专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011053560A3 SEMICONDUCTOR WAFER RE-USE USING CHEMICAL MECHANICAL POLISHING 审中-公开
公开(公告)号：WO2011053560A3
公开(公告)日：2011-05-05
申请号：PCT/US2010/054015
申请日：2010-10-26
申请人： CORNING INCORPORATED , BANKAITIS, Jonas , MOORE, Michael, J.
发明人： BANKAITIS, Jonas , MOORE, Michael, J.
IPC分类号： H01L21/304
摘要： Methods and apparatus for reducing damage of a semiconductor donor wafer include the steps of: (a) rotating a polishing pad, rotating the semiconductor donor wafer, applying a polishing slurry to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together; and (b) rotating the polishing pad and the semiconductor donor wafer, discontinuing the application of the polishing slurry, applying a rinsing fluid to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together, wherein step (a) followed by step (b) is carried out in sequence at least two times, and at least one of the following are reduced in at least two successive intervals of step (a): (i) a pressure at which the semiconductor donor wafer and the polishing pad are pressed together, (ii) a mean particle size of an abrasive within the polishing slurry, and (iii) a concentration of the slurry in water and stabilizers.

2. 发明申请

WO2010059361A3 METHODS AND APPARATUS FOR PRODUCING SEMICONDUCTOR ON INSULATOR STRUCTURES USING DIRECTED EXFOLIATION 审中-公开
标题翻译：使用直接去除法在绝缘体结构上制造半导体的方法和设备
公开(公告)号：WO2010059361A3
公开(公告)日：2010-08-12
申请号：PCT/US2009062504
申请日：2009-10-29
申请人： CORNING INC , CHEREKDJIAN SARKO , CITES JEFFREY S , COUILLARD JAMES G , MASCHMEYER RICHARD O , MOORE MICHAEL J , USENKO ALEX
发明人： CHEREKDJIAN SARKO , CITES JEFFREY S , COUILLARD JAMES G , MASCHMEYER RICHARD O , MOORE MICHAEL J , USENKO ALEX
IPC分类号： H01L21/762
CPC分类号： H01L21/76254
摘要： Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y- axial directions.
摘要翻译：提供了用于形成绝缘体上半导体（SOI）结构的方法和设备，其包括使施主半导体晶片的注入表面经受离子注入步骤以在限定供体半导体晶片的剥离层的横截面中产生弱化层 ; 以及在所述离子注入步骤之前，期间或之后使所述施主半导体晶片经历空间变化步骤，使得所述弱化层的至少一个参数在X轴和Y轴中的至少一个中在所述弱化层上在空间上变化方向。

3. 发明申请

WO2013055426A1 HEALTHCARE FORM ASSEMBLY HAVING A PLURALITY OF REMOVABLE STRIPS WITH PERFORATED LINER PORTION 审中-公开
标题翻译：具有多余的可拆卸的带有执行衬管部分的条纹的健康形式组装
公开(公告)号：WO2013055426A1
公开(公告)日：2013-04-18
申请号：PCT/US2012/047980
申请日：2012-07-24
申请人： AVERY DENNISON CORPORATION , DEHLINGER, Anne, M. , MOORE, Michael, J. , BECKER, William , SARDESAI, Rajendra, G.
发明人： DEHLINGER, Anne, M. , MOORE, Michael, J. , BECKER, William , SARDESAI, Rajendra, G.
IPC分类号： A61M25/02
CPC分类号： A61M25/02 , A61F13/0246 , A61F13/0259 , A61F13/0269 , A61M2025/0266 , C09J7/22 , C09J2201/20
摘要： A healthcare form assembly is described which includes a carrier sheet, a release coating applied to the carrier sheet, one or more regions of pressure sensitive adhesive adjacent the release coating, and a printable facestock sheet in contact with the adhesive and being removably disposed on the carrier sheet. The printable facestock sheet includes a collection of cut lines to thereby form adhesive strips which can be readily removed from the carrier sheet. The carrier sheet includes one or more weakened separation lines that facilitate use of the healthcare assembly and in particular, removal of the adhesive strips. Particular features such as peel zones and fingerlifts are also described.
摘要翻译：描述了一种保健形式组件，其包括载体片，施加到载体片的剥离涂层，与剥离涂层相邻的一个或多个压敏粘合剂区域，以及与粘合剂接触的可印刷的面材片，并且可移除地设置在载板。可印刷的面材片材包括切割线的集合，从而形成可以容易地从载体片材移除的粘合剂条带。载体片包括一个或多个弱化的分离线，其有助于保健组件的使用，特别是去除粘合剂条。还描述了诸如剥离区和指纹的特殊特征。

