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1. 发明申请

WO2011084358A2 WEATHERIZED DIRECT-MOUNT ABSOLUTE PRESSURE SENSOR 审中-公开
标题翻译：加强型直接安装式绝对压力传感器
公开(公告)号：WO2011084358A2
公开(公告)日：2011-07-14
申请号：PCT/US2010/059896
申请日：2010-12-10
申请人： ENDEVCO CORPORATION , KWA, Tom , DANIELSON, Don, L.
发明人： KWA, Tom , DANIELSON, Don, L.
IPC分类号： G01L9/06 , G01L7/08 , G01L7/02 , B64C3/00 , B64C99/00
CPC分类号： G01M9/065 , G01L19/0636 , G01L19/0654
摘要： A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.
摘要翻译：提供了一种压阻式传感器组件，其具有其中形成有至少一个气流孔的柔性电路。传感器裸片耦合到绝对支撑和柔性电路。传感器芯片具有隔膜，该隔膜响应流过气流孔并流入隔膜的气流而偏转。传感器芯片包括一个或多个位于膜片上或膜片内的量规。

2. 发明申请

WO2009108227A3 HIGH TEMPERATURE PIEZOELECTRIC CERAMICS AND SENSORS MADE OF THE SAME FOR DYNAMIC MEASUREMENTS 审中-公开
公开(公告)号：WO2009108227A3
公开(公告)日：2009-09-03
申请号：PCT/US2008/083599
申请日：2008-11-14
申请人： ENDEVCO CORPORATION , ZHANG, Hongxi
发明人： ZHANG, Hongxi
IPC分类号： H01L41/04 , C04B35/46
摘要： The present invention is directed to a new group of pure and doped bismuth layer structured perovskite high temperature piezoelectric ceramics and sensors made of the same. The new materials have the formula of [Bi 2 O 2 ][A m-1 B m O 3m+1 ], where m=2, A is mono-, di-, or trivalent ions or a combination of them, B is transition elements such as Fe 3+ , Ti 4+ , Nb 5+ , Ta 5+ , W 6+ , Mo 6+ or a combination of them. The ceramics have high Curie temperature of 900~940 °C. The sensors claimed in the present invention utilize [Bi 2 O 2 ][A m_1 B m O 3m+1 ] ceramics parts as sensing elements in various shapes and dimensions and can be used to sense force, acceleration, and pressure at very high temperatures.

3. 发明申请

WO2009043040A1 SILICON SENSING STRUCTURE TO DETECT THROUGH-PLANE MOTION A PLANE OF MATERIAL WITH THERMAL EXPANSION SUBSTANTIALLY DIFFERENT FROM THAT OF SILICON 审中-公开
标题翻译：硅传感结构检测平板运动一种材料平板，具有与硅不同的热膨胀特性
公开(公告)号：WO2009043040A1
公开(公告)日：2009-04-02
申请号：PCT/US2008/078179
申请日：2008-09-29
申请人： ENDEVCO CORPORATION , SUMINTO, James, Tjan-meng , WILNER, Leslie, Bruce
发明人： SUMINTO, James, Tjan-meng , WILNER, Leslie, Bruce
IPC分类号： G01L9/02
CPC分类号： G01L9/0055 , G01L19/04
摘要： A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm The sensor detects deflection of the metal diaphragm The sensor and diaphragm are made of different materials A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm
摘要翻译：提供一种压力传感器，其具有带轮缘的换能器主体，响应于压力而偏转的隔膜和在隔膜的边缘和隔膜的中心处接合到隔膜的传感器。传感器检测金属隔膜的偏转传感器和隔膜由不同的材料制成传感器和隔膜之间的热膨胀差异由传感器中的弯曲容纳，该传感器在金属隔膜的径向方向上接受相对运动，几乎不影响硅结构在轴向上的运动的灵敏度隔膜方向

4. 发明申请

WO2007106363A3 IMPROVED MULTI-LAYER DEVICE 审中-公开
公开(公告)号：WO2007106363A3
公开(公告)日：2007-09-20
申请号：PCT/US2007/005853
申请日：2007-03-06
申请人： ENDEVCO CORPORATION , KWA, Tom , LE, Lihn , TIKHOMIROVA, Nina
发明人： KWA, Tom , LE, Lihn , TIKHOMIROVA, Nina
IPC分类号： H01L21/00
摘要： A multi-layer device is provided for connecting to an electrical unit is enclosed. A first wafer has a first outer terminal and a second outer terminal with etch pits. A first insulator has a first surface bonded to the first wafer and a first inner terminal located on an opposing second surface. A second wafer has a first surface bonded to the second surface of the first insulating layer and includes a pillar electrically connected to the first wafer. A second insulator has a first surface bonded to a second surface of the second wafer and a second inner terminal located on the first surface of the second insulator. The first outer terminal is electrically connected to the first inner terminal, and the second outer terminal is electrically connected to the second inner terminal. The first and second outer terminals are adapted for connecting to an electrical unit.

