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1. 发明申请

WO2013143116A1 FLOW CONTROL SYSTEM AND METHOD THEREOF 审中-公开
标题翻译：流量控制系统及其方法
公开(公告)号：WO2013143116A1
公开(公告)日：2013-10-03
申请号：PCT/CN2012/073302
申请日：2012-03-30
申请人： ACM RESEARCH (SHANGHAI) INC. , WANG, Jian , ZHAO, Yu , XIE, Liangzhi , ZHANG, Xiaoyan , JIA, Shena , WANG, Hui
发明人： WANG, Jian , ZHAO, Yu , XIE, Liangzhi , ZHANG, Xiaoyan , JIA, Shena , WANG, Hui
IPC分类号： G05D7/06
CPC分类号： G05D7/0664
摘要： A flow control system and method thereof are disclosed. The flow control system includes a control valve for liquid flowing through, a pressure sensor measuring a pressure of the liquid flowing through the control valve and outputting a measuring signal, a controller receiving the measuring signal from the pressure sensor and outputting a corresponding electric current signal, an I/P converter receiving the electric current signal from the controller and outputting compressed air with corresponding pressure to the control valve to regulate the pressure of the liquid in the control valve, a flow switch measuring a flow rate of the liquid flowing into a chamber, and a needle valve regulating the flow rate to a target flow rate. The control valve, the pressure sensor, the I/P converter and the controller constitute a PID closed loop control system to provide a precise and stable liquid supply.
摘要翻译：公开了一种流量控制系统及其方法。流量控制系统包括用于液体流过的控制阀，测量流过控制阀的液体的压力并输出测量信号的压力传感器，控制器从压力传感器接收测量信号并输出相应的电流信号，I / P转换器，其接收来自控制器的电流信号，并将相应压力的压缩空气输出到控制阀，以调节控制阀中的液体的压力;流量开关，其测量流入以及将流量调节到目标流量的针阀。控制阀，压力传感器，I / P转换器和控制器构成PID闭环控制系统，提供精确稳定的液体供应。

2. 发明申请

WO2013040778A1 METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES 审中-公开
标题翻译：清洁卷芯片组装的方法和装置
公开(公告)号：WO2013040778A1
公开(公告)日：2013-03-28
申请号：PCT/CN2011/080011
申请日：2011-09-22
申请人： ACM RESEARCH (SHANGHAI) INC. , ZHANG, Xiaoyan , CHEN, Fuping , WANG, Hui
发明人： ZHANG, Xiaoyan , CHEN, Fuping , WANG, Hui
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/67051 , H01L21/02052 , H01L21/67023 , H01L24/16 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/7501 , H01L2224/81911 , H01L2924/014
摘要： An apparatus and methods for cleaning flip chip (100) assemblies are provided. The apparatus comprises: a chuck assembly (701); a motor coupled to the chuck assembly (701) by a spindle (704); at least one carrier (705) for holding flip chips (100); and at least one spray nozzle (706, 707) for directing de-ionized water, a cleaning solution, a gas or a vapor. The apparatus and methods provide a thorough and uniform cleaning of flux residues and other contaminants.
摘要翻译：提供了一种用于清洁倒装芯片（100）组件的装置和方法。该装置包括：卡盘组件（701）; 通过主轴（704）联接到所述卡盘组件（701）的马达; 用于保持倒装芯片的至少一个载体（705）; 以及用于引导去离子水，清洁溶液，气体或蒸汽的至少一个喷嘴（706,707）。该设备和方法提供对焊剂残留物和其他污染物的彻底和均匀的清洁。

3. 发明申请

WO2016127423A1 METHOD AND APPARATUS FOR INTEGRATED SUBSTRATE CLEANING AND DRYING 审中-公开
标题翻译：综合基板清洗干燥方法与装置
公开(公告)号：WO2016127423A1
公开(公告)日：2016-08-18
申请号：PCT/CN2015/073085
申请日：2015-02-15
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , CHEN, Fuping , ZHANG, Xiaoyan
IPC分类号： H01L21/02 , H01L21/67 , B08B3/04
CPC分类号： H01L21/67051 , B08B3/10 , H01L21/67028 , H01L21/67034
摘要： A method and an apparatus for integrated substrate cleaning and drying, the apparatus includes: a chuck (103) for holding and positioning a substrate (104); a driving unit (105) connecting with the chuck (103) for driving the chuck (103) to rotate; a solid pad (101) disposed above the substrate (104); a first dispense nozzle (107) disposed on the solid pad (101) for dispensing a rinsing liquid to the surface of the substrate (104); a second dispense nozzle (106) disposed on the solid pad (101) for dispensing a low tension liquid to the surface of the substrate (104); and a movable arm (102) disposed above the substrate (104) for supplying dry gas to the surface of the substrate (104).
摘要翻译：一种用于集成基板清洁和干燥的方法和装置，该装置包括：用于保持和定位基板的卡盘（103）; 与所述卡盘（103）连接以驱动所述卡盘（103）旋转的驱动单元（105）设置在所述基板（104）上方的固体垫（101）; 设置在所述固体垫（101）上用于将冲洗液体分配到所述基底（104）表面的第一分配喷嘴（107）; 设置在所述固体垫（101）上的用于将低张力液体分配到所述基底（104）的表面的第二分配喷嘴（106）; 以及设置在所述基底（104）上方的用于将干燥气体供应到所述基底（104）的表面的可移动臂（102）。

