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1. 发明申请

WO2013063233A1 ELECTRICAL CONNECTOR 审中-公开
标题翻译：电气连接器
公开(公告)号：WO2013063233A1
公开(公告)日：2013-05-02
申请号：PCT/US2012/061861
申请日：2012-10-25
申请人： 3M INNOVATIVE PROPERTIES COMPANY , SAITO, Shinji , HAYAUCHI, Takayuki , KAWATE, Yoshihisa
发明人： SAITO, Shinji , HAYAUCHI, Takayuki , KAWATE, Yoshihisa
IPC分类号： H01R13/506 , H01R13/6581 , H01R24/64 , H01R13/516
CPC分类号： H01R13/646 , H01R9/091 , H01R13/506 , H01R13/516 , H01R13/6272 , H01R13/6466 , H01R13/658 , H01R13/6581 , H01R13/7197 , H01R23/025 , H01R24/64 , H01R2201/04 , H01R2201/16
摘要： [Problem] To provide an electrical connector that suppresses cross-talk. [Resolution Means] An electrical connector includes a main body 14 and a cover 16, with the main body 14 and the cover 16 demarcating a space housing a cable 3; the main body 14 includes an upper housing 20, a lower housing 22, a wiring substrate 28 arranged between the upper housing 20 and the lower housing 22, and a shield member 30 arranged interposing the upper housing 20 and the lower housing 22; and the wiring substrate 28 includes a contact 24 for electrically connecting to the cable 3, a connection terminal 26 for electrically connecting to a mating connector, and connecting conductor wiring L for electrically connecting the contact 24 and the connection terminal 26.
摘要翻译： [问题]提供抑制串扰的电连接器。 [分辨率装置]电连接器包括主体14和盖16，主体14和盖16分隔容纳电缆3的空间; 主体14包括上壳体20，下壳体22，布置在上壳体20和下壳体22之间的布线基板28以及设置成插入上壳体20和下壳体22的屏蔽构件30; 布线基板28包括用于电连接到电缆3的触点24，用于电连接到配合连接器的连接端子26和用于电连接触头24和连接端子26的连接导体布线L.

2. 发明申请

WO2007109428A3 PACKAGING METHOD OF CHIP OR PACKAGE EQUIPPED WITH BUMPS 审中-公开
公开(公告)号：WO2007109428A3
公开(公告)日：2007-09-27
申请号：PCT/US2007/063540
申请日：2007-03-08
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Kohichiro , KAWATE, Yoshihisa , LOTTES, Andrew, C.
发明人： KAWATE, Kohichiro , KAWATE, Yoshihisa , LOTTES, Andrew, C.
IPC分类号： H01L21/58 , H01L21/60 , G01R31/26
摘要： To provide a packaging method that connects a semiconductor chip and a substrate through an under-fill material and after an operation confirmation test is conducted, the under-fill material is heat cured. A packaging method of a semiconductor chip or package equipped with bumps, comprises the steps of arranging a heat-fluidizing and thermosetting under-fill material film between a semiconductor chip or package equipped with bumps and a substrate; applying heat and pressure at a temperature and a pressure sufficiently high to cause fluidization of the under-fill material film and to achieve provisional electrical connection; conducting an operation confirmation test; and if the operation confirmation test proves successful, further heating and curing the under-fill material film to obtain the final electronic device, or if the operation confirmation test proves unsuccessful, removing a defective chip or package at a temperature and a pressure sufficient to cause fluidization of the under-fill material film, and repeating the steps described above by using a new chip or package equipped with bumps.

3. 发明申请

WO2006017037A1 CONNECTION METHOD OF CONDUCTIVE ARTICLES, AND ELECTRIC OR ELECTRONIC COMPONENT WITH PARTS CONNECTED BY THE CONNECTION METHOD 审中-公开
标题翻译：导电制品的连接方法以及连接方法连接部件的电气或电子部件
公开(公告)号：WO2006017037A1
公开(公告)日：2006-02-16
申请号：PCT/US2005/023373
申请日：2005-07-01
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , KAWATE, Kohichiro
发明人： KAWATE, Yoshihisa , KAWATE, Kohichiro
IPC分类号： H05K3/36 , C09J163/00
CPC分类号： C09J163/00 , H05K3/305 , H05K3/361 , H05K2201/09745 , H05K2201/10977 , H05K2203/1189 , Y10T29/49126 , Y10T428/24843
摘要： Provided is a method of adhesively connecting conductive traces on one substrate to conductive traces on another substrate and the resulting articles.
摘要翻译：提供了将一个衬底上的导电迹线粘附到另一衬底上的导电迹线和所得到的制品的方法。

