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1. 发明申请

WO2007089869A3 TAPE-WRAPPED MULTILAYER TUBING AND METHODS FOR MAKING THE SAME 审中-公开
公开(公告)号：WO2007089869A3
公开(公告)日：2007-08-09
申请号：PCT/US2007/002701
申请日：2007-01-30
申请人： COOLIGY, INC. , WERNER, Douglas, E. , FIROUZI, Ali , MUNCH, Mark , CICHOCKI, Zbigniew
发明人： WERNER, Douglas, E. , FIROUZI, Ali , MUNCH, Mark , CICHOCKI, Zbigniew
IPC分类号： F28F7/00
摘要： The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.

2. 发明申请

WO2004042306A2 METHOD AND APPARATUS FOR ACHIEVING TEMPERATURE UNIFORMITY AND HOT SPOT COOLING IN A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于实现制热装置中的温度均匀性和热点冷却的方法和设备
公开(公告)号：WO2004042306A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/034874
申请日：2003-10-30
申请人： COOLIGY, INC.
发明人： GOODSON, Kenneth , KENNY, Thomas , ZHOU, Peng , UPADHYA, Girish , MUNCH, Mark , MCMASTER, Mark , HOM, James
IPC分类号： F28D
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：控制与热交换器的热交换表面接触的热源的温度的方法，其中热交换表面基本上沿平面对齐。该方法包括将第一温度流体引导至热交换表面，其中第一温度流体沿热交换表面与热源进行热交换。该方法包括引导来自热交换表面的第二温度流体，其中引导流体以最小化沿着热源的温差。通过优化和控制热交换器中的流体和热阻，温差最小化。流体的阻力受传热特征，多个泵，流体路径中的固定和可变阀以及流动阻抗元件的尺寸，体积和表面积，流体的压力和流率控制以及其他因素的影响。 p>

3. 发明申请

WO2006074353A2 FABRICATION OF HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATIONS IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEMS 审中-公开
标题翻译：制造高表面量的比例结构及其在液体冷却系统的微波炉交换器中的集成
公开(公告)号：WO2006074353A2
公开(公告)日：2006-07-13
申请号：PCT/US2006/000434
申请日：2006-01-06
申请人： COOLIGY, INC. , DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
发明人： DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
IPC分类号： F28F7/00
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

4. 发明申请

WO2005122662A3 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
公开(公告)号：WO2005122662A3
公开(公告)日：2005-12-22
申请号：PCT/US2005/016879
申请日：2005-05-12
申请人： COOLIGY, INC. , BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
发明人： BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
IPC分类号： H05K7/20
摘要： A heat coolection apparatus (100) is mounted to the heat source (20) using a gimbal plate (150) which includes a gimbal joint (301).

5. 发明申请

WO2007130644A2 GIMBALLED ATTACHMENT FOR MULTIPLE HEAT EXCHANGERS 审中-公开
标题翻译：吸引多个热交换器的附件
公开(公告)号：WO2007130644A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/010956
申请日：2007-05-04
申请人： COOLIGY INC. , MUNCH, Mark , WERNER, Douglas, E.
发明人： MUNCH, Mark , WERNER, Douglas, E.
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/40 , H01L23/433 , H01L23/4338 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： One or more heat exhangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：一个或多个热交换器使用单个球形接合机构联接到一个或多个热源。接合机构包括万向板和万向接头。万向节接头能够独立地将作用于热交换器的保持力作为单点负载施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向接头到每个热交换器的保持力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

6. 发明申请

WO2007089865A3 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
公开(公告)号：WO2007089865A3
公开(公告)日：2007-08-09
申请号：PCT/US2007/002689
申请日：2007-01-30
申请人： COOLIGY, INC. , MADHAV, Datta , ZHOU, Peng , HOME, James , MUNCH, Mark , MCMASTER, Mark
发明人： MADHAV, Datta , ZHOU, Peng , HOME, James , MUNCH, Mark , MCMASTER, Mark
IPC分类号： F28F7/00 , F28F13/18
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.

