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1. 发明申请

WO2007109432A3 METHODS AND APPARATUS FOR ELECTROPROCESSING WITH RECESSED BIAS CONTACT 审中-公开
标题翻译：具有凹陷接触的电子加工方法和装置
公开(公告)号：WO2007109432A3
公开(公告)日：2007-11-29
申请号：PCT/US2007063579
申请日：2007-03-08
申请人： APPLIED MATERIALS INC , WANG YAN , HSU WEI-YUNG , DUBOUST ALAIN , MANENS ANTOINE P
发明人： WANG YAN , HSU WEI-YUNG , DUBOUST ALAIN , MANENS ANTOINE P
IPC分类号： H01L21/44
CPC分类号： B23H5/08 , B24B37/046 , B24B37/20 , C25D17/10 , C25F7/00
摘要： A method and apparatus are provided for electroprocessing with recessed bias contact. In one embodiment, the apparatus includes a platen, a processing pad disposed on the platen and having at least a first aperture and a second aperture formed therethrough, a first electrode positioned under the processing pad and exposed to a polishing surface of the processing pad through the first aperture, wherein an upper surface of the first electrode is recessed from the polishing surface; a plurality of second electrodes exposed to the polishing surface through the second aperture, wherein upper surfaces of the second electrodes are recessed from the polishing surface, and an electrical circuit coupled to the first and second electrodes and configured to bias each of the second electrodes independently relative to the first electrode.
摘要翻译：提供了用于具有凹入式偏置接触的电处理的方法和设备。在一个实施例中，该设备包括台板，设置在台板上并且至少具有穿过其形成的第一孔和第二孔的加工垫，位于加工垫下方并且通过加工垫的抛光表面暴露的第一电极所述第一孔口，其中所述第一电极的上表面从所述抛光表面凹陷; 多个第二电极，所述多个第二电极通过所述第二孔暴露于所述抛光表面，其中所述第二电极的上表面从所述抛光表面凹入;以及电路，所述电路耦合至所述第一电极和所述第二电极并且被配置为独立地偏压所述第二电极相对于第一电极。

2. 发明申请

WO2011017572A3 LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING 审中-公开
标题翻译：用于薄膜太阳能电池板激光切割的激光模块和工艺
公开(公告)号：WO2011017572A3
公开(公告)日：2011-06-16
申请号：PCT/US2010044620
申请日：2010-08-05
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , LEI WEI-SHENG , HSU WEI-YUNG , SHAMOUN BASSAM , WANG YAN
发明人： MANENS ANTOINE P , LEI WEI-SHENG , HSU WEI-YUNG , SHAMOUN BASSAM , WANG YAN
IPC分类号： H01L31/18 , B23K26/36 , H01L31/042 , H01S3/10
CPC分类号： H01L31/18 , B23K26/0673 , B23K26/082 , B23K26/364
摘要： Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.
摘要翻译：提供用于激光刻划的激光系统。该系统包括通过电缆耦合到激光模块的远程模块。远程模块包括一个控制器和一个冷却器。激光模块至少具有激光源和冷却板。激光模块可操作以从工件的至少一部分去除材料。该系统还包括通过多个光纤耦合到激光模块的多个终端模块。每个终端模块都包括一个机械接口。机械接口耦合到相应的光纤。该系统还包括多个扫描装置，其可操作以控制来自激光器的输出的位置。每个扫描设备都耦合到相应的机械接口。

