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1. 发明申请

WO2007089865A2 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
标题翻译：有效热交换器的可重用金属时刻
公开(公告)号：WO2007089865A2
公开(公告)日：2007-08-09
申请号：PCT/US2007002689
申请日：2007-01-30
申请人： COOLIGY INC , MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
发明人： MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果将金属TlM沉积在热交换器上，则拆卸产生也可再生的热交换子组件。

2. 发明申请

WO2007089865A3 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
公开(公告)号：WO2007089865A3
公开(公告)日：2007-08-09
申请号：PCT/US2007/002689
申请日：2007-01-30
申请人： COOLIGY, INC. , MADHAV, Datta , ZHOU, Peng , HOME, James , MUNCH, Mark , MCMASTER, Mark
发明人： MADHAV, Datta , ZHOU, Peng , HOME, James , MUNCH, Mark , MCMASTER, Mark
IPC分类号： F28F7/00 , F28F13/18
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.

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