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1. 发明申请

WO2009003782A2 ELEMENT WHICH GENERATES A MAGNETIC FIELD 审中-公开
标题翻译：磁场产生元件
公开(公告)号：WO2009003782A2
公开(公告)日：2009-01-08
申请号：PCT/EP2008056885
申请日：2008-06-04
申请人： CONTINENTAL AUTOMOTIVE GMBH , ANTE JOHANNES , HEINRICH STEPHAN , OTT ANDREAS
发明人： ANTE JOHANNES , HEINRICH STEPHAN , OTT ANDREAS
IPC分类号： G01P3/487
CPC分类号： F02C6/12 , F01D5/025 , F02B37/025 , F02B39/00 , F04D25/04 , F04D27/001 , F04D29/266 , F05D2220/40 , F05D2300/507 , G01P3/487 , Y02T10/144
摘要： The invention relates to an element which generates a magnetic field for securing a compressor wheel to a turboshaft of an exhaust-gas turbocharger, having a base body that receives an annular-shaped magnet that rotates with the turboshaft. In order to provide an element which generates a magnetic field for securing a compressor wheel to a turboshaft of an exhaust-gas turbocharger, in which the magnet is protected from mechanical and chemical loads, the element which generates the magnetic field has at least 3 parts that consist of a covering body, a base body and the annular-shaped magnet. Said base body is made out of a high-strength metal that is highly-conductive with the magnetic field, onto which the annular-shaped magnet is mounted and the covering body is made of a non-magnetic material, and is welded to the base body in such a manner that the covering body and the base body form a frame for the magnets.
摘要翻译：本发明涉及一种磁场产生元件，用于压缩机叶轮安装到涡轮轴的排气涡轮增压器，具有基体，其容纳一环形，在涡轮轴旋转的磁铁。为了给压缩机叶轮安装到涡轮增压器的涡轮轴，其中，所述磁体免受机械和化学应力保护提供的磁场产生元件，所述磁场产生元件是覆盖身体的至少三个部分，构成所述基体和所述环形磁铁，所述的基体是磁场以及导电，高强度的金属，在其上的环形磁体安装和由非磁性材料制成的壳体，并且被焊接到基体以这样的方式是，所述壳体和所述基体的磁体限定的外壳。

2. 发明申请

WO2012052514A3 TEMPERATURE SENSOR DEVICE 审中-公开
标题翻译：温度传感器元件
公开(公告)号：WO2012052514A3
公开(公告)日：2012-09-07
申请号：PCT/EP2011068348
申请日：2011-10-20
申请人： CONTINENTAL AUTOMOTIVE GMBH , ANTE JOHANNES , GRASS PHILIPPE , HERRMANN MARKUS , OTT ANDREAS , REITMEIER WILLIBALD , SCHAEDLICH DENNY , WEIGL MANFRED , WILDGEN ANDREAS
发明人： ANTE JOHANNES , GRASS PHILIPPE , HERRMANN MARKUS , OTT ANDREAS , REITMEIER WILLIBALD , SCHAEDLICH DENNY , WEIGL MANFRED , WILDGEN ANDREAS
IPC分类号： G01K3/14 , G01K7/18 , G01K7/42 , G01K13/02
CPC分类号： G01K7/18 , G01K3/14 , G01K7/427 , G01K13/02 , G01K2013/024 , G01K2205/04
摘要： The invention relates to a temperature sensor device (100) comprising a support substrate (10), a first temperature measuring structure (T1) and a second temperature measuring structure (T2). Said support substrate (10) has a first area (B1) and a second area (B2), said first area (B1) being exposed to a gas flow when the temperature sensor device (100) is in operation and the second area (B2) is arranged at a predetermined distance in relation to the first area (B1) and in the axial direction along a longitudinal axis (L) of the support substrate (10). Said first temperature measuring structure (T1) is arranged in the first area (B1). The second measuring structure (T2) is arranged in the second area (B2).
摘要翻译：温度传感器装置（100）具有一载体基底（10）和第一温度传感结构（T1）和在第二温度测量结构（T2）。所述载体基片（10）具有第一区域（B1）和第二区域（B2），其中所述温度传感器装置（100）的操作期间在第一区域（B1）暴露于气体流和所述第二区域（B2）与第一区域（B1）是隔开沿着载体衬底（10）中的纵向轴线（L）轴向上所定义。所述第一温度测量结构（T1）被布置在第一区域中（B 1）。所述第二温度测量结构（T2）是在设置在第二区域（B2）。

