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1. 发明申请

WO2008105867A1 METHODS TO PRODUCE HIGH DENSITY, MULTILAYER PRINTED WIRING BOARDS FROM PARALLEL-FABRICATED CIRCUITS AND FILLED VIAS 审中-公开
标题翻译：从并联电路和填充VIAS生产高密度，多层印刷布线的方法
公开(公告)号：WO2008105867A1
公开(公告)日：2008-09-04
申请号：PCT/US2007/026460
申请日：2007-12-28
申请人： ORMET CIRCUITS, INC. , HOLCOMB, Ken
发明人： HOLCOMB, Ken
IPC分类号： B05C1/00 , B05D5/12
CPC分类号： H05K3/4614 , H05K3/386 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4652 , H05K2201/0195 , H05K2201/0394 , H05K2201/10378 , H05K2203/061 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T156/1056
摘要： The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
摘要翻译：本发明提供了通过并行处理制造的质量叠层和互连高密度互连电路层的方法。本发明的方法采用内向外互连策略，其消除通孔的电镀并提供无缺陷的外部电路层。导电浆料和通孔层也是本发明的关键特征。

2. 发明申请

WO2021141932A1 INDIUM SOLDER PASTE COMPOSITIONS 审中-公开
公开(公告)号：WO2021141932A1
公开(公告)日：2021-07-15
申请号：PCT/US2021/012235
申请日：2021-01-06
申请人： ORMET CIRCUITS, INC.
发明人： SHEARER, Catherine A.
IPC分类号： B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , C22C28/00 , B22F1/00 , B22F9/00 , B22F1/0014 , B22F1/0074 , B23K35/025 , B23K35/3613 , B23K35/3615 , B23K35/3618 , C22C1/0483
摘要： The present invention relates to paste compositions comprising an indium metal powder; and an organic vehicle. The organic vehicle includes one or more C8 – C18 fatty acids; a salt formed from a C4 – C6 carboxylic acid and a tertiary alkanolamine; a cationic catalyst; a thixotrope; and a diluent.

3. 发明申请

WO2014127381A1 STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBSTRATES 审中-公开
标题翻译：多层电子基板Z轴互连的结构
公开(公告)号：WO2014127381A1
公开(公告)日：2014-08-21
申请号：PCT/US2014/016999
申请日：2014-02-18
申请人： ORMET CIRCUITS, INC. , INTEGRAL TECHNOLOGY, INC.
发明人： HUNRATH, Christopher A , TRAN, Khang Duy , SHEARER, Catherine A , HOLCOMB, Kenneth C , FRIESEN, G Delbert
IPC分类号： H01L23/48
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/4623 , H05K3/4652 , H05K2201/0195 , H05K2201/10378 , H05K2203/1194
摘要： Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
摘要翻译：本发明的z轴互连结构提供了一种在电子基板中可靠且以任何构造机械地和电气地互连金属化层的手段。本发明的z轴互连结构包括由其形成的新颖的接合膜和导电浆料以及由其形成的一体和两件式的构件结构。

4. 发明申请

WO2018231612A2 METALLIC ADHESIVE COMPOSITIONS HAVING GOOD WORK LIVES AND THERMAL CONDUCTIVITY, METHODS OF MAKING SAME AND USES THEREOF 审中-公开
公开(公告)号：WO2018231612A2
公开(公告)日：2018-12-20
申请号：PCT/US2018/036385
申请日：2018-06-07
申请人： ORMET CIRCUITS, INC.
发明人： WROSCH, Matthew , SHEARER, Catherine A.
IPC分类号： B22F1/00 , B23K35/30 , B23K35/26 , B23K35/36 , B23K35/38 , H01L21/60 , H01L23/488
摘要： Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.