7. 发明申请

WO2004071139A2 REMEDIES TO PREVENT CRACKING IN A LIQUID SYSTEM 审中-公开
标题翻译：补救措施以防止液体系统中的破裂
公开(公告)号：WO2004071139A2
公开(公告)日：2004-08-19
申请号：PCT/US2004/001047
申请日：2004-01-14
申请人： COOLIGY, INC. , MUNCH, Mark , GOODSON, Kenneth , CORBIN, Dave , ZENG, Shulin , KENNY, Thomas, W., Jr. , SHOOK, James, Gill
发明人： MUNCH, Mark , GOODSON, Kenneth , CORBIN, Dave , ZENG, Shulin , KENNY, Thomas, W., Jr. , SHOOK, James, Gill
IPC分类号： H05K
CPC分类号： H01L23/473 , F04B17/00 , F28D15/00 , F28F19/006 , F28F2245/02 , F28F2250/08 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.
摘要翻译：提供使用最小尺寸和体积的外壳，气穴，可压缩物体和柔性物体的液体冷却系统，以防止冻结时水性溶液的膨胀。在这种系统中，管道，泵和热交换器被设计成防止其外壳和腔室的破裂。还描述了防止液体冷却系统中的裂纹的方法。在所有这些情况下，系统必须设计成在水被冻结时容忍膨胀。

8. 发明申请

WO2004042304A2 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042304A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/034742
申请日：2003-10-30
申请人： COOLIGY, INC.
发明人： KENNETH, Goodson, E. , KENNY, Thomas, William, Jr. , ZHOU, Peng , UPADHYA, Girish , MUNCH, Mark , McMASTER, Mark , HOM, James , SHOOK, James, Gill , CORBIN, David , LOVETTE, James
IPC分类号： F28D
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a heat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer coupled to the first layer and in contact with the second side to the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着车道配置的热源的方法和装置。热交换器包括界面层，该界面层与热源一起执行热交换器，并被配置为将流体从第一侧传送到第二侧。歧管层包括与热源接触的第一层，并且具有适当的导热性以将热量传递到界面层。歧管层还包括耦合到第一层并与第二侧接触到界面层的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

9. 发明申请

WO2007114913A2 MULTI DEVICE COOLING 审中-公开
标题翻译：多设备冷却
公开(公告)号：WO2007114913A2
公开(公告)日：2007-10-11
申请号：PCT/US2007/008281
申请日：2007-03-30
申请人： COOLIGY, INC. , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
发明人： UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
IPC分类号： F25D17/06 , F25B1/00
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.
摘要翻译：微型冷却系统包括热耦合到第一热源的第一热交换器。冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵。冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

10. 发明申请

WO2004083742A2 BOILING TEMPERATURE DESIGN IN PUMPED MICROCHANNEL COOLING LOOPS 审中-公开
标题翻译：泵送微通道冷却机的沸腾温度设计
公开(公告)号：WO2004083742A2
公开(公告)日：2004-09-30
申请号：PCT/US2004/006746
申请日：2004-03-05
申请人： COOLIGY, INC.
发明人： ZHOU, Peng , ZENG, Shulin , KENNY, Thomas, W., Jr. , MUNCH, Mark , UPADHYA, Girish , GOODSON, Kenneth , SANTIAGO, Juan, G.
IPC分类号： F25B
CPC分类号： H01L23/473 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： A method of cooling at least one heat generating device using a cooling system is disclosed. The method comprises the steps of using at least one pump to cause a fluid to flow in at least on heat exchanger and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
摘要翻译：公开了一种使用冷却系统来冷却至少一个发热装置的方法。该方法包括以下步骤：使用至少一个泵来使流体至少在热交换器上流动并且调节流体的压力以相应地调节至少一个热交换器中的流体的沸点温度。该方法还可以包括提供至少一个散热器以排除来自系统的热的步骤，所述至少一个热排出器位于至少一个热交换器的下游。调节流体压力的步骤可以包括在系统充电和密封期间调节流体的压力。此外，调节流体压力的步骤可以包括调节在系统充电期间引入的气体和液体的组成和体积。

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