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    • 10. 发明申请
    • A FLEXIBLE CIRCUIT AND A METHOD OF PRODUCING THE SAME
    • 一种柔性电路及其制造方法
    • WO2012023902A1
    • 2012-02-23
    • PCT/SG2010/000303
    • 2010-08-18
    • 3M INNOVATIVE PROPERTIES COMPANYPALANISWAMY, RaviTAN, Fong, Liang
    • PALANISWAMY, RaviTAN, Fong, Liang
    • H05K3/10H01L23/48H05K3/46
    • H05K3/108H05K1/0393H05K3/281
    • A structure comprising a flexible dielectric film supporting on at least one side a thermoplastic polyimide layer, and on it a conductive layer, is treated by an "semi- additive" process. The "semi-additive" process comprises forming a patterned photo¬ resist layer, filling gaps in the photo-resist layer with conductive material, removing the photo-resist and exposed portions of the laminated conductive layer, and covering the structure with a coverlay. The inventors have realized that the process of laminating the copper layer onto the thermoplastic polyimide layer roughens the surface of the thermoplastic polyimide layer, thus anchoring the copper layer to the polyimide, which means that when the conductive material is deposited into the gaps in the photo-resist, conductive bodies are formed which are strongly anchored to the thermoplastic polyimide layer, and which can be used as electrodes of a flexible circuit.
    • 包括在至少一个侧面上支撑热塑性聚酰亚胺层的柔性电介质薄膜及其上的导电层的结构通过“半添加剂”方法进行处理。 “半添加”工艺包括形成图案化的光致抗蚀剂层,用导电材料填充光刻胶层中的间隙,去除光刻胶和层压导电层的暴露部分,并用覆盖物覆盖结构。 发明人已经认识到,将铜层层压到热塑性聚酰亚胺层上的过程使热塑性聚酰亚胺层的表面粗糙化,从而将铜层锚定到聚酰亚胺上,这意味着当导电材料沉积到照片中的间隙中时 形成能够牢固地固定在热塑性聚酰亚胺层上的导电体,可以作为柔性电路的电极使用。