3. 发明申请

WO2013033428A3 IN SITU PROCESS KIT CLEAN FOR MOCVD CHAMBERS 审中-公开
标题翻译：现场加工成套工具为MOCVD房间清洁
公开(公告)号：WO2013033428A3
公开(公告)日：2013-04-25
申请号：PCT/US2012053186
申请日：2012-08-30
申请人： APPLIED MATERIALS INC , LU JIANG , CHUNG HUA , WANG YAN , SHEN KUAN CHIEN KERIS , DONG XIZI , DUBOUST ALAIN , HSU WEI-YUNG , GRIFFIN KEVIN S , OLGADO DONALD J K
发明人： LU JIANG , CHUNG HUA , WANG YAN , SHEN KUAN CHIEN KERIS , DONG XIZI , DUBOUST ALAIN , HSU WEI-YUNG , GRIFFIN KEVIN S , OLGADO DONALD J K
IPC分类号： H01L21/205 , H01L21/02 , H01L21/302
CPC分类号： H01L21/67115 , C23C16/4405
摘要： Embodiments of the invention include methods of in situ cleaning of deposited materials from the surfaces of processing chambers, e.g., MOCVD processing chambers. The cleaning process increases the time between preventative maintenance cleanings and reduces chamber down-time by targeting the removal of the layers deposited on the interior surfaces of the chamber body and/or liner, as well as the process kit components. The cleaning process occurs while shielding the showerhead and a carrier plate from at least some of the cleaning gases used during the cleaning process. To prevent chemical attack of the layers already deposited on the surface of the showerhead, and to prevent poisoning of the layers deposited after performing the cleaning process, the showerhead and the carrier plate are shielded from the cleaning gas by delivering an inert gas through the showerhead and across the surface of the carrier plate and/or cleaning plate during the cleaning.
摘要翻译：本发明的实施例包括从处理室例如MOCVD处理室的表面就地清洁沉积材料的方法。清洁过程增加了预防性维护清洁之间的时间，并通过针对去除沉积在腔室主体和/或衬里的内表面上的层以及处理套件组件来减少腔室停机时间。清洁过程发生的同时将喷头和承载板与清洁过程中使用的至少一些清洁气体隔离。为了防止已经沉积在喷头表面上的层的化学侵蚀，并且为了防止在执行清洁过程之后沉积的层的中毒，通过将惰性气体输送通过喷头来将喷头和承载板与清洁气体隔离并且在清洁期间越过承载板和/或清洁板的表面。

4. 发明申请

WO2007121177A3 PLANARIZATION OF SUBSTRATES AT A HIGH POLISHING RATE USING ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：使用电化学机械抛光在高抛光速率下对基板进行平面化
公开(公告)号：WO2007121177A3
公开(公告)日：2007-12-21
申请号：PCT/US2007066329
申请日：2007-04-10
申请人： APPLIED MATERIALS INC , DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
发明人： DUBOUST ALAIN , HSU WEI-YUNG , LIU FENG Q , WANG YAN , WANG ZHIHONG , ECONOMIKOS LAERTIS
IPC分类号： B24B1/00 , B24B7/19
CPC分类号： B23H5/08 , B24B37/042 , C25D11/34 , C25F1/04 , H01L21/32125
摘要： A method and apparatus for removing conductive material from a substrate surface are provided. In one embodiment, a method is provided for electrochemical mechanical polishing of a substrate. A substrate comprising dielectric feature definitions, a barrier material disposed on the feature definitions, and a bulk conductive material in an amount sufficient to fill the feature definitions is provided. The substrate is exposed to an electrolyte solution. A passivation layer is formed on the conductive material. The passivation strength of the passivation layer is increased by polishing the substrate with a first voltage for a first time period. The substrate is polished with a second voltage higher than the first voltage for a second time period. Conductive material is removed from at least a portion of the substrate surface by anodic dissolution.
摘要翻译：提供了用于从基板表面去除导电材料的方法和装置。在一个实施例中，提供了一种用于衬底的电化学机械抛光的方法。提供了包括介电特征定义的基板，设置在特征定义上的阻挡材料以及足以填充特征定义的量的体导电材料。将基底暴露于电解质溶液。在导电材料上形成钝化层。通过用第一时间段的第一电压抛光衬底来增加钝化层的钝化强度。在第二时间段内以比第一电压高的第二电压来抛光衬底。通过阳极溶解从导电材料的至少一部分去除导电材料。

