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1. 发明申请

WO2006076248A1 PATTERNED WAFER THICKNESS DETECTION SYSTEM 审中-公开
标题翻译：图形厚度检测系统
公开(公告)号：WO2006076248A1
公开(公告)日：2006-07-20
申请号：PCT/US2006/000573
申请日：2006-01-09
申请人： APPLIED MATERIALS, INC. , GU, Yuping , BIRANG, Manoocher , SHANMUGASUNDRAM, Arulkumar , LUBOMIRSKY, Dmitry , STEVENS, Joseph, J.
发明人： GU, Yuping , BIRANG, Manoocher , SHANMUGASUNDRAM, Arulkumar , LUBOMIRSKY, Dmitry , STEVENS, Joseph, J.
IPC分类号： G01B11/06 , C23C18/16
CPC分类号： G01B11/0683 , C23C18/1632 , C23C18/1675 , G01N21/55 , G01N21/9501
摘要： An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate is provided. In one embodiment, the detected end of an electroless deposition process step is measured while the substrate is rotated relative to the detection mechanism. In another embodiment, a detection mechanism, which is proximate to the processing region, directs electromagnetic radiation onto a substrate surface, which is then reflected by features on the substrate surface and is detected by the detection mechanism. In one aspect, the angle of the directed electromagnetic radiation is perpendicular to the surface of the substrate and the shape of the directed electromagnetic radiation spot is substantially circular in shape.
摘要翻译：提供了一种通过将电磁辐射引导到衬底的表面并检测在衬底的表面上被反射的特征的一个或多个波长处的电磁辐射的强度变化来控制无电沉积工艺的装置和方法。在一个实施例中，在基板相对于检测机构旋转的同时测量无电沉积工艺步骤的检测结束。在另一个实施例中，靠近处理区域的检测机构将电磁辐射引导到衬底表面上，然后其被衬底表面上的特征反射并被检测机构检测。一方面，定向电磁辐射的角度垂直于衬底的表面，并且定向电磁辐射光斑的形状基本上是圆形的。

2. 发明申请

WO2007082122A2 POLYALUMINUM CHLORIDE AND ALUMINUM CHLOROHYDRATE, PROCESSES AND COMPOSITIONS: HIGH-BASICITY AND ULTRA HIGH-BASICITY PRODUCTS 审中-公开
标题翻译：氯化铝和氯铝酸盐，工艺和组成：高碱性和超高分子产品
公开(公告)号：WO2007082122A2
公开(公告)日：2007-07-19
申请号：PCT/US2007/060073
申请日：2007-01-04
申请人： NEXT CHEM , PRATT, William, E. , STEVENS, Joseph, J.
发明人： PRATT, William, E. , STEVENS, Joseph, J.
CPC分类号： C01F7/56 , A61K8/26 , A61Q15/00 , B01D61/44 , C01B9/02 , C01G23/02 , C01G25/04 , C01G49/10
摘要： The invention relates generally to processes for the production of high- basicity and ultr- high basicity polyaluminum chlorides including aluminum chlorohydrate. The processes can produce products of a wide range of basicities and are particularly useful in producing high basicity products. The process can produce a wide range of solution concentrations and are particularly useful in producing high solution concentrations. The processes described generate high purity products, which are free of by-product salt(s). The processes described herein can also be utilized to produce enhanced efficacy polyaluminum chlorides including aluminum chlorohydrate. When compared to conventional processes for manufacturing these compounds the processes disclosed herein are unique in so far as the disclosed processes do not require aluminum metal as a starting material. The products of the processes are suitable in applications including water purification, catalysts, and antiperspirants. In addition, the invention is directed to the products prepared by the processes described herein.
摘要翻译：本发明一般涉及生产高碱度和超高碱性聚氯化铝的方法，包括氯化铝水合物。该工艺可生产各种碱性产品，特别适用于生产高碱度产品。该方法可产生大范围的溶液浓度，特别适用于生产高溶液浓度。所述方法产生不含副产物盐的高纯度产物。本文所述的方法也可用于产生包括氯化铝水合物的增强效力的聚氯化铝。与用于制造这些化合物的常规方法相比，本文公开的方法是独特的，只要所公开的方法不需要铝金属作为起始材料即可。该方法的产品适用于包括水净化，催化剂和止汗剂在内的应用。此外，本发明涉及通过本文所述方法制备的产品。

3. 发明申请

WO2007082123A2 POLYMETAL HYDROXYCHLORIDE PROCESSES AND COMPOSITIONS: ENHANCED EFFICACY ANTIPERSPIRANT SALT COMPOSITIONS 审中-公开
标题翻译：聚合羟基氯化物工艺和组合物：增强效能抗菌盐组合物
公开(公告)号：WO2007082123A2
公开(公告)日：2007-07-19
申请号：PCT/US2007/060074
申请日：2007-01-04
申请人： NEXT CHEM , PRATT, William, E. , STEVENS, Joseph, J.
发明人： PRATT, William, E. , STEVENS, Joseph, J.
CPC分类号： C01F7/56 , A61K8/26 , A61K8/28 , A61K8/44 , A61Q15/00 , B01D61/44 , C01B7/035 , C01G25/006 , C01P2002/87
摘要： The invention describes processes for the production of basic aluminum compounds, including aluminum chlorohydrate, basic zirconium compounds, and basic aluminum zirconium compounds. The process produces products of a wide range of basicities. The products formed by the present invention are comprised of low molecular weight species characteristic of enhanced efficacy antiperspirant salt compositions. The products of this process are suitable for use as water purification agents, as binders in catalyst applications, and in antiperspirant applications. In addition, the invention is directed to the products made by the disclosed process.
摘要翻译：本发明描述了生产碱性铝化合物的方法，包括氯化铝水合物，碱性锆化合物和碱性锆锆化合物。该过程产生广泛基础的产品。由本发明形成的产品由具有增强的功效止汗剂盐组合物特征的低分子量物质组成。该方法的产品适用于作为水净化剂，作为催化剂应用中的粘合剂和止汗剂应用。此外，本发明涉及通过公开的方法制造的产品。