4. 发明申请

WO2010088501A3 MATERIAL SHEET HANDLING SYSTEM AND PROCESSING METHODS 审中-公开
标题翻译：材料处理系统和处理方法
公开(公告)号：WO2010088501A3
公开(公告)日：2011-05-12
申请号：PCT/US2010022558
申请日：2010-01-29
申请人： CORNING INC , CHANG CHESTER H , MOORE MICHAEL J , NISHIMOTO MICHAEL Y , ZHANG CHUNHE
发明人： CHANG CHESTER H , MOORE MICHAEL J , NISHIMOTO MICHAEL Y , ZHANG CHUNHE
IPC分类号： H01L21/00 , B23K26/14 , B28D5/00 , H01L21/683
CPC分类号： H01L21/78 , B28D5/0047 , B28D5/0052 , B33Y80/00 , H01L21/67017 , H01L21/67092 , H01L21/6838 , Y10T83/0591 , Y10T83/364
摘要： Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to dice the material sheet when suspended.
摘要翻译：方法和设备提供将受控的气体供给到至少一个航空机械装置以赋予气流以悬浮材料片材; 防止材料片在悬挂时在至少一个方向上的横向移动; 并且从与所述至少一个航空机械装置相对的所述材料片的一侧施加水流，以在悬挂时切割所述材料片。

5. 发明申请

WO2010059361A2 METHODS AND APPARATUS FOR PRODUCING SEMICONDUCTOR ON INSULATOR STRUCTURES USING DIRECTED EXFOLIATION 审中-公开
公开(公告)号：WO2010059361A2
公开(公告)日：2010-05-27
申请号：PCT/US2009/062504
申请日：2009-10-29
申请人： CORNING INCORPORATED , CHEREKDJIAN, Sarko , CITES, Jeffrey, S. , COUILLARD, James, G. , MASCHMEYER, Richard, O. , MOORE, Michael, J. , USENKO, Alex
发明人： CHEREKDJIAN, Sarko , CITES, Jeffrey, S. , COUILLARD, James, G. , MASCHMEYER, Richard, O. , MOORE, Michael, J. , USENKO, Alex
IPC分类号： H01L21/762
CPC分类号： H01L21/76254
摘要： Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y- axial directions.

6. 发明申请

WO2005032487A3 ANGIOTENSIN-CONVERTING ENZYME-2 AS A RECEPTOR FOR THE SARS CORONAVIRUS 审中-公开
标题翻译： ANGIOTENSIN转化酶2作为非典型肺炎克雷伯菌的受体
公开(公告)号：WO2005032487A3
公开(公告)日：2006-03-02
申请号：PCT/US2004032877
申请日：2004-10-05
申请人： BRIGHAM & WOMENS HOSPITAL , FARZAN MICHAEL , LI WENHUI , MOORE MICHAEL J
发明人： FARZAN MICHAEL , LI WENHUI , MOORE MICHAEL J
IPC分类号： A61K20060101 , C07K14/705 , C12N7/01 , C12N9/48 , C12N15/86 , C12Q1/70 , G01N33/569 , C12N7/00 , C07K16/28 , C12N5/10 , C12N7/02 , C12N15/12 , C12N15/63
CPC分类号： G01N33/56983 , C07K14/70596 , C12N9/48 , G01N2333/165 , G01N2333/948 , G01N2500/02
摘要： The present invention is based upon the identification of human angiotensinconverting enzyme-2 (ACE-2) as a functional receptor for the SARS coronavirus. Transfection of cells with ACE-2 confers upon them the ability to support viral replication. In addition, assays performed using ACE-2 together with the S protein of the SARS virus or a fragment derived from the S protein can be used to identify inhibitors that block the interaction between virus and host cell.
摘要翻译：本发明基于鉴定人血管紧张素转换酶-2（ACE-2）作为SARS冠状病毒的功能受体。用ACE-2转染细胞给予他们支持病毒复制的能力。此外，使用ACE-2与SARS病毒的S蛋白或衍生自S蛋白的片段进行的测定可用于鉴定阻断病毒和宿主细胞之间的相互作用的抑制剂。

