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1. 发明申请

WO2006076248A1 PATTERNED WAFER THICKNESS DETECTION SYSTEM 审中-公开
标题翻译：图形厚度检测系统
公开(公告)号：WO2006076248A1
公开(公告)日：2006-07-20
申请号：PCT/US2006/000573
申请日：2006-01-09
申请人： APPLIED MATERIALS, INC. , GU, Yuping , BIRANG, Manoocher , SHANMUGASUNDRAM, Arulkumar , LUBOMIRSKY, Dmitry , STEVENS, Joseph, J.
发明人： GU, Yuping , BIRANG, Manoocher , SHANMUGASUNDRAM, Arulkumar , LUBOMIRSKY, Dmitry , STEVENS, Joseph, J.
IPC分类号： G01B11/06 , C23C18/16
CPC分类号： G01B11/0683 , C23C18/1632 , C23C18/1675 , G01N21/55 , G01N21/9501
摘要： An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate is provided. In one embodiment, the detected end of an electroless deposition process step is measured while the substrate is rotated relative to the detection mechanism. In another embodiment, a detection mechanism, which is proximate to the processing region, directs electromagnetic radiation onto a substrate surface, which is then reflected by features on the substrate surface and is detected by the detection mechanism. In one aspect, the angle of the directed electromagnetic radiation is perpendicular to the surface of the substrate and the shape of the directed electromagnetic radiation spot is substantially circular in shape.
摘要翻译：提供了一种通过将电磁辐射引导到衬底的表面并检测在衬底的表面上被反射的特征的一个或多个波长处的电磁辐射的强度变化来控制无电沉积工艺的装置和方法。在一个实施例中，在基板相对于检测机构旋转的同时测量无电沉积工艺步骤的检测结束。在另一个实施例中，靠近处理区域的检测机构将电磁辐射引导到衬底表面上，然后其被衬底表面上的特征反射并被检测机构检测。一方面，定向电磁辐射的角度垂直于衬底的表面，并且定向电磁辐射光斑的形状基本上是圆形的。

2. 发明申请

WO2007016218A3 INTEGRATED ELECTROLESS DEPOSITION SYSTEM 审中-公开
公开(公告)号：WO2007016218A3
公开(公告)日：2007-02-08
申请号：PCT/US2006/029137
申请日：2006-07-28
申请人： APPLIED MATERIALS, INC. , LUBOMIRSKY, Dmitry , SHANMUGASUNDRAM, Arulkumar , D'AMBRA, Allen , WEIDMAN, Timothy W. , STEWART, Michael P. , RABINOVICH, Eugene , SHERMAN, Svetlana , BIRANG, Manoocher , WANG, Yaxin , YANG, Michael X. , HANSEN, Bradley
发明人： LUBOMIRSKY, Dmitry , SHANMUGASUNDRAM, Arulkumar , D'AMBRA, Allen , WEIDMAN, Timothy W. , STEWART, Michael P. , RABINOVICH, Eugene , SHERMAN, Svetlana , BIRANG, Manoocher , WANG, Yaxin , YANG, Michael X. , HANSEN, Bradley
IPC分类号： C23C16/00 , C23C18/18 , C23C18/31 , C23C18/40 , C23C28/00 , H05H1/24 , B05C3/00
摘要： Embodiments of the invention provide methods for depositing a material onto a surface of a substrate (120) by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method of depositing a seed layer (129) on a substrate (120) with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer (129) on a substrate (120), fill interconnect features on a substrate (120), or sequentially deposit both a seed layer (129) and fill interconnect features on the substrate (120). One embodiment provides a method for forming a capping layer over substrate interconnects. Embodiments further provide a cluster tool (200) configured to deposit a material onto a substrate surface by using one or more electroless (202, 204), electrochemical plating (210, 212), CVD and/or ALD processing chambers (235). In one aspect, a ruthenium-containing catalytic layer is formed.

3. 发明申请

WO2005028705A1 APPARATUS AND METHOD OF DETECTING THE ELECTROLESS DEPOSITION ENDPOINT 审中-公开
标题翻译：检测电沉积端点的装置和方法
公开(公告)号：WO2005028705A1
公开(公告)日：2005-03-31
申请号：PCT/US2004/030444
申请日：2004-09-17
申请人： APPLIED MATERIALS, INC. , SHANMUGASUNDRAM, Arulkumar , BIRANG, Manoocher , PANCHAM, Ian, A. , LOPATIN, Sergey
发明人： SHANMUGASUNDRAM, Arulkumar , BIRANG, Manoocher , PANCHAM, Ian, A. , LOPATIN, Sergey
IPC分类号： C23C18/16
CPC分类号： C23C18/1667 , C23C18/1651 , C23C18/1675 , G01B11/0683 , G01N21/8422 , G01N21/9501
摘要： An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate. In one embodiment the detected end of an electroless deposition process step is measured while the substrate is moved relative to the detection mechanism. In another embodiment multiple detection points are used to monitor the state of the deposition process across the surface of the substrate. In one embodiment the detection mechanism is immersed in the electroless deposition fluid on the substrate. In one embodiment a controller is used to monitor, store, and/or control the electroless deposition process by use of stored process values, comparison of data collected at different times, and various calculated time dependent data.
摘要翻译：通过将电磁辐射引导到衬底的表面并检测在基底表面上的特征反射的一个或多个波长处的电磁辐射的强度变化来控制无电沉积工艺的装置和方法。在一个实施例中，在基板相对于检测机构移动时测量无电沉积工艺步骤的检测结束。在另一个实施方案中，多个检测点用于监测穿过基底表面的沉积工艺的状态。在一个实施例中，检测机构浸没在基板上的无电沉积流体中。在一个实施例中，控制器用于通过使用存储的过程值，在不同时间收集的数据的比较以及各种计算的时间相关数据来监视，存储和/或控制无电沉积过程。