5. 发明申请

WO2014082100A1 ALTERNATIVE COMPOSITIONS FOR HIGH TEMPERATURE SOLDERING APPLICATIONS 审中-公开
标题翻译：高温焊接应用的替代组合物
公开(公告)号：WO2014082100A1
公开(公告)日：2014-05-30
申请号：PCT/US2013/074497
申请日：2014-01-16
申请人： ORMET CIRCUITS INC.
发明人： SHEARER, Catherine A
IPC分类号： B23K35/363 , B23K35/26 , B23K35/14
CPC分类号： B23K35/262 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/264 , B23K35/266 , B23K35/268 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3026 , B23K35/3033 , B23K35/3612 , B23K35/362 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05639 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/2929 , H01L2224/29294 , H01L2224/29301 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29314 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29373 , H01L2224/2938 , H01L2224/29384 , H01L2224/29386 , H01L2224/29411 , H01L2224/29424 , H01L2224/29438 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29449 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29469 , H01L2224/29473 , H01L2224/2948 , H01L2224/29484 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/325 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/832 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83825 , H01L2224/8384 , H05K3/3463 , H01L2924/00014 , H01L2924/01004 , H01L2924/01052 , H01L2924/0108 , H01L2924/01034 , H01L2924/01084 , H01L2924/01048 , H01L2924/01049 , H01L2924/01058 , H01L2924/01047 , H01L2924/01029 , H01L2924/01051 , H01L2924/01083 , H01L2924/00012
摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C to form a dense metallic joint that does not remelt at the original process temperature.
摘要翻译：本发明组合物是在高工作温度和步骤焊接应用中替代高熔点温度的焊膏和预成型件。在本发明的使用中，金属粉末的混合物在低于350℃的温度下反应形成不会在原始工艺温度下重熔的致密金属接头。

6. 发明申请

WO2011078918A3 PREPARATION OF METALLURGIC NETWORK COMPOSITIONS AND METHODS OF USE THEREOF 审中-公开
标题翻译：冶金网络组合物的制备及其使用方法
公开(公告)号：WO2011078918A3
公开(公告)日：2011-10-27
申请号：PCT/US2010055562
申请日：2010-11-05
申请人： ORMET CIRCUITS INC , SHEARER CATHERINE , HOLCOMB KENNETH C , FRIESEN G DELBERT , MATTHEWS MICHAEL C
发明人： SHEARER CATHERINE , HOLCOMB KENNETH C , FRIESEN G DELBERT , MATTHEWS MICHAEL C
IPC分类号： H01B1/02 , B22F3/10 , C22C1/04
CPC分类号： H01B1/02 , B22F3/10 , C22C1/0425 , C22C1/0483 , C22C1/0491 , H01B1/026 , H01L2224/83825 , H01L2224/8384
摘要： The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.
摘要翻译：本发明提供用于电子应用的导电金属组合物及其制备方法和用途。更具体地说，本发明提供金属颗粒瞬态液相烧结组合物，其含有金属和金属合金组分的混合配方，其形成具有增加的稳定性，耐热应力和减轻材料之间CTE失配的能力的互连导电冶金网络。

7. 发明申请

WO2021050453A1 LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM CONDUCTIVE PASTES 审中-公开
公开(公告)号：WO2021050453A1
公开(公告)日：2021-03-18
申请号：PCT/US2020/049803
申请日：2020-09-09
申请人： ORMET CIRCUITS, INC. , MERCK PATENT GMBH
发明人： SHEARER, Catherine, A. , LU, Ping-Hung , CHEN, Chunwei
IPC分类号： H01L21/48 , H01L23/498
摘要： The present invention relates to electrical interconnect structures formed from a lithographically defined polymer coating in conjunction with a conductive paste, and methods for forming same.