4. 发明申请

WO2012106103A1 SOCKET FOR IC DEVICE 审中-公开
标题翻译： IC器件插座
公开(公告)号：WO2012106103A1
公开(公告)日：2012-08-09
申请号：PCT/US2012/021504
申请日：2012-01-17
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , TSUBAKI, Yuichi
发明人： KAWATE, Yoshihisa , TSUBAKI, Yuichi
IPC分类号： H05K7/10 , H01L23/66 , H01R13/66 , G01R1/04 , G01R31/28
CPC分类号： H01R13/6625 , G01R1/045 , G01R1/0483 , G01R1/07371 , H01L23/66 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an IC device socket equipped with a structure that can effectively suppress instability of a power supply due to decreased voltages and higher speeds of an IC device. The IC device socket (1) includes a dielectric layer arranged so as to configure a capacitor in a space between a first surface (26) and a second surface (27) of a base material (21) composed of insulating materials, and a power layer (2104) and a GND layer (2201) formed on both sides of the dielectric layer. A surface area defined by an outermost perimeter of at least the power layer (2103) among the power layer (2103) and the GND layer (2201) is set to be smaller than a surface area defined by an outermost perimeter of the first surface (26), and a capacitance between the power layer (2103) and the GND layer (2201) is controlled by changing the surface area of a portion (AR) in which the power layer (2103) and the GND layer overlap as seen from the first surface (26) toward the second surface (27).
摘要翻译：本发明涉及一种具有能够有效地抑制由于IC器件的电压降低和速度变快引起的电源的不稳定性的结构的IC器件插座。 IC器件插座（1）包括电介质层，其布置成在由绝缘材料构成的基材（21）的第一表面（26）和第二表面（27）之间的空间中构成电容器，并且功率层（2104）和形成在电介质层两侧的GND层（2201）。由功率层（2103）和GND层（2201）中的至少功率层（2103）的最外周限定的表面积被设定为小于由第一表面的最外周界限定的表面积（ 26），并且通过改变功率层（2103）和GND层重叠的部分（AR）的表面积，从功率层（2103）和GND层（2201）之间的电容重叠来控制电容第一表面（26）朝向第二表面（27）。

5. 发明申请

WO2011153054A3 CONTACT HOLDER 审中-公开
公开(公告)号：WO2011153054A3
公开(公告)日：2011-12-08
申请号：PCT/US2011/038064
申请日：2011-05-26
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , TSUBAKI, Yuichi , KOBAYASHI, Masahiko
发明人： KAWATE, Yoshihisa , TSUBAKI, Yuichi , KOBAYASHI, Masahiko
IPC分类号： H01R33/76 , H01L23/32 , G01R1/067
摘要： To provides a contact holder, capable of compensating a change of signal transmission characteristic at the outer edge area of the substrate. A substrate 21 has grounding conductive layers 291, 292 arranged on or above surfaces 212, 213 of the substrate, near a plunger of a signal transmitting contact 3b. Each grounding conductive layer is electrically connected to a conductive portion 241 electrically connected to each grounding contact, on surface 212 or 213 of substrate 21. Further, each grounding conductive layer is not electrically connected to the signal transmitting contact.