4. 发明申请

WO2006091937A2 AUXILIARY ELECTRODE ENCASED IN CATION EXCHANGE MEMBRANE TUBE FOR ELECTROPLATING CELL 审中-公开
标题翻译：辅助电极用于电镀细胞的交换膜管
公开(公告)号：WO2006091937A2
公开(公告)日：2006-08-31
申请号：PCT/US2006/006839
申请日：2006-02-24
申请人： APPLIED MATERIALS, INC. , SINGH, Saravjeet , HAFEZI, Hooman , BIRANG, Manoocher , ROSENFELD, Aron , BEHNKE, Joseph
发明人： SINGH, Saravjeet , HAFEZI, Hooman , BIRANG, Manoocher , ROSENFELD, Aron , BEHNKE, Joseph
IPC分类号： C25D5/18
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的被包围的辅助电极组件。被封装的辅助电极组件通常包括设置在保护管中的辅助电极。

5. 发明申请

WO2006127320A2 ELECTROPLATING APPARATUS BASED ON AN ARRAY OF ANODES 审中-公开
标题翻译：基于阳极阵列的电镀设备
公开(公告)号：WO2006127320A2
公开(公告)日：2006-11-30
申请号：PCT/US2006/018792
申请日：2006-05-16
申请人： APPLIED MATERIALS, INC. , SINGH, Saravjet , BIRANG, Manoocher , KOVARSKY, Nicolay , ROSENFELD, Aron
发明人： SINGH, Saravjet , BIRANG, Manoocher , KOVARSKY, Nicolay , ROSENFELD, Aron
IPC分类号： C25D3/02
CPC分类号： C25D17/12 , C25D17/10 , H01L21/2885 , Y10S204/07
摘要： The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
摘要翻译：本发明一般涉及在基片上镀敷导电材料的装置和方法。本发明的一个实施例提供一种用于在基板上镀覆导电材料的装置。该装置包括被配置为保持电解质的流体池，被配置为支撑基板并且电连接基板的接触环以及设置在流体槽中的阳极组件，其中阳极组件包括排成行的多个阳极元件。

6. 发明申请

WO2005043132A1 POLISHING ENDPOINT DETECTION SYSTEM AND METHOD USING FRICTION SENSOR 审中-公开
标题翻译：抛光端点检测系统和使用摩擦传感器的方法
公开(公告)号：WO2005043132A1
公开(公告)日：2005-05-12
申请号：PCT/US2004/036412
申请日：2004-10-28
申请人： APPLIED MATERIALS, INC.
发明人： MILLER, Gabriel, Lorimer , BIRANG, Manoocher , JOHANNSON, Nils , SWEDEK, Boguslaw, A. , BENVEGNU, Dominic, J.
IPC分类号： G01N19/02
CPC分类号： B24B37/013 , B24B37/042 , B24B49/16 , G01N19/02
摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
摘要翻译：描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。顶表面的至少一部分与抛光表面基本共面。提供传感器以测量基板接触构件的横向位移。一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。

7. 发明申请

WO2002087825A1 INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING 审中-公开
标题翻译：具有光和电流监测的集成端点检测系统
公开(公告)号：WO2002087825A1
公开(公告)日：2002-11-07
申请号：PCT/US2002/014281
申请日：2002-05-02
申请人： APPLIED MATERIALS, INC.
发明人： SWEDEK, Boguslaw, A. , BIRANG, Manoocher , JOHANSSON, Nils
IPC分类号： B24B37/04
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus (20) and method can use an eddy current monitoring system (40) and an optical monitoring system (140). Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad (30) can be calculated. The eddy current monitoring system (40) and optical monitoring system (140) can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置（20）和方法可以使用涡流监测系统（40）和光学监测系统（140）。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫（30）的厚度。涡流监测系统（40）和光学监测系统（140）可以测量基板上基本相同的位置。

