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1. 发明申请

WO2016166547A1 CONFIGURABLE NODE DEVICES 审中-公开
标题翻译：可配置的节点设备
公开(公告)号：WO2016166547A1
公开(公告)日：2016-10-20
申请号：PCT/GB2016/051054
申请日：2016-04-15
申请人： RF MODULE AND OPTICAL DESIGN LIMITED
发明人： HOLLAND, Andrew George
IPC分类号： G06F3/01 , G06F3/0484 , H04L29/08 , H04L12/28 , H04Q9/00 , G06F1/16 , G06F3/0346
CPC分类号： G06F3/0484 , G06F3/017 , G06F3/0346 , G08C17/02 , H04L12/4625
摘要： A node device arranged to monitor, measure and/or control an environment in which it is situated, and methods therewith are provided. The node device is arranged to function as a node in a network, and is configurable for a plurality of purposes via a user interface device connected to the node device via the network, such that stimuli to be recognised by the node device can be specified. The device has a receiver arranged to receive signals from one or more other devices in the network; a plurality of sensors arranged to generate output signals, so that a user specifies which one or more sensors of the plurality of sensors are to be used for the one or more purposes for which the node device has been configured; processing circuitry arranged to receive the output signals from the plurality of sensors and signals received by the receiver and to generate a control signal; and an emitter connected to the processing circuitry for receiving the control signal and emitting a signal for reception by one or more receivers in one or more of the other devices in the network or to generate a user perceptible output from the control signal.
摘要翻译：提供了一种用于监视，测量和/或控制其所在环境的节点装置及其方法。节点设备被布置为用作网络中的节点，并且可经由经由网络连接到节点设备的用户接口设备为多个目的配置，使得可以指定要由节点设备识别的刺激。该设备具有被布置成从网络中的一个或多个其他设备接收信号的接收机; 布置成生成输出信号的多个传感器，使得用户指定多个传感器中的哪一个或多个传感器将用于节点设备已被配置的一个或多个目的; 处理电路，被布置成接收来自多个传感器的输出信号和由接收器接收的信号并产生控制信号; 以及连接到处理电路的发射器，用于接收控制信号并且发射用于由网络中的一个或多个其他设备中的一个或多个接收器接收的信号，或者从控制信号产生用户可感知的输出。

2. 发明申请

WO2008155522A2 IMPROVEMENTS RELATING TO SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：关于半导体封装的改进
公开(公告)号：WO2008155522A2
公开(公告)日：2008-12-24
申请号：PCT/GB2008/002028
申请日：2008-06-13
申请人： RF MODULE AND OPTICAL DESIGN LIMITED , HOLLAND, Andrew, George
发明人： HOLLAND, Andrew, George
CPC分类号： H01L25/105 , H01L24/14 , H01L25/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2225/1005 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package comprising a first semiconductor sub-package (40) having a connection face (44) with un-supported connectors (21) depending therefrom arranged to electrically connect a first semiconductor device contained therein to an external circuit, and at least one second semiconductor sub-package (42) also having a connection face (46) with un-supported connectors (25) depending therefrom arranged to electrically connect a second semiconductor device contained therein to an external circuit, the second semiconductor sub-package (42) also having an attachment face (48), on an opposite side thereof from the connection face (46); wherein the second semiconductor sub-package (42) is mounted on the first semiconductor sub-package (40) such that its attachment face (48) is coupled to the connection face (44) of the first semiconductor sub-package (40).
摘要翻译：一种半导体封装，其包括第一半导体子封装（40），该第一半导体子封装（40）具有连接面（44），所述连接面（44）具有从所述第一半导体子封装（40）排出的非支撑连接器（21）半导体子封装（42）还具有连接面（46），所述连接面（46）具有悬置于其中的未支撑的连接器（25），用于将包含在其中的第二半导体器件电连接到外部电路，所述第二半导体子封装（42）也具有在与连接面（46）相反侧的附接面（48）; 其中所述第二半导体子封装（42）安装在所述第一半导体子封装（40）上，使得其附接面（48）联接到所述第一半导体子封装（40）的连接面（44）。

3. 发明申请

WO2005059995A3 SEMICONDUCTOR PACKAGE WITH INTEGRATED HEATSINK AND ELECTROMAGNETIC SHIELD 审中-公开
公开(公告)号：WO2005059995A3
公开(公告)日：2005-06-30
申请号：PCT/GB2004/005217
申请日：2004-12-17
申请人： RF MODULE AND OPTICAL DESIGN LIMITED , HOLLAND, Andrew
发明人： HOLLAND, Andrew
IPC分类号： H01L23/433
摘要： The invention provides a mounting for a printed circuit board which mounting is suitable for receiving a semiconductor assembly wherein the mounting comprises: a base support having a semiconductor assembly facing surface, and an opposed printed surface board facing surface; a cover having a semiconductor assembly facing surface, an opposed heat radiating surface; a connecting formation which joins the cover to the base support and provides an electrical and thermal communication between the cover and the base support wherein the connecting formation has a semiconductor assembly facing surface, an outer opposed surface and a thickness between the two surfaces; and a plurality of package connectors extending from the base support each of which package connectors have a printed surface board facing surface; an array of mountings; and a semiconductor package comprising a semiconductor assembly having one or more semiconductor chips, which assembly is mounted on the mounting wherein the package connectors of the mounting are in a spaced relationship with the base support and are linked electrically with the semiconductor assembly and the cover is arranged to be in a spaced parallel relationship with the base support.

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