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1. 发明申请

WO2005083752A2 CONTAMINANT REDUCING SUBSTRATE TRANSPORT AND SUPPORT SYSTEM 审中-公开
标题翻译：污染物减少基板运输和支持系统
公开(公告)号：WO2005083752A2
公开(公告)日：2005-09-09
申请号：PCT/US2005/005672
申请日：2005-02-23
申请人： APPLIED MATERIALS, INC. , PARKHE, Vijay, D. , LEOPOLD, Matthew , RONAN, Timothy , MARTIN, Todd, W. , NG, Edward , KHURANA, Nitin , SUH, Song-Moon , FAY, Richard , HAGERTY, Christopher , RICE, Michael , ANGELO, Darryl , AHMAN, Kurt, J. , TSAI, Matthew, C. , SANSONI, Steve
发明人： PARKHE, Vijay, D. , LEOPOLD, Matthew , RONAN, Timothy , MARTIN, Todd, W. , NG, Edward , KHURANA, Nitin , SUH, Song-Moon , FAY, Richard , HAGERTY, Christopher , RICE, Michael , ANGELO, Darryl , AHMAN, Kurt, J. , TSAI, Matthew, C. , SANSONI, Steve
IPC分类号： H01L21/00
CPC分类号： C23C16/463 , H01L21/6831 , H01L21/6875 , H01L21/68757 , Y10T279/23
摘要： A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon. In another version, contamination of substrate is reduced by providing a substrate lifting assembly having a pair of arcuate fins with raised protrusions to support the substrates.
摘要翻译：衬底支撑件具有支撑结构，并且在具有碳 - 氢网络的支撑结构上具有涂层。涂层具有摩擦系数小于约0.3，硬度至少约8GPa的接触表面。涂层的接触表面能够减少与接触表面接触的基底的磨损和污染。在一个版本中，支撑结构具有覆盖电极的电介质。电介质上的多个台面具有其上具有接触表面的涂层。在另一个版本中，通过提供具有一对具有凸起的凸起以支撑基板的弓形翅片的基板提升组件来降低基板的污染。

2. 发明申请

WO2003001658A1 CONTROLLED RESISTIVITY BORON NITRIDE ELECTROSTATIC CHUCK APPARATUS FOR RETAINING A SEMICONDUCTOR WAFER AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：用于保持半导体滤波器的控制电阻率硝酸盐静电电容器及其制造方法
公开(公告)号：WO2003001658A1
公开(公告)日：2003-01-03
申请号：PCT/US2002/019342
申请日：2002-06-18
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D. , DESHPANDEY, Chandra, V.
IPC分类号： H02N13/00
CPC分类号： H02N13/00 , Y10T279/23
摘要： Apparatus (Figure 1) for retaining a workpiece in a semiconductor processing chamber (100) and method for fabricating the same. In one embodiment, a method for fabricating the apparatus includes providing a controlled resistivity boron nitride (CRBN) plate. A conductive layer is disposed on a portion of a lower surface of the CRBN plate to form at least one chucking electrode (116). A layer of boron nitride powder is disposed on the conductive layer and the lower surface of the CRBN plate. The CRBN plate, the conductive layer, and the boron nitride powder are hot pressed together to form the apparatus. In a second embodiment, a conductive electrode layer is deposited on a portion of a lower surface of the CRBN plate. A layer of pyrolytic boron nitride is deposited on the conductive layer and the lower surface of the CRBN plate to form the apparatus.
摘要翻译：用于将工件保持在半导体处理室（100）中的装置（图1）及其制造方法。在一个实施例中，制造该装置的方法包括提供受控电阻率的氮化硼（CRBN）板。导电层设置在CRBN板的下表面的一部分上以形成至少一个夹持电极（116）。在导电层和CRBN板的下表面上设置一层氮化硼粉末。将CRBN板，导电层和氮化硼粉末热压在一起以形成该装置。在第二实施例中，导电电极层沉积在CRBN板的下表面的一部分上。在导电层和CRBN板的下表面上沉积一层热解氮化硼以形成该装置。

3. 发明申请

WO2022173536A1 ELECTROSTATIC CHUCK WITH METAL BOND 审中-公开
公开(公告)号：WO2022173536A1
公开(公告)日：2022-08-18
申请号：PCT/US2022/011788
申请日：2022-01-10
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D.
IPC分类号： H01L21/683 , H01L21/67 , H01L21/687 , H05B3/26 , C23C16/458 , H01J37/32
摘要： Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic bottom plate having heater elements therein. The substrate support assembly also includes a ceramic top plate having an electrode therein. A metal layer is between the ceramic top plate and the ceramic bottom plate. The ceramic top plate is in direct contact with the metal layer, and the metal layer is in direct contact with the ceramic bottom plate.