4. 发明申请

WO2019205074A1 METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS 审中-公开
公开(公告)号：WO2019205074A1
公开(公告)日：2019-10-31
申请号：PCT/CN2018/084752
申请日：2018-04-27
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： CHEN, Fuping , ZHANG, Xiaoyan , WANG, Hui
IPC分类号： B01D19/00 , F04B23/00
摘要： Embodiments of the present disclosure relate to a method for cleaning an in-process wafer. The method comprises causing the in-process wafer to be rotated, causing function water to be applied to a surface of the rotated in-process wafer to generate a flowing function water film on the rotated in-process wafer, causing the surface of the in-process wafer to be cleaned by a sonic device for a first period, causing the sonic device to be lifted and/or rotation speed of the rotated in-process wafer to be accelerated to separate the sonic device from the flowing function water film, causing the function water to be applied to the surface of the rotated in-process wafer for a second period after separating the sonic device from the function water film, and causing the surface of the in-process wafer to be dried.

5. 发明申请

WO2019153134A1 METHOD AND APPARATUS FOR CLEANING SUBSTRATES 审中-公开
公开(公告)号：WO2019153134A1
公开(公告)日：2019-08-15
申请号：PCT/CN2018/075550
申请日：2018-02-07
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , WANG, Xi , CHEN, Fuping , ZHANG, Xiaoyan , CHEN, Fufa
IPC分类号： H01L21/02
摘要： The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

6. 发明申请

WO2018161205A1 APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES 审中-公开
公开(公告)号：WO2018161205A1
公开(公告)日：2018-09-13
申请号：PCT/CN2017/075716
申请日：2017-03-06
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , TAO, Xiaofeng , CHEN, Fuping , JIA, Shena , WANG, Xi , ZHANG, Xiaoyan , LI, Xuejun
IPC分类号： H01L21/76 , B08B3/02
摘要： An apparatus for cleaning semiconductor substrates includes a chamber (101), a chuck (102), a liquid collector (104), an enclosing wall (105), at least one driving mechanism (106), at least one internal dispenser (111), and at least one external dispenser (118). The chamber (101) has a top wall (1011), a side wall (1012) and a bottom wall (1013). The chuck (102) is disposed in the chamber (101) for holding a semiconductor substrate (103). The liquid collector (104) surrounds the chuck (102). The enclosing wall (105) surrounds the liquid collector (104). The at least one driving mechanism (106) drives the enclosing wall (105) to move up and down, wherein when the at least one driving mechanism (106) drives the enclosing wall (105) to move up, a seal room (110) is formed by the liquid collector (104), the enclosing wall (105), the top wall (1011) of the chamber (101), and the bottom wall (1013) of the chamber (101). The at least one internal dispenser (111) is disposed inside the seal room (110). The at least one external dispenser (118) is disposed outside the seal room (110). The at least one external dispenser (118) gets in and out the seal room (110) after the enclosing wall (105) is driven to move down.

