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1. 发明申请

WO2014100413A1 APPARATUS AND METHODS FOR SYMMETRICAL GAS DISTRIBUTION WITH HIGH PURGE EFFICIENCY 审中-公开
标题翻译：具有高效率的对称气体分配的装置和方法
公开(公告)号：WO2014100413A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/076560
申请日：2013-12-19
申请人： APPLIED MATERIALS, INC. , KAO, Chien-Teh , CHANG, Mei , LAM, Hyman , HUSTON, Joel M. , YUAN, Xiaoxiong , CUVALCI, Olkan
发明人： KAO, Chien-Teh , CHANG, Mei , LAM, Hyman , HUSTON, Joel M. , YUAN, Xiaoxiong , CUVALCI, Olkan
IPC分类号： C23C16/455
CPC分类号： C23C16/45565 , C23C16/45536 , C23C16/50
摘要： Provided are apparatus and methods for depositing materials by vapor deposition and plasma enhanced vapor deposition techniques, and more particularly a gas distribution assembly and vapor deposition chamber to deposit a material. The gas distribution assembly comprises a plurality of sections with each section containing a flow channel with passages extending from the flow channel to the processing region of a processing chamber.
摘要翻译：提供了通过气相沉积和等离子体增强气相沉积技术沉积材料的装置和方法，更具体地说，是用于沉积材料的气体分配组件和气相沉积室。气体分配组件包括多个部分，每个部分包含流道，流道从流动通道延伸到处理室的处理区域。

2. 发明申请

WO2014164743A1 HIGH TEMPERATURE PROCESS CHAMBER LID 审中-公开
标题翻译：高温过程室
公开(公告)号：WO2014164743A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/023377
申请日：2014-03-11
申请人： APPLIED MATERIALS, INC. , DURUKAN, Ilker , HUSTON, Joel M. , WU, Dien-Yeh , KAO, Chien-Teh , CHANG, Mei
发明人： DURUKAN, Ilker , HUSTON, Joel M. , WU, Dien-Yeh , KAO, Chien-Teh , CHANG, Mei
IPC分类号： C23C16/00 , C23C16/44 , H01L21/205
CPC分类号： H01L21/67126 , H01L21/6719
摘要： Lid assemblies for processing chamber and processing chambers including the lid assemblies are described. The lid assemblies include a high temperature lid module and a housing. The high temperature lid module being positioned adjacent a process liner of a processing chamber. The flexible housing positioned around the high temperature lid module and joined to the high temperature lid module with an elastomeric ring.
摘要翻译：描述了包括盖组件的处理室和处理室的盖组件。盖组件包括高温盖模块和壳体。高温盖模块位于处理室的处理衬垫附近。柔性壳体围绕高温盖模块定位，并与弹性体环连接到高温盖模块。

3. 发明申请

WO2019055406A1 SUBSTRATE SUPPORT FOR REDUCED DAMAGE SUBSTRATE BACKSIDE 审中-公开
公开(公告)号：WO2019055406A1
公开(公告)日：2019-03-21
申请号：PCT/US2018/050446
申请日：2018-09-11
申请人： APPLIED MATERIALS, INC.
发明人： HUSTON, Joel M. , TSAI, Cheng-Hsiung , TZU, Gwo-Chuan
IPC分类号： H01L21/683 , H01L21/67
摘要： Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body having a first surface; one or more receptacles extending through the first surface and into the support body; and one or more protrusions respectively disposed within corresponding ones of the one or more receptacles and projecting from the first surface, wherein the one or more protrusions at least partially define a substantially planar support surface above the first surface. Methods of eliminating back-side wafer damage are also disclosed.

4. 发明申请

WO2015084825A1 METHODS AND APPARATUS FOR IN-SITU CLEANING OF A PROCESS CHAMBER 审中-公开
标题翻译：过程室内现场清洁的方法和装置
公开(公告)号：WO2015084825A1
公开(公告)日：2015-06-11
申请号：PCT/US2014/068124
申请日：2014-12-02
申请人： APPLIED MATERIALS, INC.
发明人： HUSTON, Joel M. , DENNY, Nicholas R. , KAO, Chien-Teh
IPC分类号： C23C16/44 , C23C16/56
CPC分类号： C23C16/4405 , C23C16/45502 , H01J37/3244 , H01J37/32834 , H01J37/32862 , H01L21/67017
摘要： Methods and apparatus for in-situ cleaning of substrate processing chambers are provided herein. A substrate processing chamber may include a chamber body enclosing an inner volume; a chamber lid removably coupled to the chamber body and including a first flow channel fluidly coupled to the inner volume to selectively open or seal the inner volume to or from a first outlet; a chamber floor including a second flow channel fluidly coupled to the inner volume to selectively open or seal the inner volume to or from a first inlet; and a pump ring disposed in and in fluid communication with the inner volume, the pump ring comprising an upper chamber fluidly coupled to a lower chamber, and a second outlet fluidly coupled to the lower chamber to selectively open or seal the inner volume to or from the second outlet.
摘要翻译：本文提供了用于原位清洗基板处理室的方法和装置。衬底处理室可以包括包围内部容积的室主体; 腔室盖，其可移除地联接到腔室主体并且包括流体地联接到内部容积的第一流动通道，以选择性地将内部容积打开或密封到第一出口或从第一出口密封; 室底板，其包括流体地联接到内部容积的第二流动通道，以选择性地将内部容积打开或密封到第一入口或从第一入口密封; 以及设置在所述内部容积中且与所述内部容积流体连通的泵环，所述泵环包括流体地联接到下部室的上部腔室，以及流体地联接到所述下部腔室的第二出口，以选择性地将所述内部容积打开或密封第二个出口。

