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    • 3. 发明申请
    • TISSUE INTERFACE DEVICE
    • 组装界面装置
    • WO0135820A9
    • 2002-05-16
    • PCT/US0031765
    • 2000-11-17
    • SPECTRX INCALTEA TECH INCFAUPEL MARK LKUMAR KRISHNAFARQUHAR DAVIDVREEKE MARKSMITH ALANHATCH MICHAELWOODS TERESA
    • FAUPEL MARK LKUMAR KRISHNAFARQUHAR DAVIDVREEKE MARKSMITH ALANHATCH MICHAELWOODS TERESA
    • G01N33/487A61B5/00G01N33/48
    • A61B5/1486
    • A tissue interface device (10) suitable for positioning on or about one or more artificial openings in a biological membrane of an organism and for coupling to a monitor and control unit and a vacuum source. The tissue interface device (10) comprises a housing (100), a sensor channel (130), and a sensor (150). The housing (100) defines an orifice (120), the orifice (120) having an open inlet port (122) on the bottom end (102) of the housing (100) and a distal end (124) that is in fluid communication with the sensor channel (130). The orifice (120) is in fluid communication with fluid that flows from the artificial opening formed in the biological membranes. The sensor channel (130) is for coupling to, and fluid communication therewith, the vacuum source. The sensor (150) is positioned in the sensor channel (130) in a flow path of the fluid for sensing a characteristic of the fluid as it flows out from the artificial opening. The sensor generates a sensor signal representative thereof.
    • 适于定位在生物体的生物膜中的一个或多个人造开口上或周围的组织界面装置(10),并用于耦合到监测和控制单元和真空源。 组织接口装置(10)包括壳体(100),传感器通道(130)和传感器(150)。 壳体(100)限定孔口(120),孔口(120)在壳体(100)的底端(102)上具有开放的入口端口(122)和远端(124),该远端端部 与传感器通道(130)连接。 孔口(120)与从生物膜中形成的人造开口流动的流体流体连通。 传感器通道(130)用于耦合到真空源并与之流体连通。 传感器(150)在流体的流动路径中位于传感器通道(130)中,用于感测流体从人造开口流出时的特性。 传感器产生代表其的传感器信号。
    • 4. 发明申请
    • METHOD AND SYSTEM FOR WEBPAGE REGRESSION TESTING
    • 用于网格回归测试的方法和系统
    • WO2013003679A2
    • 2013-01-03
    • PCT/US2012044823
    • 2012-06-29
    • AMERICAN EXPRESS TRAVEL RELATEKUMAR KRISHNA BIHARINARSIPUR KESHAV AGREINER HANS-JURGEN
    • KUMAR KRISHNA BIHARINARSIPUR KESHAV AGREINER HANS-JURGEN
    • G06K9/68
    • G06K9/00442G06F11/3688G06K9/6202
    • A regression testing system comprises an automatic test tool configured to capture a first web screen shot and a second web screen shot of a webpage. where the webpage has undergone an update or edit. The regression testing system also comprises a visual comparator configured to identify similar areas in the first web screen shot and the second web screen shot. The visual comparator receives, and compares characteristics of, the web screen shots. Furthermore, the regression testing system generates a report, with marked different characteristics between the first and second web screen shots. The regression testing system identifies similar areas in the first and second web screen shots shot even if the similar areas are at different locations within the web screen shots. The comparison performed by the visual comparator includes performing a pixel comparison combined with a marking algorithm to group differences in smaller, related but separate areas.
    • 回归测试系统包括被配置为捕获网页的第一网络屏幕截图和第二网络屏幕截图的自动测试工具。 网页已经进行了更新或编辑。 回归测试系统还包括被配置为识别第一网络屏幕截图和第二网络屏幕截图中的相似区域的视觉比较器。 视觉比较器接收并比较网络屏幕截图的特征。 此外,回归测试系统生成报告,在第一个和第二个Web屏幕截图之间具有不同的特征。 回归测试系统识别第一和第二网络屏幕截图中的相似区域,即使相似的区域在网络屏幕截图内的不同位置。 由可视比较器执行的比较包括执行与标记算法组合的像素比较,以对较小的相关但分开的区域中的差异进行分组。
    • 9. 发明申请
    • METHOD OF FORMING MONOLITHIC CMOS-MEMS HYBRID INTEGRATED, PACKAGED STRUCTURES
    • 形成单片CMOS-MEMS混合集成的包装结构的方法
    • WO2011003057A3
    • 2011-04-14
    • PCT/US2010040890
    • 2010-07-02
    • ADVANCED MICROFAB LLCKUMAR KRISHNA GCHOKSI NISHIT ACHALIL JOSEPH M
    • KUMAR KRISHNA GCHOKSI NISHIT ACHALIL JOSEPH M
    • H01L21/8238B82B3/00H01L27/092
    • H01L27/0617B81C1/0023B81C1/00238H01L24/82H01L2224/24137H01L2224/24227H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01019H01L2924/01029H01L2924/01032H01L2924/01033H01L2924/01047H01L2924/01074H01L2924/01077H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/01322H01L2924/014H01L2924/09701H01L2924/14H01L2924/1461H01L2924/19041H01L2924/00
    • A method of forming Monolithic CMOS-MEMS hybrid integrated, packaged structures includes the steps of providing: providing at least one semiconductor substrate having a CMOS device area including dielectric layers and metallization layers; applying at least one protective layer overlying the CMOS device area; forming at least one opening on the protective layer and patterning the dielectric and metallization layers to access the semiconductor substrate; forming at least one opening on the semiconductor substrate by etching the dielectric and metallization layers; applying at least one filler layer in the at least one opening on the semiconductor substrate; positioning at least one chip on the filler layer, the chip including a prefabricated front face and a bare backside; applying a first insulating layer covering the front face of the chip providing continuity from the semiconductor substrate to the chip; forming at least one via opening on the insulating layer covering the chip to access at least one contact area; applying at least one metallization layer overlying the insulating layer on the substrate and the chip connecting the metallization layer on the substrate to the at least one another contact area on the chip; applying a second insulating layer overlying the metallization layer on the at least one chip; applying at least one interfacial layer; applying at least one rigid substrate overlying the interfacial layer; and applying at least one secondary protective layer overlying the rigid substrate.
    • 一种形成单片CMOS-MEMS混合集成封装结构的方法包括以下步骤:提供至少一个具有包括电介质层和金属化层的CMOS器件区域的半导体衬底; 施加覆盖在CMOS器件区域上的至少一个保护层; 在所述保护层上形成至少一个开口,并且对所述电介质层和金属化层进行图形化以进入所述半导体衬底; 通过蚀刻所述电介质层和金属化层在所述半导体衬底上形成至少一个开口; 在所述半导体衬底上的所述至少一个开口中施加至少一个填充层; 将至少一个芯片定位在填充层上,该芯片包括预制的正面和裸露的背面; 施加覆盖芯片前表面的第一绝缘层,从半导体衬底到芯片提供连续性; 在覆盖芯片的绝缘层上形成至少一个通孔,以进入至少一个接触区域; 施加覆盖在所述衬底上的所述绝缘层上的至少一个金属化层和将所述衬底上的所述金属化层连接到所述芯片上的所述至少另一个接触区域中的所述芯片; 在所述至少一个芯片上施加覆盖所述金属化层的第二绝缘层; 施加至少一个界面层; 施加覆盖在界面层上的至少一个刚性基材; 以及施加覆盖在刚性基底上的至少一个二次保护层。