7. 发明申请

WO2016041151A1 COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANING METHOD 审中-公开
标题翻译：具有自动清洁功能和涂层自动清洗方法
公开(公告)号：WO2016041151A1
公开(公告)日：2016-03-24
申请号：PCT/CN2014/086644
申请日：2014-09-16
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , CHEN, Fuping , WANG, Wenjun , YANG, Hongchao , NUCH, Voha , CHEN, Fufa , WANG, Jian , ZHANG, Xiaoyan , YANG, Shu
IPC分类号： H01L21/00
CPC分类号： G03F7/162 , H01L21/67086 , H01L21/6715 , H01L21/68742
摘要： A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning. The coater (100,200,300,400,500,600,700,800) automatic cleaning method includes the following steps: turning off a liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) of the coater (100,200,300,400,500,600,700,800); filling up a coater chamber (101,201,301,401,501,601,701,801) with cleaning solution; after photoresist in the coater chamber (101,201,301,401,501,601,701,801) being dissolved into the cleaning solution, turning on the liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) and draining the cleaning solution out of the coater chamber (101,201,301,401,501,601,701,801).
摘要翻译：具有自动清洗功能的涂布机和涂布机的自动清洗方法。涂布机（100,200,300,400,500,600,700,800）包括能够填充清洁溶液的涂布机室（101,201,301,401,501,601,701,801），保持和定位基板（103,203,303,403,503,603,703,803）的基板卡盘（102,202,302,402,502,602,702,802）以及能够向上移动以防止的基板（108,208,308,408,508）从涂膜室（101,201,301,401,501,601,701,801）喷出的光致抗蚀剂，或者向下移动并浸入清洁溶液中以进行清洁。涂布机（100,200,300,400,500,600,700,800）自动清洗方法包括以下步骤：关闭涂布机的液体出口阀（118,218,318,418A，418B，518,532,618,718,818）（100,200,300,400,500,600,700,800）; 用清洁液填充涂布室（101,201,301,401,501,601,701,801）; 在涂布机室（101,201,301,401,501,601,701,801）中的光致抗蚀剂溶解在清洁溶液中之后，打开液体出口阀（118,218,318,418A，418B，518,532,618,718,818）并将清洁溶液排出涂布机室（101,201,301,401,501,601,701,801）。

8. 发明申请

WO2021081975A1 SUBSTRATE CLEANING METHOD AND APPARATUS 审中-公开
公开(公告)号：WO2021081975A1
公开(公告)日：2021-05-06
申请号：PCT/CN2019/114972
申请日：2019-11-01
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Wenjun , YAO, Ting , ZHANG, Xiaoyan , CHEN, Fuping , WANG, Hui
IPC分类号： H01L21/02 , H01L21/67
摘要： A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (601); using TEBO megasonic to clean the substrate surface (602); and drying the substrate (603). The TEBO megasonic cleaning is used to remove small size particles on the substrate and the gas-liquid atomization cleaning is used to remove large size particles on the substrate. The method enables achieving an effect of cleaning the substrate without or with less device damage. A substrate cleaning apparatus is also provided.

9. 发明申请

WO2019095126A1 METHOD FOR CLEANING SEMICONDUCTOR WAFERS 审中-公开
公开(公告)号：WO2019095126A1
公开(公告)日：2019-05-23
申请号：PCT/CN2017/111015
申请日：2017-11-15
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , CHEN, Fufa , CHEN, Fuping , WANG, Jian , WANG, Xi , ZHANG, Xiaoyan , JIN, Yinuo , JIA, Zhaowei , XIE, Liangzhi , WANG, Jun , LI, Xuejun
IPC分类号： B08B3/12 , H01L21/67
摘要： A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

10. 发明申请

WO2018049671A1 METHODS AND APPARATUS FOR CLEANING SUBSTRATES 审中-公开
标题翻译：用于清洁基材的方法和设备
公开(公告)号：WO2018049671A1
公开(公告)日：2018-03-22
申请号：PCT/CN2016/099303
申请日：2016-09-19
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , WANG, Xi , CHEN, Fuping , CHEN, Fufa , WANG, Jian , ZHANG, Xiaoyan , JIN, Yinuo , JIA, Zhaowei , WANG, Jun , LI, Xuejun
IPC分类号： B08B3/12
摘要： A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f 1 and power P 1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f 2 and power P 2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f 1 and power P 1 again; repeating above steps till the substrate (20010) being cleaned.
摘要翻译：一种使用超大型声波装置（1003,3003,16062,17072）有效地清洁基板（20010）上的通孔（20034），沟槽（20036）或凹陷区域的方法，包括：将液体（1032）施加到衬底（20010）和超声波/超声波装置（1003,3003,16062,17072）之间的空间中; 在频率f 1和功率P 1下设置超/兆声波电源以驱动所述超声/兆声波设备（1003,3003,16062,17072）; 在通孔（20034）内的总气泡体积与体积之比，衬底（20010）上的沟槽（20036）或凹陷区域增加到第一设定值之后，将频率f 2设定为所述超大/超声波电源和功率P 2以驱动所述超大/超声波设备（1003,3003,16062,17072）;以及其中，在通孔（20034）内的总气泡体积与体积之比，沟槽（20036）或凹陷区域减小到第二设定值之后，以频率f1设置所述超/兆声波电源并且功率P <1>再次; 重复上述步骤直到清洗基板（20010）。

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