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1. 发明申请

WO2006053277A3 WIRE BOND INTERCONNECTION 审中-公开
标题翻译：电线互连
公开(公告)号：WO2006053277A3
公开(公告)日：2007-06-21
申请号：PCT/US2005041116
申请日：2005-11-14
申请人： CHIPPAC INC , LEE HUNG-TEAK , KIM JONG-KUK , KIM CHULSIK , JANG KI-YOUNG , PENDSE RAJENDRA D
发明人： LEE HUNG-TEAK , KIM JONG-KUK , KIM CHULSIK , JANG KI-YOUNG , PENDSE RAJENDRA D
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/13 , H01L23/4952 , H01L23/49833 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48455 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/4848 , H01L2224/48599 , H01L2224/48644 , H01L2224/48647 , H01L2224/48699 , H01L2224/48744 , H01L2224/48747 , H01L2224/49109 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/85051 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2224/85181 , H01L2224/85186 , H01L2924/2065 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal. The width of the lead finger at the bond site is less than a diameter of the support pedestal. The lead finger can have a generally trapezoidal, or roughly triangular (truncated), or roughly triangular (with rounded apex) cross section.
摘要翻译：芯片焊盘和键合指状物之间的引线键合互连包括在引线指的键合位置处的支撑基座，在芯片焊盘上的球接合以及支撑基座上的针脚接合。引线指在焊接部位的宽度小于支撑基座的直径。铅指可以具有大致梯形或大致三角形（截顶）或大致三角形（具有圆顶顶点）横截面。

2. 发明申请

WO2012173404A2 WELDING SERVER AND WELDING MANAGEMENT SYSTEM 审中-公开
标题翻译：焊接服务器和焊接管理系统
公开(公告)号：WO2012173404A2
公开(公告)日：2012-12-20
申请号：PCT/KR2012004693
申请日：2012-06-14
申请人： HYOSUNG CORP , JANG KI-YOUNG , HWANG YOUNG-MIN , RYU JAE-DEOG , KIM HEE-SOO
发明人： JANG KI-YOUNG , HWANG YOUNG-MIN , RYU JAE-DEOG , KIM HEE-SOO
IPC分类号： G06Q50/10
CPC分类号： G06Q50/10
摘要： The present invention relates to a welding server and a welding management system. A welding server of the present invention comprises a first LAN card (104) and a second LAN card (102), wherein an application (110) for selecting one of said first LAN card (104) and said second LAN card (102) is provided. Further, if said first LAN card (104) is selected by said application (110), the welding server (100) reads IP information of welding control devices (200) connected to a network, and performs a grouping operation. In addition, the welding server (100) continuously communicates with communication-capable welding control devices (200), and collects and manages welding data and event information, and for communication-capable welding control devices (200), the welding server (100) searches for the communication-capable welding control devices by performing a continuous scanning operation. According to the present invention as mentioned above, the invention improves reliability in the management of welding quality, and prevents communication loads and the waste of resources that constitute the network.
摘要翻译：本发明涉及焊接服务器和焊接管理系统。本发明的焊接服务器包括第一LAN卡（104）和第二LAN卡（102），其中用于选择所述第一LAN卡（104）和所述第二LAN卡（102）之一的应用（110）是提供。此外，如果由所述应用程序（110）选择所述第一LAN卡（104），则焊接服务器（100）读取连接到网络的焊接控制装置（200）的IP信息，并执行分组操作。另外，焊接服务器（100）与可通信的焊接控制装置（200）连续通信，并且收集和管理焊接数据和事件信息，并且对于可通信的焊接控制装置（200），焊接服务器（100）通过执行连续扫描操作来搜索具有通信能力的焊接控制装置。根据如上所述的本发明，本发明提高了焊接质量管理的可靠性，并且防止构成网络的通信负荷和资源浪费。

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