5. 发明申请

WO2007019279A3 METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光底物的方法和组合物
公开(公告)号：WO2007019279A3
公开(公告)日：2007-05-10
申请号：PCT/US2006030381
申请日：2006-08-03
申请人： APPLIED MATERIALS INC , LIU FENG Q , DU TIANBAO , DUBOUST ALAIN , WANG YAN , HU YONGQI , TSAI STAN D , CHEN LIANG-YUH , TU WEN-CHIANG , HSU WEI-YUNG
发明人： LIU FENG Q , DU TIANBAO , DUBOUST ALAIN , WANG YAN , HU YONGQI , TSAI STAN D , CHEN LIANG-YUH , TU WEN-CHIANG , HSU WEI-YUNG
IPC分类号： B23H5/06 , B23H5/08
CPC分类号： B23H5/08 , B24B37/042 , C25F3/02 , H01L21/32125 , H01L21/6875 , H01L21/7684
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及然后用至少一种化学机械抛光技术研磨衬底。

6. 发明申请

WO2011056900A3 MULTI-WAVELENGTH LASER-SCRIBING TOOL 审中-公开
标题翻译：多波长激光切割工具
公开(公告)号：WO2011056900A3
公开(公告)日：2011-09-29
申请号：PCT/US2010055335
申请日：2010-11-03
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , HSU WEI-YUNG , THOTHADRI MANIVANNAN , YASUDA ARTHUR K
发明人： MANENS ANTOINE P , HSU WEI-YUNG , THOTHADRI MANIVANNAN , YASUDA ARTHUR K
IPC分类号： B23K26/36 , B23K26/08 , B23K26/42 , H01L31/18 , H01S3/10
CPC分类号： B23K26/083 , B23K26/0622 , B23K26/0676 , B23K26/082 , B23K26/364
摘要： Multi-wavelength laser-scribing systems are disclosed. A system for scribing a workpiece includes a frame, a translation stage coupled with the frame to support the workpiece and translate the supported workpiece relative to the frame in a longitudinal direction, at least one laser operable to generate a first output having a first wavelength and generate a second output having a second wavelength, and at least one scanning device coupled with the frame and operable to control a position of the first and second outputs. Each of the first and second outputs are able to remove material from at least a portion of the workpiece. Laser assemblies that each include a laser and at least one scanning device can be arranged in rows to enhance the rate at which latitudinal scribe lines are formed.
摘要翻译：公开了多波长激光刻划系统。用于划片工件的系统包括框架，与框架连接以支撑工件并且使支撑的工件相对于框架沿纵向平移的至少一个激光器，可操作以产生具有第一波长的第一输出的移动台和产生具有第二波长的第二输出，以及至少一个扫描装置，与所述框架耦合并可操作以控制所述第一和第二输出的位置。第一和第二输出中的每一个都能够从工件的至少一部分去除材料。每个包括激光器和至少一个扫描装置的激光器组件可以排列成行，以提高形成纬向划线的速率。

7. 发明申请

WO2011017570A3 IN-LINE METROLOGY METHODS AND SYSTEMS FOR SOLAR CELL FABRICATION 审中-公开
标题翻译：用于太阳能电池制造的在线计量方法和系统
公开(公告)号：WO2011017570A3
公开(公告)日：2011-06-16
申请号：PCT/US2010044618
申请日：2010-08-05
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , SHIU TING-RUEI , SHAMOUN BASSAM , HSU WEI-YUNG , THOTHADRI MANIVANNAN
发明人： MANENS ANTOINE P , SHIU TING-RUEI , SHAMOUN BASSAM , HSU WEI-YUNG , THOTHADRI MANIVANNAN
IPC分类号： H01L31/18 , B23K26/36 , H01L31/042 , H01S3/10
CPC分类号： B23K26/048 , B23K26/032 , B23K26/0673 , B23K26/082 , B23K26/083 , B23K26/364 , B23K26/40 , B23K26/705 , B23K2203/172 , H01L31/046 , H01L31/0463 , Y02E10/50
摘要： In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.
摘要翻译：公开了用于在太阳能电池制造中使用的激光划线系统的在线测量方法和系统。这样的方法和系统可以涉及各种组件，例如用于测量输入到激光器的功率量的设备，用于测量激光输出功率的功率计，用于测量激光束方面的光束观测器，高度传感器用于测量工件高度的显微镜，用于测量由激光刻划系统形成的工件特征的显微镜，以及用于监视激光划线系统并在操作限制时发出警告和/或错误消息的系统超标。在线测量方法还可以包括输出光束反射的处理，以跟踪随着时间的光束漂移和/或提供成像设备的聚焦。

