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1. 发明申请

WO2009020464A9 CONDUCTIVE PATTERNS AND METHODS OF USING THEM 审中-公开
标题翻译：导电模式和使用它们的方法
公开(公告)号：WO2009020464A9
公开(公告)日：2009-04-30
申请号：PCT/US2007078918
申请日：2008-03-18
申请人： FRY METALS INC , KHASELEV OSCAR , DESAI NITIN , MARCZI MICHAEL T , SINGH BAWA
发明人： KHASELEV OSCAR , DESAI NITIN , MARCZI MICHAEL T , SINGH BAWA
IPC分类号： H01F5/00
CPC分类号： H01F5/003 , B22F2998/00 , C09D11/52 , H01L51/0022 , H05K3/1241 , H05K3/1258 , H05K3/38 , H05K2201/098 , H05K2201/09909 , H05K2203/0568 , H05K2203/0769 , H05K2203/1105 , H05K2203/1131 , H05K2203/1476 , B22F1/0062
摘要： Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
摘要翻译：公开了使用和印刷这种导电图案的导电图案和方法。在某些示例中，导电图案可以通过将导电材料设置在衬底上的支撑物之间来产生。支撑件可被移除以提供具有期望长度和/或几何形状的导电图案。

2. 发明申请

WO2004112095A3 THERMOPLASTIC FLUXING UNDERFILL COMPOSITION AND METHOD 审中-公开
标题翻译：热塑性氟化组合物和方法
公开(公告)号：WO2004112095A3
公开(公告)日：2006-10-26
申请号：PCT/US2004018569
申请日：2004-06-14
申请人： FRY METALS INC , WILSON MARK , GARRETT DAVID
发明人： WILSON MARK , GARRETT DAVID
IPC分类号： H01L23/29 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/56
CPC分类号： H01L21/563 , H01L23/293 , H01L2224/73104 , H01L2224/73203 , H01L2924/01004 , H01L2924/01025 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/09701
摘要： A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods and materials for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
摘要翻译：具有焊锡凸块和热塑性和助熔剂的底部填充物的倒装芯片以及用于制造这种装置的方法和材料。所得到的器件非常适用于印刷电路板的简单的一步应用，从而简化了倒装芯片制造工艺。

3. 发明申请

WO2005007919A3 COATING METAL PARTICLES 审中-公开
标题翻译：涂覆金属颗粒
公开(公告)号：WO2005007919A3
公开(公告)日：2005-07-21
申请号：PCT/US2004022079
申请日：2004-07-09
申请人： FRY METALS INC , ARORA SANYOGITA , MINOGUE GERARD
发明人： ARORA SANYOGITA , MINOGUE GERARD
IPC分类号： B05D7/00 , B22F1/00 , B23K35/34 , B32B5/16 , C23C20060101 , H05K3/34
CPC分类号： B22F1/0062 , B22F1/0059 , B22F2998/00 , B23K35/34 , H05K3/3484 , H05K2201/0224 , H05K2203/0425 , H05K2203/105 , Y10T428/2991 , Y10T428/2998
摘要： A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.
摘要翻译：制备颗粒以保留电荷的方法，使得颗粒呈静电或电动方式移动。该方法包括用促进电荷导向剂材料附着的涂覆介质涂覆颗粒，并用电荷导向介质使颗粒与其上的涂覆介质接触，以向其施加正电荷或负电荷，从而使颗粒静电或电动移动。用于静电或电动沉积工艺的静电和电动移动颗粒。颗粒包括涂覆介质和颗粒体上的电荷导向剂。

4. 发明申请

WO2005033352A3 DEPOSITION AND PATTERNING PROCESS 审中-公开
标题翻译：沉积和图案化过程
公开(公告)号：WO2005033352A3
公开(公告)日：2005-07-14
申请号：PCT/US2004022143
申请日：2004-07-09
申请人： FRY METALS INC , LEWIS BRIAN G , SINGH BAWA , DETIG ROBERT H , MINOGUE GERARD , EBERLEIN DIETMAR C , REILLY KENNETH , MARCZI MICHAEL
发明人： LEWIS BRIAN G , SINGH BAWA , DETIG ROBERT H , MINOGUE GERARD , EBERLEIN DIETMAR C , REILLY KENNETH , MARCZI MICHAEL
IPC分类号： B01J19/08 , B05D1/06 , B05D1/32 , B23K3/06 , C23C20060101 , H01L21/288 , H01L21/48 , H01L21/60 , H05K3/34
CPC分类号： H05K3/3484 , B23K3/0607 , H01L21/288 , H01L21/2885 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03622 , H01L2224/03912 , H01L2224/0401 , H01L2224/05023 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/11005 , H01L2224/11332 , H01L2224/11334 , H01L2224/114 , H01L2224/11442 , H01L2224/116 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01049 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/12042 , H05K3/3478 , H05K2203/0338 , H05K2203/041 , H05K2203/0425 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/13099 , H01L2924/00014 , H01L2924/00
摘要： A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
摘要翻译：通过电动或静电方式直接或通过使用中间工具将图案中的颗粒施加到基底上的方法。通过电动或静电方式直接或通过使用中间工具将金属颗粒（例如焊料金属）以图案施加到电子器件基板的方法。

