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1. 发明申请

WO9960189A2 METHOD FOR METAL COATING OF SUBSTRATES 审中-公开
标题翻译：方法金属涂层与基体结合
公开(公告)号：WO9960189A2
公开(公告)日：1999-11-25
申请号：PCT/EP9903322
申请日：1999-05-14
申请人： BLASBERG OBERFLAECHENTECH , HUPE JUERGEN , FIX SABINE , STEINIUS ORTRUD
发明人： HUPE JUERGEN , FIX SABINE , STEINIUS ORTRUD
IPC分类号： H05K3/42 , C23C18/16 , C25D5/56 , C25D7/00 , C25D21/14 , H05K3/18 , H05K3/24 , C25D
CPC分类号： C23C18/1641 , C23C18/2013 , C23C18/2086 , C23C18/26 , C25D5/56 , C25D21/14 , H05K3/188 , H05K3/241 , Y10T29/49155 , Y10T29/49165
摘要： The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards, more particularly, printed boards with micro-orifices and fine structures, by applying an electrically conductive polymer layer and subsequently conducting metalization. The electrically conductive polymer layer is doped with a colloidal palladium solution containing tin before the metalization step is carried out, whereby the electrically conductive polymer is poly-3,4-ethylene-dioxythiophene and is brought into contact with a copper(II) salt solution before metalization.
摘要翻译：一种用于生产印刷电路板的聚合物表面，尤其是电路板的具有微细孔和精细的结构，通过将导电性高分子层和随后的金属化，其中所述导电聚合物层与含锡胶体钯溶液中的金属化之前掺杂，其中基底的金属镀层方法导电性高分子是（II）聚-3,4-乙烯二氧噻吩，并用铜金属化之前盐水接触。

2. 发明申请

WO1992020204A1 MEANS FOR THE SELECTIVE FORMATION OF A THIN OXIDISING LAYER 审中-公开
标题翻译：意味着选择性形成一个薄氧化层
公开(公告)号：WO1992020204A1
公开(公告)日：1992-11-12
申请号：PCT/EP1992000864
申请日：1992-04-17
申请人： BLASBERG OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , ALTGELD, Werner , KRONENBERG, Walter , FIX, Sabine
发明人： BLASBERG OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： C08G61/123 , C25D5/54 , H05K3/424 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , H05K2203/122
摘要： The means of the invention for the selective formation of a thin oxidising layer by means of permanganate on polymers, glass fibres and ceramics but not on copper consists of an aqueous solution of potassium permanganate adjusted to a pH of 6.0 to 0, and preferably 5.0 to 2.0, by means of sulphonic acids, preferably methane sulphonic acid.
摘要翻译：通过高锰酸盐在聚合物，玻璃纤维和陶瓷而不是铜上选择性形成薄氧化层的本发明的方法包括调节至pH 6.0至0，优选5.0至 2.0，通过磺酸，优选甲烷磺酸。

3. 发明申请

WO1997005758A1 PROCESS AND DEVICE FOR PRODUCING THROUGH-CONNECTED PRINTED CIRCUIT BOARDS AND MULTILAYERED PRINTED CIRCUIT BOARDS 审中-公开
标题翻译： PROCESS FOR通过印刷电路板或多层LEITERPLATTEN（多层）PRODUCING
公开(公告)号：WO1997005758A1
公开(公告)日：1997-02-13
申请号：PCT/EP1996003134
申请日：1996-07-17
申请人： BLASBERG OBERFLÄCHENTECHNIK GMBH , HUPE, Jürgen , FIX, Sabine
发明人： BLASBERG OBERFLÄCHENTECHNIK GMBH
IPC分类号： H05K03/42
CPC分类号： H05K3/424 , H05K3/0055
摘要： Through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers are produced using a combined desmearing and direct metalization process (multilayering) wherein the polymer base materials are subjected to the following process steps: 1) swell in a per se known treatment liquid and rinse with water; 2) treat with an alkaline permanganate solution (desmear); 3) rinse with water; 4) rinse with acidic aqueous solution (pH value approximately 1, duration of rinsing 10 to 120 sec. depending on acid content); 5) rinse with water; 6) rinse with alkaline aqueous solution (pH 8 to 9.5); 7) rinse with water; 8) rinse with a microemulsion of ethylene-3,4-dioxythiophenes (catalyst); 9) rinse with acid (fixation); 10) rinse with water; 11) copper; 12) rinse with water and 13) dry; 14) conventional process steps for creating the printed circuit pattern.
摘要翻译：用于产生通过连接使用组合的去污和Direktmetallisierungsprozess（多层）的印刷电路板或基于聚合物的导电聚合物的多层印刷电路板的过程需要在该基体材料的地方，一个聚合物的基础上设置有钻孔以下方法步骤进行：1）中的资源本身已知的处理液和用水，2）治疗漂洗用碱性高锰酸盐溶液（去污），3）用水冲洗，4）用酸性水溶液冲洗（pH为约1，这取决于为10〜120）的酸含量冲洗时间秒，5）用水漂洗，6）用碱性水溶液（pH为8〜9.5漂洗），7）用水冲洗，8）亚乙基-3,4-二氧噻吩（催化剂的微乳液漂洗），9）用酸漂洗（定影），10）以水冲洗，11）铜，12）以水冲洗，和13）干燥，14），用于图案电镀通常的工艺步骤。

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