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    • 1. 发明申请
    • PHOTOELECTRIC CONVERSION APPARATUS AND MANUFACTURING METHOD FOR A PHOTOELECTRIC CONVERSION APPARATUS
    • 光电转换装置的光电转换装置和制造方法
    • WO2010090149A1
    • 2010-08-12
    • PCT/JP2010/051309
    • 2010-01-26
    • CANON KABUSHIKI KAISHAWATANABE, Takanori
    • WATANABE, Takanori
    • H01L27/146
    • H01L27/1463H01L27/1464H01L27/14689
    • A, photoelectric conversion apparatus (100) comprises: multiple photoelectric converting units (PD) disposed in a semiconductor substrate; (SB) and isolation portions (103,104,105,106) disposed in the semiconductor substrate. Each photoelectric converting unit includes: a second semiconductor region (107); a third semiconductor region, (109) disposed below the second semiconductor region (107) and a fourth semiconductor region (102) disposed below the third semiconductor region, and each isolation portion includes: a fifth semiconductor region, (104) disposed at a location that is deeper than the surface of the semiconductor substrate and at least extending laterally to the second semiconductor region, containing a first conductivity type impurity; and a sixth semiconductor region, (105) disposed below the fifth semiconductor region and at least extending laterally to the third semiconductor region, containing the first conductivity type impurity, and the diffusion coefficient of the impurity contained in the fifth semiconductor region is lower than the diffusion coefficient of the impurity contained in the sixth semiconductor region.
    • A,光电转换装置(100)包括:设置在半导体衬底中的多个光电转换单元(PD) (SB)和设置在半导体衬底中的隔离部分(103,104,105,106)。 每个光电转换单元包括:第二半导体区域(107); 设置在所述第二半导体区域(107)下方的第三半导体区域(109)和设置在所述第三半导体区域下方的第四半导体区域(102),并且每个隔离部分包括:第五半导体区域(104),设置在位置 其比半导体衬底的表面更深,并且至少横向延伸到包含第一导电类型杂质的第二半导体区域; 以及第六半导体区域(105),其设置在所述第五半导体区域的下方,并且至少横向延伸到所述第三半导体区域,所述第三半导体区域包含所述第一导电型杂质,并且所述第五半导体区域中所含的杂质的扩散系数低于 包含在第六半导体区域中的杂质的扩散系数。