6. 发明申请

WO2006049853A2 METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD 审中-公开
标题翻译：将半导体封装连接到印刷电路板的方法
公开(公告)号：WO2006049853A2
公开(公告)日：2006-05-11
申请号：PCT/US2005/037287
申请日：2005-10-14
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Kohichiro , SATO, Yoshiaki , MONMA, Miwa , KAWATE, Yoshihisa
发明人： KAWATE, Kohichiro , SATO, Yoshiaki , MONMA, Miwa , KAWATE, Yoshihisa
CPC分类号： H01L21/6835 , H01L21/563 , H01L23/293 , H01L24/29 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H05K3/284 , H05K3/305 , H05K3/3436 , H05K3/3457 , H05K2201/10977 , H05K2203/0278 , Y02P70/613 , H01L2924/0665 , H01L2224/73204 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of electrically connecting a bump array package to a wiring board, comprising the steps of: arranging a thermofluidizing, thermosetting adhesive film on a surface of a bump array package having metal bumps; creating a bump array package having a flat surface comprising said metal bumps and said adhesive film, and connecting the bump array package to the wiring board by arranging the flat surface comprising said metal bumps and said adhesive film on the wiring board, and heating the adhesive film at a temperature high enough for finishing the setting of said adhesive film and higher than the melting temperature of said solder.
摘要翻译：一种将凸块阵列封装电连接到布线板的方法，包括以下步骤：在具有金属凸块的凸块阵列封装的表面上布置热流化热固性粘合剂膜; 形成具有包括所述金属凸块和所述粘合膜的平坦表面的凸块阵列封装，并且通过将包括所述金属凸块和所述粘合剂膜的平坦表面布置在所述布线板上并将所述粘合剂加热而将所述凸块阵列封装连接到所述布线板在足够高的温度下完成所述粘合剂膜的设置并高于所述焊料的熔化温度的膜。

7. 发明申请

WO2012106221A1 IC DEVICE SOCKET 审中-公开
标题翻译： IC设备插座
公开(公告)号：WO2012106221A1
公开(公告)日：2012-08-09
申请号：PCT/US2012/023066
申请日：2012-01-30
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , TSUBAKI, Yuichi
发明人： KAWATE, Yoshihisa , TSUBAKI, Yuichi
IPC分类号： G01R1/04
CPC分类号： G01R1/06722 , G01R1/0483 , G01R1/07371 , G01R1/07378
摘要： The present invention relates to an IC device socket that enables the efficient use of conductive contact pins and enables them to be efficiently replaced. The IC device socket (100) includes a pin holder (1) that includes a first substrate (210), a second substrate (220), and a third substrate (230). The first substrate (210) includes a first pin (4) disposed to form a first arrangement pattern. The second substrate (220) includes a second pin (6) disposed to form a second arrangement pattern that is different from the first arrangement pattern. The third substrate (230) is disposed between the first and second substrates (210, 220), includes a plurality of conduction paths that electrically connect pins having the same function from among the first and second pins (4, 6), and the third substrate (230) is separated from at least one of the first and second substrates (210, 220).
摘要翻译：本发明涉及一种IC器件插座，其能够有效地使用导电接触销并使其能够被有效地更换。 IC器件插座（100）包括：引脚保持器（1），其包括第一基板（210），第二基板（220）和第三基板（230）。第一基板（210）包括设置成形成第一布置图案的第一销（4）。第二基板（220）包括设置成形成与第一布置图案不同的第二布置图案的第二销（6）。第三基板（230）设置在第一和第二基板（210,220）之间，包括多个导电路径，其将与第一和第二引脚（4,6）具有相同功能的引脚电连接，并且第三基板衬底（230）与第一和第二衬底（210,220）中的至少一个分离。

8. 发明申请

WO2006110363A1 CABLE HARNESS BODY 审中-公开
标题翻译：电缆线束体
公开(公告)号：WO2006110363A1
公开(公告)日：2006-10-19
申请号：PCT/US2006/012216
申请日：2006-04-04
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , MIYA, Takuro , KAWATE, Kohichiro
发明人： KAWATE, Yoshihisa , MIYA, Takuro , KAWATE, Kohichiro
IPC分类号： H01R12/10 , H01R4/04
CPC分类号： H01R4/04 , H01R12/598 , H01R12/61 , H01R12/613 , H05K1/117 , H05K3/305 , H05K3/361 , H05K2201/0212 , H05K2201/10356 , H05K2201/10977 , Y10T29/49117
摘要： To provide a connecting means that can facilitate electrical connection between the circuit boards mounted in an electronic apparatus and can attain the miniaturization of connecting parts. A cable harness body comprising a plurality of cables for electrically connecting circuit boards mounted in an electronic apparatus and the terminal members disposed on both ends of said cables, wherein at least one of said terminal members is comprised of a flexible circuit board and an adhesive layer on the surface of the electric connecting part of said flexible circuit board.
摘要翻译：为了提供能够促进安装在电子设备中的电路板之间的电连接的连接装置，并且可以实现连接部件的小型化。一种电缆束体，包括多个电缆，用于电连接安装在电子设备中的电路板和设置在所述电缆的两端的端子构件，其中至少一个所述端子构件包括柔性电路板和粘合层在所述柔性电路板的电连接部分的表面上。