5. 发明申请

WO1988004962A1 APPARATUS AND METHOD FOR DETERMINING SURFACE IONIC CONTAMINATION LEVELS OF ELECTRONIC ASSEMBLIES SUCH AS PRINTED CIRCUIT ASSEMBLIES 审中-公开
标题翻译：用于确定电子组件的表面离子污染水平的装置和方法如印刷电路组件
公开(公告)号：WO1988004962A1
公开(公告)日：1988-07-14
申请号：PCT/US1987003490
申请日：1987-12-22
申请人： FRY METALS INC.
发明人： FRY METALS INC. , Brous, Jack
IPC分类号： B08B03/04
CPC分类号： H05K3/26 , G01N27/06 , H05K2203/0783 , H05K2203/1518 , H05K2203/163
摘要： A method and apparatus for determining the surface ionic contamination level on an electronic assembly utilizes deionized, heated solvent mixtures consisting essentially of water and a water miscible solvent which, when heated well above room temperature, has a vapor pressure substantially less than that of water at the same temperature. A solvent mixture is pumped from a solvent reservoir (12) by the centrifugal pump (26), heated in a heater (30) and sprayed through conduits (18), (29), (24) and (20) on said electronic assembly (14). The water miscible solvent acts quickly on the electronic assembly (14) to dissolve and to remove the non-ionic residues, thereby exposing the ionic contaminants such that they may be dissolved and removed from said assembly (14). The aqueous solution (12) flows from the enclosure (10) to a dynamic contamination measurement apparatus (34) for the determination of the ionic contamination level in the assembly (14), then returns to the solvent reservoir (12). A change in an electrical property of the mixture, such as conductivity or resistivity, due to the presence of the dissolved ionic contaminants is measured to obtain an indication of the ionic contamination level originally present in said electronic assembly (14).
摘要翻译：用于确定电子组件上的表面离子污染物水平的方法和装置使用基本上由水和水混溶性溶剂组成的去离子，加热的溶剂混合物，当加热到高于室温时，其蒸气压显着小于水的蒸气压相同的温度。溶剂混合物通过离心泵（26）从溶剂储存器（12）泵送，在加热器（30）中加热并通过所述电子组件上的导管（18），（29），（24）和（20）喷射（14）。水混溶性溶剂快速地作用于电子组件（14）以溶解和去除非离子残余物，从而暴露离子污染物，使得它们可以从所述组件（14）中溶解并除去。水溶液（12）从外壳（10）流动到动态污染测量设备（34），用于确定组件（14）中的离子污染物水平，然后返回到溶剂容器（12）。测量由于溶解的离子污染物的存在而导致的混合物电性能的变化，例如导电性或电阻率，以获得最初存在于所述电子组件（14）中的离子污染水平的指示。

6. 发明申请

WO2008049006A2 MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELATED METHODS 审中-公开
标题翻译：与电气设备互连使用的材料及相关方法
公开(公告)号：WO2008049006A2
公开(公告)日：2008-04-24
申请号：PCT/US2007081650
申请日：2007-10-17
申请人： FRY METALS INC , MARCZI MICHAEL T , KOEP PAUL , DE MONCHY MICHEL A , FINKE MARTINUS N , LEWIS BRIAN
发明人： MARCZI MICHAEL T , KOEP PAUL , DE MONCHY MICHEL A , FINKE MARTINUS N , LEWIS BRIAN
IPC分类号： H01L23/48
CPC分类号： H05K3/3484 , B23K35/262 , B23K35/264 , B23K35/302 , H01L23/3736 , H01L24/83 , H01L31/02008 , H01L31/048 , H01L2224/8181 , H01L2224/81825 , H01L2224/83224 , H01L2224/83801 , H01L2224/8381 , H01L2924/01322 , H01L2924/01327 , H01L2924/12042 , H01L2924/13055 , H05K3/341 , H05K3/3463 , H05K2201/0209 , H05K2201/068 , H05K2201/10992 , H05K2203/0415 , Y02E10/50 , Y02P70/613 , H01L2924/3512 , H01L2924/00
摘要： Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
摘要翻译：本文公开的某些实例涉及被设计用于诸如印刷电路板和太阳能电池的电气设备的互连中的材料。在某些实例中，可以使用两步焊料来减少用于电气设备生产中的材料的应力。