8. 发明申请

WO1995020838A1 ELECTROSTATIC CHUCK WITH CONFORMAL INSULATOR FILM 审中-公开
标题翻译：具有合格绝缘膜的静电卡盘
公开(公告)号：WO1995020838A1
公开(公告)日：1995-08-03
申请号：PCT/US1995001355
申请日：1995-01-31
申请人： APPLIED MATERIALS, INC.
发明人： APPLIED MATERIALS, INC. , SHAMOUILIAN, Shamouil , SOMEKH, Sasson , LEVINSTEIN, Hyman , BIRANG, Manoocher , SHERSTINSKY, Semyon , CAMERON, John, F.
IPC分类号： H02N13/00
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00
摘要： An electrostatic chuck (20) for holding a substrate (75) comprises (i) a base (80) having an upper surface (95) with grooves (85) therein, the grooves (85) sized and distributed for holding coolant for cooling a substrate (75), and (ii) a substantially continuous insulator film (45) conformal to the grooves (85) on upper surface (95) of the base (80). The base (80) can be electrically conductive and capable of serving as the electrode (50) of the chuck (20), or the electrode (50) can be embedded in the insulator film (45). The insulator film (45) has a dielectric breakdown strength sufficiently high that when a substrate (75) placed on the chuck (20) and electrically biased with respect to the electrode (50), electrostatic charge accumulates in the substrate (75) and in the electrode (50) forming an electrostatic force that attracts and holds the substrate (75) to the chuck (20). Preferably the chuck (20) is fabricated using a pressure forming process, and more preferably using a pressure differential process.
摘要翻译：用于保持基板（75）的静电卡盘（20）包括（i）具有在其中具有凹槽（85）的上表面（95）的基部（80），所述凹槽（85）的尺寸和分布以保持用于冷却的冷却剂衬底（75），和（ii）与基座（80）的上表面（95）上的凹槽（85）共形的基本上连续的绝缘膜（45）。基座（80）可以是导电的并且能够用作卡盘（20）的电极（50），或者电极（50）可以嵌入绝缘膜（45）中。绝缘体膜（45）具有足够高的绝缘击穿强度，当放置在卡盘（20）上并相对于电极（50）电偏置的基板（75）时，静电电荷积聚在基板（75）中所述电极（50）形成吸引并保持所述基板（75）到所述卡盘（20）的静电力。优选地，使用压力成形方法制造卡盘（20），更优选使用压差法。

9. 发明申请

WO2005013340A1 EDDY CURRENT SYSTEM FOR IN-SITU PROFILE MEASUREMENT 审中-公开
标题翻译：用于现场配置文件测量的EDDY电流系统
公开(公告)号：WO2005013340A1
公开(公告)日：2005-02-10
申请号：PCT/US2004/024405
申请日：2004-07-27
申请人： APPLIED MATERIALS, INC.
发明人： MILLER, Gabriel, Lorimer , SWEDEK, Boguslaw, A. , BIRANG, Manoocher
IPC分类号： H01L21/00
CPC分类号： B24B37/013 , B24B49/105 , G01B7/10 , H01L21/67253
摘要： An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
摘要翻译：涡流监视系统可以包括细长的核心。一个或多个线圈可以与细长铁芯耦合以产生可与晶片上的一个或多个导电区域耦合的振荡磁场。芯可以相对于晶片翻转以提供改善的分辨率，同时保持足够的信号强度。涡流监测系统可以包括用于产生谐振频率的振荡磁场的DC耦合边缘振荡器，其中谐振频率可能由于对一个或多个导电区域的改变而改变。涡流监视系统可用于实现实时配置文件控制。

10. 发明申请

WO1997022442A1 DETERMINING THE COEFFICIENT OF FRICTION OF A POLISHING PAD 审中-公开
标题翻译：确定抛光垫的摩擦系数
公开(公告)号：WO1997022442A1
公开(公告)日：1997-06-26
申请号：PCT/US1996019657
申请日：1996-12-12
申请人： APPLIED MATERIALS, INC.
发明人： APPLIED MATERIALS, INC. , BIRANG, Manoocher , PRINCE, John
IPC分类号： B24B53/00
CPC分类号： B24B37/013 , B24B49/02
摘要： An apparatus and method for determining the roughness of a polishing pad (14) for endpoint detection during pad conditioning by the measurement of a force related to the surface friction. The apparatus includes a floating head (34) having a bottom surface in contact with the polishing pad surface (14). A bracket (38) restrains the floating head (34), and a force sensing device senses a restraining force exerted by the bracket (38) on the floating head (34) and outputs a signal indicative of the restraining force, which is related to the frictional force. The frictional force is directly related to the surface roughness of the pad (14).
摘要翻译：一种用于通过测量与表面摩擦相关的力来确定用于在衬垫调节期间的端点检测的抛光垫（14）的粗糙度的装置和方法。该装置包括具有与抛光垫表面（14）接触的底表面的浮动头（34）。支架（38）限制浮动头（34），力感测装置感测由支架（38）施加在浮动头（34）上的约束力，并输出指示限制力的信号，该信号与摩擦力。摩擦力与垫（14）的表面粗糙度直接相关。

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