4. 发明申请

WO2002029137A3 METHOD AND ASSOCIATED APPARATUS FOR TILTING A SUBSTRATE UPON ENTRY FOR METAL DEPOSITION 审中-公开
公开(公告)号：WO2002029137A3
公开(公告)日：2002-04-11
申请号：PCT/US2001/030058
申请日：2001-09-26
申请人： APPLIED MATERIALS,INC.
发明人： DORDI, Yezdi, N. , STEVENS, Joseph, J. , SUGARMAN, Michael, N.
IPC分类号： C25D7/12 , C25D21/00 , H05K3/24
摘要： An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

5. 发明申请

WO2003065423A2 ELECTROLESS DEPOSITION APPARATUS 审中-公开
标题翻译：电沉积装置
公开(公告)号：WO2003065423A2
公开(公告)日：2003-08-07
申请号：PCT/US2003/001753
申请日：2003-01-21
申请人： APPLIED MATERIALS, INC.
发明人： STEVENS, Joseph, J. , LUBOMIRSKY, Dmitry , PANCHAM, Ian , OLGADO, Donald, J. , GRUNES, Howard, E. , MOK, Yeuk-Fai, Edwin
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , C23C18/1607 , C23C18/1619 , C23C18/1628 , C23C18/165 , C23C18/1653 , C23C18/1678 , C25D7/123 , C25D17/001
摘要： An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, and alloys/combinations thereof, into sub-micron features formed on a substrate. Exemplary metals include palladium, platinum, cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a "patch" of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material may be deposited over the catalytic layer, by an electroless process, for example. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.
摘要翻译：将包含选自贵金属，半贵金属及其合金/组合的至少一种金属的催化剂层沉积到形成在基底上的亚微米特征中的装置和方法。示例性的金属包括钯，铂，钴，镍和钨。可通过无电沉积，电镀或化学气相沉积来沉积催化层。在一个实施方案中，催化层可以沉积在特征中以用作随后沉积的导电材料的阻挡层。在另一个实施方案中，催化剂层可以沉积在阻挡层上。在另一个实施方案中，催化层可以沉积在沉积在阻挡层上的种子层上，以充当种子层中任何不连续性的“贴片”。一旦已经沉积了催化剂层，例如，可以通过无电镀方法在催化剂层上沉积导电材料。在另一个实施方案中，导电材料通过无电沉积，随后电镀或化学气相沉积沉积在催化剂层上。在另一个实施例中，导电材料通过电镀或化学气相沉积沉积在催化层上。

6. 发明申请

WO2003057943A3 ELECTROLESS PLATING SYSTEM 审中-公开
公开(公告)号：WO2003057943A3
公开(公告)日：2003-07-17
申请号：PCT/US2002/040631
申请日：2002-12-20
申请人： APPLIED MATERIALS, INC.
发明人： STEVENS, Joseph, J. , LUBOMIRSKY, Dmitry , PANCHAM, Ian , OLGADO, Donald, J. , GRUNES, Howard, J. , MOK, Yeuk-Fai, Edwin , DIXIT, Girish
IPC分类号： C23C18/16
摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.

7. 发明申请

WO2003057943A2 ELECTROLESS PLATING SYSTEM 审中-公开
标题翻译：电镀系统
公开(公告)号：WO2003057943A2
公开(公告)日：2003-07-17
申请号：PCT/US2002/040631
申请日：2002-12-20
申请人： APPLIED MATERIALS, INC.
发明人： STEVENS, Joseph, J. , LUBOMIRSKY, Dmitry , PANCHAM, Ian , OLGADO, Donald, J. , GRUNES, Howard, J. , MOK, Yeuk-Fai, Edwin , DIXIT, Girish
IPC分类号： C23C18/16
CPC分类号： H01L21/67167 , C23C18/1632 , C23C18/1692 , H01L21/6723
摘要： A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.
摘要翻译：一种用于电镀基板的方法和装置，其中所述装置包括具有至少一个基板传送机器人的中央基板传送外壳。提供与中心基板传送外壳连通的基板激活室，并且可由至少一个基板传送机器人访问。提供与中心基板传送外壳连通的基板电镀室，并且可由至少一个基板传送机器人访问。提供与中央基板传送外壳连通的基板旋转漂洗干燥室，并且可由至少一个基板传送机器人访问，并且提供与中央基板传送外壳连通的退火室，并且可由至少一个基板传送机器人。还提供了至少一个与基板传送室连通并且可由至少一个基板传送机器人访问的基板盒装载器。

8. 发明申请

WO2003065423A3 ELECTROLESS DEPOSITION APPARATUS AND METHOD 审中-公开
公开(公告)号：WO2003065423A3
公开(公告)日：2003-08-07
申请号：PCT/US2003/001753
申请日：2003-01-21
申请人： APPLIED MATERIALS, INC.
发明人： STEVENS, Joseph, J. , LUBOMIRSKY, Dmitry , PANCHAM, Ian , OLGADO, Donald, J. , GRUNES, Howard, E. , MOK, Yeuk-Fai, Edwin
IPC分类号： H01L21/00
摘要： An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, and alloys/combinations thereof, into sub-micron features formed on a substrate. Exemplary metals include palladium, platinum, cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a "patch" of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material may be deposited over the catalytic layer, by an electroless process, for example. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.

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