3. 发明申请

WO2012080347A2 METHOD FOR OPERATING A SOOT SENSOR 审中-公开
标题翻译：一种用于操作传感器RUSS
公开(公告)号：WO2012080347A2
公开(公告)日：2012-06-21
申请号：PCT/EP2011072778
申请日：2011-12-14
申请人： CONTINENTAL AUTOMOTIVE GMBH , ANTE JOHANNES , HERRMANN MARKUS , OTT ANDREAS , REITMEIER WILLIBALD , SCHAEDLICH DENNY , WEIGL MANFRED , WILDGEN ANDREAS
发明人： ANTE JOHANNES , HERRMANN MARKUS , OTT ANDREAS , REITMEIER WILLIBALD , SCHAEDLICH DENNY , WEIGL MANFRED , WILDGEN ANDREAS
IPC分类号： F01N9/00 , G01N15/06
CPC分类号： G01N15/0656 , F01N9/002 , F01N2560/05 , Y02T10/47
摘要： The invention relates to a method for operating a soot sensor in the exhaust gas tract of an internal combustion engine. Said soot sensor comprises an inter-digital electrode structure to which a measurement voltage is applied. Soot particles from the exhaust gas flow deposit themselves on the inter-digital electrode structure and the measuring current flowing over the soot particles and the inter-digital electrode structure is evaluated as a measurement for the soot concentration of the soot sensor. Said soot sensor comprises a heating element for burning clean the inter-digital electrode structure. The aim of the invention is to provide a method for operating a soot sensor which has good measurement results, said soot sensor should have the shortest possible idle time. To this end, a point in time for burning clean the soot sensor is determined in accordance with the operational state of the internal combustion engine and then, the burning clean of the inter-digital electrode structure starts by heating the soot sensor by means of the heating element.
摘要翻译：本发明涉及一种用于在内燃发动机的排气系统中操作烟尘传感器，烟灰传感器具有交叉梳状电极结构，被施加的测量电压，其中沉积在叉指型电极结构的煤烟颗粒从废气流和流过所述烟尘颗粒电流和叉指式电极结构测量电流被评价为烟灰传感器的煤烟荷载的测量值，并且其中所述烟灰传感器包括加热元件的叉指式电极结构的燃烧。用于操作烟尘传感器，其提供良好的测量结果，其中所述烟灰传感器应具有最小可能的死区时间，在对内燃机的运转状态的依赖性提供一种方法，确定时间用于燃烧烟灰传感器，然后通过与加热烟尘传感器beginntdas叉指电极结构的自由燃烧加热元件。

4. 发明申请

WO2009032230A2 A CMOS DEVICE HAVING GATE INSULATION LAYERS OF DIFFERENT TYPE AND THICKNESS AND METHOD OF FORMING THE SAME 审中-公开
标题翻译：具有不同类型和厚度的门绝缘层的CMOS器件及其形成方法
公开(公告)号：WO2009032230A2
公开(公告)日：2009-03-12
申请号：PCT/US2008010299
申请日：2008-08-30
申请人： ADVANCED MICRO DEVICES INC , WEI ANDY , WAITE ANDREW , TRENTZSCH MARTIN , GROSCHOPF JOHANNES , GRASSHOFF GUNTER , OTT ANDREAS
发明人： WEI ANDY , WAITE ANDREW , TRENTZSCH MARTIN , GROSCHOPF JOHANNES , GRASSHOFF GUNTER , OTT ANDREAS
IPC分类号： H01L21/8234 , H01L21/8238 , H01L27/088 , H01L27/092
CPC分类号： H01L21/82345 , H01L21/823462 , H01L21/823807 , H01L21/823842 , H01L21/823857 , H01L21/84 , H01L27/088 , H01L27/0922 , H01L29/66545 , H01L29/7843 , H01L29/7848 , Y10S438/926
摘要： In the process sequence for replacing conventional gate electrode structures (310) by high-k metal gate structures (310N, 310B, 310P), the number of additional masking steps may be maintained at a low level, for instance by using highly selective etch steps (322, 325, 327, 331), thereby maintaining a high degree of compatibility with conventional CMOS techniques. Furthermore, the techniques disclosed herein enable compatibility to front-end process techniques and back-end process techniques, thereby allowing the integration of well-established strain- inducing mechanisms in the transistor level as well as in the contact level.
摘要翻译：在用高k金属栅极结构（310N，310B，310P）代替常规栅电极结构（310）的处理顺序中，例如通过使用高选择性蚀刻步骤，附加掩模步骤的数量可以保持在低水平（322,325,327,331），从而保持与常规CMOS技术的高度兼容性。此外，本文公开的技术能够实现与前端处理技术和后端处理技术的兼容性，从而允许将已建立的应变诱导机制集成在晶体管级以及接触级中。

5. 发明申请

WO2005078769A2 MANUFACTURING INTEGRATED CIRCUITS 审中-公开
标题翻译：制造集成电路
公开(公告)号：WO2005078769A2
公开(公告)日：2005-08-25
申请号：PCT/IB2005000353
申请日：2005-02-14
申请人： MELEXIS NV , HOFFMAN JENS , OTT ANDREAS , STAHL KARL-ULRICH
发明人： HOFFMAN JENS , OTT ANDREAS , STAHL KARL-ULRICH
IPC分类号： G01R31/3185 , G11C29/44 , H01L23/544 , H01L23/58 , H01L21/00
CPC分类号： H01L22/32 , H01L22/34 , H01L2224/05554
摘要： A method of manufacturing integrated circuits 201 comprises the steps of: forming an array of integrated circuits 201 on a wafer, each integrated circuit 201 being provided with dedicated configuration means 104, 105; configuring said integrated circuits 201 using said configuration means 104, 105; and separating the individual integrated circuits 201 from the array by cutting along scribe channels 202 provided between the integrated circuits 201 in the array wherein said dedicated configuration means 104, 105 for each integrated circuit 201 is wholly or partially formed in a scribe channel 202 adjacent to said integrated circuit 201. The configuration means 104, 105 are thus destroyed during the separation process, thus producing a smaller integrated circuits 201. As this is the case, more integrated circuits 201 can be formed on a single wafer thus using the available wafer more efficiently and providing significant cost savings.
摘要翻译：制造集成电路201的方法包括以下步骤：在晶片上形成集成电路阵列201，每个集成电路201设置有专用配置装置104,105; 使用所述配置装置104,105来配置所述集成电路201; 并且通过沿着阵列中的集成电路201之间设置的划线通道202切割各个集成电路201，每个集成电路201用于每个集成电路201的所有专用配置装置104,105全部或部分形成在邻近的划线通道202中所述集成电路201.因此，在分离过程期间，配置装置104,105被破坏，从而产生较小的集成电路201.在这种情况下，可以在单个晶片上形成更多的集成电路201，从而使用可用的晶片更多有效地节省成本。

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