7. 发明申请

WO2005032487A2 ANGIOTENSIN-CONVERTING ENZYME-2 AS A RECEPTOR FOR THE SARS CORONAVIRUS 审中-公开
标题翻译： ANGIOTENSIN转化酶2作为非典型肺炎克雷伯菌的受体
公开(公告)号：WO2005032487A2
公开(公告)日：2005-04-14
申请号：PCT/US2004/032877
申请日：2004-10-05
申请人： THE BRIGHAM AND WOMEN'S HOSPITAL, INC. , FARZAN, Michael , LI, Wenhui , MOORE, Michael, J.
发明人： FARZAN, Michael , LI, Wenhui , MOORE, Michael, J.
IPC分类号： A61K
CPC分类号： G01N33/56983 , C07K14/70596 , C12N9/48 , G01N2333/165 , G01N2333/948 , G01N2500/02
摘要： The present invention is based upon the identification of human angiotensinconverting enzyme-2 (ACE-2) as a functional receptor for the SARS coronavirus. Transfection of cells with ACE-2 confers upon them the ability to support viral replication. In addition, assays performed using ACE-2 together with the S protein of the SARS virus or a fragment derived from the S protein can be used to identify inhibitors that block the interaction between virus and host cell.
摘要翻译：本发明基于鉴定人血管紧张素转换酶-2（ACE-2）作为SARS冠状病毒的功能受体。用ACE-2转染细胞给予他们支持病毒复制的能力。此外，使用ACE-2与SARS病毒的S蛋白或衍生自S蛋白的片段进行的测定可用于鉴定阻断病毒和宿主细胞之间的相互作用的抑制剂。

8. 发明申请

WO2011066491A3 METHODS AND APPARATUS FOR EDGE CHAMFERING OF SEMICONDUCTOR WAFERS USING CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：使用化学机械抛光的半导体波形边缘切割的方法和装置
公开(公告)号：WO2011066491A3
公开(公告)日：2012-03-29
申请号：PCT/US2010058153
申请日：2010-11-29
申请人： CORNING INC , BANKAITIS JONAS , MOORE MICHAEL J , STONE JEFFERY S , WILLIAMSON PAUL J , ZHANG CHUNHE
发明人： BANKAITIS JONAS , MOORE MICHAEL J , STONE JEFFERY S , WILLIAMSON PAUL J , ZHANG CHUNHE
IPC分类号： H01L21/304 , H01L21/02 , H01L21/306
CPC分类号： H01L21/304 , H01L21/02021 , H01L21/02032 , H01L21/30625
摘要： Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.
摘要翻译：用于处理施主半导体晶片的边缘部分的方法和装置包括控制化学机械抛光参数以实现施主半导体晶片的边缘的倒角; 并且替代地或附加地弯曲施主半导体晶片以呈现凹形结构，其中其边缘部分与其中心表面区域相比更显着，使得施主半导体晶片的显着边缘部分优先按照抛光表面被抛光实现倒角。

