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    • 4. 发明申请
    • SOLID-STATE IMAGE PICKUP DEVICE
    • 固态图像拾取器件
    • WO2012004965A1
    • 2012-01-12
    • PCT/JP2011/003796
    • 2011-07-04
    • CANON KABUSHIKI KAISHASHIMOTSUSA, Mineo
    • SHIMOTSUSA, Mineo
    • H01L27/146H04N5/369
    • H01L27/14636H01L27/14601H01L27/14621H01L27/14634H01L27/1464H01L27/14645H01L27/14685H01L27/14687H01L27/1469H01L31/09
    • A solid-state image pickup device capable of suppressing the generation of dark current and/or leakage current is provided. The solid-state image pickup device has a first substrate provided with a photoelectric converter on its primary face, a first wiring structure having a first bonding portion which contains a conductive material, a second substrate provided with a part of a peripheral circuit on its primary face, and a second wiring structure having a second bonding portion which contains a conductive material. In addition, the first bonding portion and the second bonding portion are bonded so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. Furthermore, the conductive material of the first bonding portion and the conductive material of the second bonding portion are surrounded with diffusion preventing films.
    • 提供能够抑制暗电流和/或漏电流的产生的固态图像拾取装置。 固体摄像装置具有在其一次面上设置有光电转换器的第一基板,具有包含导电材料的第一接合部的第一布线结构,在其一次侧设置有外围电路的一部分的第二基板 面和具有包含导电材料的第二接合部分的第二布线结构。 另外,第一接合部和第二接合部被接合,使得第一基板,第一布线结构,第二布线结构和第二基板以该顺序布置。 此外,第一接合部分的导电材料和第二接合部分的导电材料被扩散防止膜包围。