8. 发明申请

WO2010114874A3 CONDUCTIVE COMPOSITIONS CONTAINING BLENDED ALLOY FILLERS 审中-公开
标题翻译：含有混合合金填料的导电组合物
公开(公告)号：WO2010114874A3
公开(公告)日：2011-03-03
申请号：PCT/US2010029330
申请日：2010-03-31
申请人： ORMET CIRCUITS INC , SHEARER CATHERINE , HOLCOMB KENNETH C , FRIESEN G DELBERT , MATTHEWS MICHAEL C
发明人： SHEARER CATHERINE , HOLCOMB KENNETH C , FRIESEN G DELBERT , MATTHEWS MICHAEL C
IPC分类号： H01B1/22 , H01B1/02 , H01B1/16
CPC分类号： B22F1/0003 , B22F1/0059 , B22F7/064 , H05K3/321 , H05K2201/0221 , H05K2201/0272
摘要： The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesireable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.
摘要翻译：本发明提供用于形成电子元件之间的互连的导电和导热组合物。本发明组合物包含三种或更多种金属或金属合金颗粒类型和包含特异性应用的助熔剂的有机载体。第一颗粒型包括与其它颗粒中的反应性低熔点金属反应以形成金属间物质的反应性高熔点金属。本发明的反应性低熔点金属以两种不同的颗粒形式提供。第一反应性低熔点金属颗粒包括促进与反应性高熔点金属反应的载体。第二反应性低熔点金属颗粒主要作为反应性低熔点金属的来源。三种颗粒类型的组合提供了几个优点，包括减少载体金属的不希望的特性，同时保留并且在一些实施方案中，增强金属反应的有利促进。

9. 发明申请

WO2003098745A1 METHOD OF ATTACHING CIRCUITRY TO A MODULAR JACK CONNECTOR USING ELECTRICALLY CONDUCTIVE PASTE 审中-公开
标题翻译：使用电导电胶将电路连接到模块插座连接器的方法
公开(公告)号：WO2003098745A1
公开(公告)日：2003-11-27
申请号：PCT/US2003/015352
申请日：2003-05-13
申请人： ORMET CIRCUITS, INC. , GANDHI, Pradeep
发明人： GANDHI, Pradeep
IPC分类号： H01R12/00
CPC分类号： H01R13/665 , H01R13/035 , H05K1/0284 , H05K1/095 , H05K1/119 , H05K3/3447 , H05K3/366 , H05K2201/09118 , H05K2201/10303 , H05K2201/10977
摘要： Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components (60) integrated into the connector are electrically connected to one another and the connector pins (90, 100) by an electrically conductive circuit (110) formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing reduces the number of assembly steps required to manufacture the connector.
摘要翻译：公开了具有集成电子部件的电连接器装置，包括磁性装置。集成到连接器中的电子部件（60）通过直接形成在连接器壳体上的导电电路（110）彼此电连接和连接器引脚（90,100）。直接在连接器壳体上形成导电电路减少了制造连接器所需的组装步骤数量。

10. 发明申请

WO2019113208A1 METALLURGICAL COMPOSITIONS WITH THERMALLY STABLE MICROSTRUCTURES FOR ASSEMBLY IN ELECTRONIC PACKAGING 审中-公开
公开(公告)号：WO2019113208A1
公开(公告)日：2019-06-13
申请号：PCT/US2018/064070
申请日：2018-12-06
申请人： ORMET CIRCUITS, INC.
发明人： SHEARER, Catherine, A.
IPC分类号： B23K35/26 , B23K35/02 , B23K1/20 , H01L23/00 , B22F1/00 , B23K35/30 , H01K1/20
摘要： Paste compositions comprising 40-70 percent by weight (wt%) of a low melting point (LMP) particle composition comprising Y; 25-65 wt% of a high melting point (HMP) particle composition comprising M; and 1-15 wt% of a fluxing vehicle. The reaction products formed between M and Y are crystalline intermetallics that are solids at temperature T1 and the surface area of said HMP particle composition is in the range of 0.07 to 0.18 square meters per gram of Y in said composition. Also provided are methods of contacting electronic compositions using the paste compositions.

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