9. 发明申请

WO2011053560A2 SEMICONDUCTOR WAFER RE-USE USING CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：半导体晶片再使用化学机械抛光
公开(公告)号：WO2011053560A2
公开(公告)日：2011-05-05
申请号：PCT/US2010054015
申请日：2010-10-26
申请人： CORNING INC , BANKAITIS JONAS , MOORE MICHAEL J
发明人： BANKAITIS JONAS , MOORE MICHAEL J
IPC分类号： H01L21/304
CPC分类号： H01L21/02024 , H01L21/02032 , H01L21/76254
摘要： Methods and apparatus for reducing damage of a semiconductor donor wafer include the steps of: (a) rotating a polishing pad, rotating the semiconductor donor wafer, applying a polishing slurry to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together; and (b) rotating the polishing pad and the semiconductor donor wafer, discontinuing the application of the polishing slurry, applying a rinsing fluid to the polishing pad, and pressing the semiconductor donor wafer and the polishing pad together, wherein step (a) followed by step (b) is carried out in sequence at least two times, and at least one of the following are reduced in at least two successive intervals of step (a): (i) a pressure at which the semiconductor donor wafer and the polishing pad are pressed together, (ii) a mean particle size of an abrasive within the polishing slurry, and (iii) a concentration of the slurry in water and stabilizers.
摘要翻译：用于减少半导体施主晶片的损坏的方法和设备包括以下步骤：（a）旋转抛光垫，旋转半导体施主晶片，将抛光浆施加到抛光垫，并且将半导体施主晶片和抛光垫压在一起 ; 和（b）旋转抛光垫和半导体施主晶片，停止施加抛光浆料，将漂洗流体施加到抛光垫上，并将半导体施主晶片和抛光垫压在一起，其中步骤（a）然后是步骤（b）依次进行至少两次，并且在步骤（a）的至少两个连续间隔中减少至少一个：（i）半导体给体晶片和抛光垫的压力（ii）研磨浆料内的研磨剂的平均粒径，和（iii）浆料在水中和稳定剂中的浓度。

10. 发明申请

WO2008131301A1 SURFACES, METHODS AND DEVICES EMPLOYING CELL ROLLING 审中-公开
标题翻译：表面，方法和使用细胞滚动的装置
公开(公告)号：WO2008131301A1
公开(公告)日：2008-10-30
申请号：PCT/US2008/060934
申请日：2008-04-18
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , KARP, Jeffrey, M. , MOORE, Michael, J. , KHADEMHOSSEINI, Ali , LANGER, Robert, S. , HONG, Seungpyo
发明人： KARP, Jeffrey, M. , MOORE, Michael, J. , KHADEMHOSSEINI, Ali , LANGER, Robert, S. , HONG, Seungpyo
IPC分类号： A61K38/36
CPC分类号： A61L27/3808 , A61L27/34 , A61L27/507 , A61L27/54 , A61L27/58 , A61L31/005 , A61L31/10 , A61L31/148 , A61L31/16 , A61L2300/25 , A61L2300/252 , A61L2400/06
摘要： In various aspects, the present invention provides surfaces and materials for cell rolling applications, methods of making such surfaces and materials, and devices having such surfaces and materials. In some embodiments, the present invention provides surfaces with at least partial coatings of an ordered layer of cell adhesion molecules, or fragments, analogs, or modifications thereof, covalently bound to the surface of the substrate through an immobilization moiety. In some embodiments, the layer of a cell adhesion molecules further comprises a cell modifying ligand that can be targeted, e.g ., to one or more specific cell types.
摘要翻译：在各个方面，本发明提供了用于电池轧制应用的表面和材料，制造这种表面和材料的方法，以及具有这种表面和材料的装置。在一些实施方案中，本发明提供具有细胞粘附分子或其片段，类似物或修饰的有序层的至少部分涂层的表面，其通过固定部分共价结合到所述底物的表面。在一些实施方案中，细胞粘附分子的层还包含可靶向例如一种或多种特定细胞类型的细胞修饰配体。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式