9. 发明申请

WO2004095645A1 COAXIAL CABLE CONNECTOR, AND HARNESS UNIT THAT UTILIZES THE COAXIAL CABLE CONNECTOR 审中-公开
标题翻译：同轴电缆连接器和使用同轴电缆连接器的线束单元
公开(公告)号：WO2004095645A1
公开(公告)日：2004-11-04
申请号：PCT/US2004/008104
申请日：2004-03-16
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , MATSUOKA, Hiroyuki
发明人： KAWATE, Yoshihisa , MATSUOKA, Hiroyuki
IPC分类号： H01R9/053
CPC分类号： H01R4/2433
摘要： A coaxial cable connector can be easily fitted to one or a plurality of coaxial cables, and that can secure an independent shield. Inner insulator exposed portions and outer conductor exposed portions of coaxial cables are matched with a first cable holder. A second cable holder is reversed on the first cable holder, and is engaged therewith. The engagement is further engaged with a housing. Central conductors of the inner insulator exposed portions are engaged with cuts of first contact elements. The outer conductor exposed portions are held in gripping conductors that are disposed inside the first cable holder. Gripping conductor extensions that are coupled with the gripping conductors are engaged with cuts of second contact elements. The contact elements are connected to external cable connection terminals that extend within a connection chamber of the housing.
摘要翻译：同轴电缆连接器可以容易地装配到一个或多个同轴电缆，并且可以固定独立的屏蔽。同轴电缆的内部绝缘体暴露部分和外部导体暴露部分与第一电缆保持器相匹配。第二缆线架在第一缆线架上相反，并与其接合。进一步参与住房。内绝缘体暴露部分的中心导体与第一接触元件的切口接合。外导体暴露部分保持在设置在第一电缆保持器内部的夹持导体中。与夹持导体耦合的夹持导体延伸部与第二接触元件的切口接合。接触元件连接到在壳体的连接室内延伸的外部电缆连接端子。

10. 发明申请

WO2012106220A1 SOCKET FOR IC DEVICE 审中-公开
标题翻译： IC器件插座
公开(公告)号：WO2012106220A1
公开(公告)日：2012-08-09
申请号：PCT/US2012/023061
申请日：2012-01-30
申请人： 3M INNOVATIVE PROPERTIES COMPANY , KAWATE, Yoshihisa , TSUBAKI, Yuichi
发明人： KAWATE, Yoshihisa , TSUBAKI, Yuichi
IPC分类号： G01R1/04 , H05K7/10
CPC分类号： H05K7/1069 , G01R1/0483 , G01R1/07371
摘要： The present invention relates to an IC device socket having a configuration for allowing easy setting of a plurality of types power sources and/or grounds without increasing the thickness of the substrate. The IC device socket (1) includes at least one dielectric layer (22) and a power layer (222, 222') and a GND layer (224, 224') formed on both sides of the dielectric layer (22), arranged so as to configure a C component in a base material (21). The power layer (222, 222') and a GND layer (224, 224') are each segmented into two or more portions with an insulation region (290) interspersed therebetween. This configuration easily allows for different power source settings in the IC device socket (1) without increasing the thickness of the substrate (2).
摘要翻译：本发明涉及一种IC器件插座，其具有用于容易地设置多个类型的电源和/或接地而不增加衬底的厚度的结构。 IC器件插座（1）包括形成在电介质层（22）的两侧上的至少一个电介质层（22）和功率层（222,222'）和GND层（224,224'），其布置成以构成基材（21）中的C成分。功率层（222,222'）和GND层（224,224'）分别被分成两个或更多个部分，其间分散有绝缘区域（290）。该配置容易地允许IC器件插座（1）中的不同的电源设置，而不增加衬底（2）的厚度。

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