5. 发明申请

WO2014078033A1 MODULAR CHEMICAL DELIVERY SYSTEM 审中-公开
标题翻译：模块化学输送系统
公开(公告)号：WO2014078033A1
公开(公告)日：2014-05-22
申请号：PCT/US2013/066366
申请日：2013-10-23
申请人： APPLIED MATERIALS, INC.
发明人： KAO, Chien-Teh , CHANG, Mei , LAM, Hyman W. H. , CHANG, Yu , HUSTON, Joel M. , CUVALCI, Olkan
IPC分类号： H01L21/02
CPC分类号： H01L21/67017 , Y10T137/8593
摘要： In some embodiments, a modular chemical delivery system may include a plurality of gas delivery units directly and removably coupled to each other, wherein each gas delivery unit includes a body with a first volume, a plurality of gas sticks disposed in the first volume, wherein each of the plurality of gas sticks is configured to be coupled to at least one gas supply through one or more inlets in the body, a plurality of valves disposed in the first volume, each valve respectively disposed in line with a corresponding one of the at least one gas supply, at least one outlet conduit to deliver at least one process gas to one or more gas delivery zones in a process chamber, and an electrical controller disposed in the first volume and configured to control the plurality of gas sticks and the plurality of valves.
摘要翻译：在一些实施例中，模块化化学物质输送系统可以包括直接和可移除地彼此耦合的多个气体输送单元，其中每个气体输送单元包括具有第一体积的体，设置在第一体积中的多个气棒，其中多个气棒中的每一个被构造成通过主体中的一个或多个入口连接到至少一个气体供给装置，多个阀设置在第一容积中，每个阀分别设置成与相应的一个气体至少一个气体供应源，至少一个出口管道，用于将至少一个处理气体输送到处理室中的一个或多个气体输送区域;以及电控制器，其布置在第一体积中并且被配置为控制多个气棒和多个气体的阀门。

6. 发明申请

WO2019055172A1 SUBSTRATE PROCESSING CHAMBER HAVING HEATED SHOWERHEAD ASSEMBLY 审中-公开
公开(公告)号：WO2019055172A1
公开(公告)日：2019-03-21
申请号：PCT/US2018/047161
申请日：2018-08-21
申请人： APPLIED MATERIALS, INC.
发明人： GUNGOR, Faruk , WU, Dien-Yeh , HUSTON, Joel M. , CHANG, Mei , YUAN, Xiaoxiong , DAITO, Kazuya , GELATOS, Avgerinos V. , KURATOMI, Takashi , CHANG, Yu , CAO, Bin
IPC分类号： H01L21/67 , C23C16/44 , H01L21/02 , H05H1/46
摘要： Apparatus for processing a substrate are provided herein. In some embodiments a showerhead assembly includes a gas distribution plate having a plurality of apertures; a holder having a wall, an radially inwardly extending flange extending from a lower portion of the wall and coupled to the gas distribution plate, and a radially outwardly extending flange extending from an upper portion of the wall, wherein the wall has a thickness between about 0.015 inches and about 0.2 inches; and a heating apparatus disposed above and spaced apart from the gas distribution plate, wherein the heating apparatus includes a heater configured to heat the gas distribution plate.

7. 发明申请

WO2015030947A1 HOT WALL REACTOR WITH COOLED VACUUM CONTAINMENT 审中-公开
标题翻译：具有冷却真空容器的热壁反应器
公开(公告)号：WO2015030947A1
公开(公告)日：2015-03-05
申请号：PCT/US2014/047126
申请日：2014-07-18
申请人： APPLIED MATERIALS, INC.
发明人： HUSTON, Joel M. , CUVALCI, Olkan , KARAZIM, Michael P. , YUDOVSKY, Joseph
IPC分类号： H01L21/02 , H01L21/324 , H01L21/683
CPC分类号： H01J37/32477 , C23C16/4401 , C23C16/4408 , C23C16/4409 , C23C16/45519 , C23C16/45521 , C23C16/46 , H01J37/32513 , H01J37/32522 , H01J37/32724
摘要： Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.
摘要翻译：本文提供了处理基板的方法和装置。在一些实施例中，用于处理衬底的设备包括包围处理容积的室主体，室主体包括室底板，耦合到室底板的室壁，以及可移除地联接到室壁的室盖，其中至少一个室壁和腔室盖包括用于热控制介质流动的通道; 设置在与室底板相邻并间隔开的加热板; 套筒邻近并与室壁间隔开设置，套筒由加热板支撑; 以及设置在所述室壁和所述室盖之间的第一界面处的第一密封元件。

8. 发明申请

WO2014120456A1 SUBSTRATE SUPPORT WITH CONTROLLED SEALING GAP 审中-公开
标题翻译：基板支持与控制密封GAP
公开(公告)号：WO2014120456A1
公开(公告)日：2014-08-07
申请号：PCT/US2014/011819
申请日：2014-01-16
申请人： APPLIED MATERIALS, INC.
发明人： CUVALCI, Olkan , HUSTON, Joel M. , TZU, Gwo-Chuan
IPC分类号： H01L21/683 , H01L21/205
CPC分类号： H01L21/6838 , B25B11/005 , H01L21/67126 , H01L21/6875
摘要： Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of plurality of first support elements.
摘要翻译：本文提供了基板支撑件的实施例。在一些实施例中，衬底支撑件可以包括具有支撑表面的支撑板，支撑板具有支撑表面以支撑衬底;支撑环，用于在支撑表面的周边支撑衬底; 以及设置在所述支撑环中的多个第一支撑元件，其中每个所述第一支撑元件的端部在所述支撑环的上表面上方升高，以在所述支撑环的上表面和假想平面之间形成间隙设置在多个第一支撑元件的端部上。

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