4. 发明申请

WO2010019430A2 ELECTROSTATIC CHUCK ASSEMBLY 审中-公开
标题翻译：静电块组件
公开(公告)号：WO2010019430A2
公开(公告)日：2010-02-18
申请号：PCT/US2009/052917
申请日：2009-08-06
申请人： APPLIED MATERIALS, INC. , SANSONI, Steven, V. , TSAI, Cheng-Hsiung , ROY, Shambhu, N. , BROWN, Karl, M. , PARKHE, Vijay, D. , PONNEKANTI, Hari, K.
发明人： SANSONI, Steven, V. , TSAI, Cheng-Hsiung , ROY, Shambhu, N. , BROWN, Karl, M. , PARKHE, Vijay, D. , PONNEKANTI, Hari, K.
IPC分类号： H01L21/687 , B23Q3/15 , H02N13/00 , H01L21/68
CPC分类号： H01L21/6833 , H01J37/32431 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H01L21/68785 , H01L2924/0002 , H02N13/00 , H01L2924/00
摘要： Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.
摘要翻译：本发明的实施例提供了一种经济高效的静电卡盘组件，其能够在超高真空环境中在宽的温度范围内运行，同时使静电卡盘组件内的热机械应力最小化。在一个实施例中，静电卡盘组件包括具有夹持电极的介电体，该夹持电极包括与电介质体的CTE匹配的具有热膨胀系数（CTE）的金属基质复合材料。

5. 发明申请

WO2014182711A1 ELECTROSTATIC CHUCK HAVING THERMALLY ISOLATED ZONES WITH MINIMAL CROSSTALK 审中-公开
标题翻译：具有最小型CROSSTALK的隔热隔离带的静电卡盘
公开(公告)号：WO2014182711A1
公开(公告)日：2014-11-13
申请号：PCT/US2014/036989
申请日：2014-05-06
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D. , MAKHRATCHEV, Konstantin , DELLA ROSA, Jason , NOORBAKHSH, Hamid , MAYS, Brad, L. , BUCHBERGER, Douglas, A., Jr.
IPC分类号： H01L21/687 , H01L21/324
CPC分类号： H01L21/6833 , H01L21/67103 , H01L21/6831 , Y10T156/10
摘要： A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.
摘要翻译：衬底支撑组件包括陶瓷盘和导热基底，其具有结合到陶瓷盘的下表面的上表面。导热基底包括多个热区和多个热绝缘体，其从导热基底的上表面延伸到导热基底的下表面，其中多个热隔离器中的每一个提供在在导热基体的上表面的多个热区中的两个。

6. 发明申请

WO2014176282A1 PROTECTIVE COVER FOR ELECTROSTATIC CHUCK 审中-公开
标题翻译：防静电保护罩
公开(公告)号：WO2014176282A1
公开(公告)日：2014-10-30
申请号：PCT/US2014/035039
申请日：2014-04-22
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D.
IPC分类号： H01L21/687 , H02N13/00 , B23Q3/15
CPC分类号： H01L21/68757 , C04B35/44 , C04B35/48 , C04B35/505 , C23C14/081 , C23C14/083 , H01L21/67011 , H01L21/67017 , H01L21/6831 , Y10T279/3493
摘要： A protective cover for an electrostatic chuck may include a conductive wafer and a plasma resistant ceramic layer on at least one surface of the conductive wafer. The plasma resistant ceramic layer covers a top surface of the conductive wafer, side walls of the conductive wafer and an outer perimeter of a bottom surface of the conductive wafer. Alternatively, a protective cover for an electrostatic chuck may include a plasma resistant bulk sintered ceramic wafer and a conductive layer on a portion of a bottom surface of the plasma resistant bulk sintered ceramic wafer, wherein a perimeter of the bottom surface is not covered.
摘要翻译：用于静电卡盘的保护盖可以包括在导电晶片的至少一个表面上的导电晶片和耐等离子体陶瓷层。耐等离子体陶瓷层覆盖导电晶片的顶表面，导电晶片的侧壁和导电晶片的底表面的外周。或者，用于静电卡盘的保护盖可以包括耐等离子体体积烧结陶瓷晶片和等离子体体积烧结陶瓷晶片的底表面的一部分上的导电层，其中底表面的周边不被覆盖。

7. 发明申请

WO2022187029A1 ELECTROSTATIC CHUCK WITH METAL SHAFT 审中-公开
公开(公告)号：WO2022187029A1
公开(公告)日：2022-09-09
申请号：PCT/US2022/017328
申请日：2022-02-22
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D. , AGARWAL, Ashutosh
IPC分类号： H01L21/683 , H01L21/687 , H01L21/67 , C23C16/458 , H01J37/32
摘要： Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic bottom plate, a ceramic top plate, and a bond layer between the ceramic top plate and the ceramic bottom plate, the ceramic top plate in direct contact with the bond layer, and the bond layer in direct contact with the ceramic bottom plate. A metal shaft is coupled to the ceramic bottom plate at a side of the ceramic bottom plate opposite the bond layer.

8. 发明申请

WO2022177691A1 ELECTROSTATIC CHUCK WITH DIFFERENTIATED CERAMICS 审中-公开
公开(公告)号：WO2022177691A1
公开(公告)日：2022-08-25
申请号：PCT/US2022/013177
申请日：2022-01-20
申请人： APPLIED MATERIALS, INC.
发明人： PARKHE, Vijay, D.
IPC分类号： H01L21/683 , H01L21/687 , H01L21/67 , C23C16/458
摘要： Electrostatic chucks (ESCs) for reactor or plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic bottom plate having heater elements therein, the ceramic bottom plate composed of alumina having a first purity. The substrate support assembly also includes a ceramic top plate having an electrode therein, the ceramic top plate composed of alumina having a second purity higher than the first purity. A bond layer is between the ceramic top plate and the ceramic bottom plate. The ceramic top plate is in direct contact with the bond layer, and the bond layer is in direct contact with the ceramic bottom plate.

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