7. 发明申请

WO2006125089A3 MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES 审中-公开
标题翻译：用于电子沉积和掩模方法的掩模和方法
公开(公告)号：WO2006125089A3
公开(公告)日：2007-11-22
申请号：PCT/US2006019250
申请日：2006-05-18
申请人： FRY METALS INC , KHASELEV OSCAR , LEWIS BRIAN G , MARCZI MICHAEL , SINGH BAWA
发明人： KHASELEV OSCAR , LEWIS BRIAN G , MARCZI MICHAEL , SINGH BAWA
IPC分类号： B05D1/06 , B05C17/06 , B05D1/18
CPC分类号： C25D13/00 , B23K3/0623 , B23K2201/42 , C25D5/022 , C25D13/22 , C25D15/00 , H01L21/2885 , H01L24/11 , H01L24/12 , H01L2224/05001 , H01L2224/05023 , H01L2224/05124 , H01L2224/05155 , H01L2224/05171 , H01L2224/05568 , H01L2224/11505 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/3025 , H05K3/3484 , H05K2203/0425 , H05K2203/0557 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/05599
摘要： A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.
摘要翻译：一种用于施加到基底以便于将带电粒子电动沉积到基底上的掩模，该掩模包括导电层，电介质层和掩模开口。一种将带电粒子图案应用于基板的方法，包括：将上述基板施加到掩模基板上; 将掩蔽的基板浸入含有带电粒子的浴中; 并且在掩模的导电层和对电极之间建立电位，从而通过掩模开口电动地将颗粒沉积到暴露在掩模开口中的基板的区域上。通过这种方法制成的产品。

8. 发明申请

WO2006086440A3 THERMALLY RESPONSIVE PRESSURE RELIEF PLUG AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：温度响应压力缓冲器及其制造方法
公开(公告)号：WO2006086440A3
公开(公告)日：2006-10-26
申请号：PCT/US2006004376
申请日：2006-02-08
申请人： FRY METALS INC , GODIJN PAUL W , LUSSE PATRICK , FINKE MARTINUS
发明人： GODIJN PAUL W , LUSSE PATRICK , FINKE MARTINUS
IPC分类号： F16K17/38 , B65D83/14
CPC分类号： F16K17/383
摘要： A preformed pressure relief plug (10) for insertion into a cavity of a vessel or valve. The plug may be formed of a eutectic alloy of bismuth, indium and tin.
摘要翻译：一种用于插入容器或阀的空腔中的预制压力释放塞（10）。插塞可以由铋，铟和锡的共晶合金形成。

9. 发明申请

WO2006091833A2 PREPARATION OF METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION 审中-公开
标题翻译：用于电动或静电沉积的金属颗粒的制备
公开(公告)号：WO2006091833A2
公开(公告)日：2006-08-31
申请号：PCT/US2006006632
申请日：2006-02-24
申请人： FRY METALS INC , KHASELEV OSCAR , LEWIS BRIAN G
发明人： KHASELEV OSCAR , LEWIS BRIAN G
IPC分类号： H01B1/12
CPC分类号： G03G9/09708 , B22F1/0062 , B22F1/0074 , B22F2998/10 , G03G9/0902 , G03G9/09716 , H05K3/3484 , H05K2203/0425 , H05K2203/09 , H05K2203/105 , Y10T428/2982 , Y10T428/2991
摘要： Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.
摘要翻译：用于电动或静电沉积的金属颗粒以及用于制造这种颗粒的方法，该金属颗粒包含金属颗粒体，颗粒体上的有机酸膜和粘附在有机酸膜上的电荷导向剂。

10. 发明申请

WO2004038052B1 FRICTION-RESISTANT ALLOY FOR USE AS A BEARING 审中-公开
标题翻译：耐磨合金用作轴承
公开(公告)号：WO2004038052B1
公开(公告)日：2004-06-24
申请号：PCT/US0333430
申请日：2003-10-22
申请人： FRY METALS INC
发明人： LAUGHLIN JOHN P , KYAW DAVID V
IPC分类号： C22C11/00 , C22C13/00 , C22C13/02 , F16C33/14
CPC分类号： C22C13/00 , C22C13/02 , F16C33/14 , F16C2223/42 , F16C2223/46
摘要： A friction-resistant alloy being a tin matrix containing copper, antimony, and between about 0.10% and about 2% by weight bismuth; and an industrial bearing component having this alloy on a wear surface.
摘要翻译：耐摩擦合金是含有铜，锑的锡基质和约0.10重量％至约2重量％的铋; 以及在磨损表面上具有该合金的工业轴承部件。

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