8. 发明申请

WO2009140239A2 IN-SITU MONITORING FOR LASER ABLATION 审中-公开
标题翻译：用于激光雷射的现场监测
公开(公告)号：WO2009140239A2
公开(公告)日：2009-11-19
申请号：PCT/US2009043554
申请日：2009-05-12
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , HSU WEI-YUNG
发明人： MANENS ANTOINE P , HSU WEI-YUNG
IPC分类号： G01N21/25 , B23K26/00 , G01N21/27
CPC分类号： G01N21/718 , B23K26/03 , B23K26/40 , B23K2203/172
摘要： In a system where scribe lines are formed by a series of partially-overlapping ablation spots (300, 1106), discontinuities (502, 552) can be detected by capturing an intensity of light (706, 708, 710) generated during each instance of ablation for a respective spot. In any instance where the intensity of light (708) given off falls below a desired threshold, such that the ablation spot might not sufficiently overlap any adjacent spot, the position of that instance can be captured such that another attempt at ablation can be carried out at that location.
摘要翻译：在通过一系列部分重叠的消融点（300,1106）形成划痕线的系统中，可以通过捕获在每个实例中产生的光强度（706,708,710）来检测不连续性（502,552）消融各个点。在任何情况下，放出的光（708）的强度都低于期望的阈值，使得消融点可能不会与任何相邻的斑点充分重叠，可以捕获该实例的位置，从而可以进行另一次消融尝试在那个地方。

9. 发明申请

WO2009137764A3 CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM 审中-公开
标题翻译： CMP PAD厚度和型材监控系统
公开(公告)号：WO2009137764A3
公开(公告)日：2010-02-25
申请号：PCT/US2009043288
申请日：2009-05-08
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , HSU WEI-YUNG , M SAAD HICHEM
发明人： MANENS ANTOINE P , HSU WEI-YUNG , M SAAD HICHEM
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B53/017 , B24B37/042 , B24B53/12
摘要： In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.
摘要翻译：在一个实施例中，提供了一种用于维持基板处理表面的方法。该方法通常包括在衬底处理表面上执行一组测量，其中使用耦合到处理表面调节臂的位移传感器获取测量集合，基于该组测量确定处理表面轮廓，将处理表面简档到最小配置文件阈值，并传达配置文件比较的结果。

10. 发明申请

WO2010059595A3 LASER-SCRIBING TOOL ARCHITECTURE 审中-公开
标题翻译：激光切割工具架构
公开(公告)号：WO2010059595A3
公开(公告)日：2010-08-12
申请号：PCT/US2009064720
申请日：2009-11-17
申请人： APPLIED MATERIALS INC , MANENS ANTOINE P , HSU WEI-YUNG
发明人： MANENS ANTOINE P , HSU WEI-YUNG
IPC分类号： H01L21/78 , H01L31/042
CPC分类号： B23K26/082 , B23K26/702
摘要： The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus (30, 60) includes a frame, a first fixture (32) coupled with the frame, a second fixture (34) coupled with the frame, a laser (96, 100) operable to generate output able to remove material from at least a portion of the workpiece (36), and a scanning device (106) coupled with the laser (96, 100) and the frame. The first fixture (32) is configured for engagement with a first portion of the workpiece (36). The second fixture (34) is configured for engagement with a second portion of the workpiece (36). When the workpiece (36) is engaged by the first and second fixtures the workpiece (36) is substantially vertically oriented. The scanning device (106) is operable to control a position of the output from the laser (96, 100) relative to the workpiece (36).
摘要翻译：本公开涉及用于激光划线垂直取向的工件的装置和系统。在许多实施例中，激光划线装置（30,60）包括框架，与框架联接的第一固定装置（32），与框架联接的第二固定装置（34），可操作以产生输出能够从工件（36）的至少一部分移除材料，以及与激光（96,100）和框架耦合的扫描装置（106）。第一夹具（32）构造成与工件（36）的第一部分接合。第二夹具（34）构造成与工件（36）的第二部分接合。当工件（36）被第一和第二固定件接合时，工件（36）基本垂直定向。扫描装置（106）可操作以控制来自激光器（96,100）的输出相对于工件（36）的位置。

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