请号：PCT/US2005016875
申请日：2005-05-12
申请人： COOLIGY INC , MUNCH MARK , UPADHYA GIRISH
发明人： MUNCH MARK , UPADHYA GIRISH
IPC分类号： H01L23/473 , F28F3/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
摘要翻译：微型热交换器和集成电路根据逆流取向。为了确定该取向，确定集成电路的温度梯度。温度梯度用于确定优选地表示从集成电路的热部分到冷部分的方向定向的温度矢量。微型热交换器循环冷却流体以接收从集成电路传递的热量。确定该冷却液的定向流动。定向流量作为从微型热交换器的入口到出口的方向矢量进行测量。逆流方向被定义为与定向流相反的温度矢量。

10. 发明申请

WO2007089865A2 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
标题翻译：有效热交换器的可重用金属时刻
公开(公告)号：WO2007089865A2
公开(公告)日：2007-08-09
申请号：PCT/US2007002689
申请日：2007-01-30
申请人： COOLIGY INC , MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
发明人： MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果将金属TlM沉积在热交换器上，则拆卸产生也可再生的热交换子组件。

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