5. 发明申请

WO2011019879A1 PROOF MASS FOR MAXIMIZED, BI-DIRECTIONAL AND SYMMETRIC DAMPING IN HIGH G-RANGE ACCELERATION SENSORS 审中-公开
标题翻译：用于最大化，高方向加速度传感器中的双向和对称阻尼的质量证明
公开(公告)号：WO2011019879A1
公开(公告)日：2011-02-17
申请号：PCT/US2010/045275
申请日：2010-08-12
申请人： ENDEVCO CORPORATION , WILNER, Leslie, Bruce , KWA, Tom
发明人： WILNER, Leslie, Bruce , KWA, Tom
IPC分类号： G01P15/09
CPC分类号： G01P15/123 , B81B3/0078 , B81B2201/0235 , G01P1/023 , G01P15/08 , G01P15/0802 , G01P2015/0882
摘要： A new high G-range damped acceleration sensor is proposed with a proof mass optimized for maximized, bi-directional and symmetrical damping to accommodate acceleration ranges above and beyond several thousand G's. In order to achieve the maximum, bi-directional and symmetrical damping, the high G- range acceleration sensor is designed to have minimum amount of mass in the proof mass while maximizing its surface areas. Such high G-range damped acceleration sensor can be applied to any application in which damping (or suppression of ringing) is desired at quite high frequencies.
摘要翻译：提出了一种新的高G范围阻尼加速度传感器，其具有针对最大化，双向和对称阻尼优化的检测质量，以适应超过数千G的加速度范围。为了实现最大的双向和对称阻尼，高G范围加速度传感器被设计为在最大化其表面积的同时在检验质量中具有最小量的质量。这种高G范围阻尼加速度传感器可以应用于在相当高的频率下需要阻尼（或抑制振铃）的任何应用。

6. 发明申请

WO2009043032A1 FLEXURAL PIVOT FOR MICRO-SENSORS 审中-公开
标题翻译：用于微型传感器的柔性传感器
公开(公告)号：WO2009043032A1
公开(公告)日：2009-04-02
申请号：PCT/US2008/078168
申请日：2008-09-29
申请人： ENDEVCO CORPORATION , WILNER, Leslie, Bruce
发明人： WILNER, Leslie, Bruce
IPC分类号： G01P3/00
CPC分类号： G01L1/2218 , G01P15/0888 , G01P15/123 , G01P2015/0831
摘要： A micro-sensor is provided with a fixed reference frame and an elastic pivot. The elastic pivot has at least two co-axial segments of pivot and is coupled to the fixed reference frame. The elastic pivot has a neutral axis that is a central line of the pivot. A moveable body is coupled to the elastic pivot and the reference frame. The moveable body and the reference frame share a reference surface. The moveable body extends between the two co-axial segments to provide that for a rotation of the moveable body about the pivot the moveable body approaches the reference surface at a first side, and recedes from the reference surface from an opposite side to provide an opening gap and a closing gap. The neutral axis is below the reference surface.
摘要翻译：微传感器设置有固定的参考框架和弹性枢轴。弹性枢轴具有至少两个枢轴的同轴段，并且连接到固定的参考系。弹性枢轴具有作为枢轴的中心线的中性轴线。可移动主体联接到弹性枢轴和参考框架。可移动体和参考框架共享参考面。可移动体在两个同轴段之间延伸以提供可移动体围绕枢轴旋转的可动体在第一侧接近参考表面，并从参考表面从相对侧后退以提供开口差距和缩小差距。中性轴低于参考面。

7. 发明申请

WO2008043061A2 HIGHLY SENSITIVE PIEZORESISTIVE ELEMENT 审中-公开
标题翻译：高灵敏度的PIEZORESISTIVE元素
公开(公告)号：WO2008043061A2
公开(公告)日：2008-04-10
申请号：PCT/US2007/080547
申请日：2007-10-05
申请人： ENDEVCO CORPORATION , WILNER, Leslie, Bruce
发明人： WILNER, Leslie, Bruce
IPC分类号： G01L1/22 , H01C17/00
CPC分类号： G01L1/2293 , G01L1/18 , Y10T29/49103
摘要： A mechanical-to-electrical sensing structure has first and second movable blocks formed in a handle layer. A first hinge is coupled to the first and second movable blocks and configured to resist loads other than flexing of the first hinge. The first hinge is formed in the handle layer. A first gauge is separated from the first hinge and aligned to provide that a moment tending to rotate one of the first or second blocks relative to the other about the first hinge applies a tensile or compressive force along a length of the first gauge. The first gauge is formed from a device layer with an oxide between the device and handle layers. The sensing structure is made from an SOI wafer, and the first gauge is protected during an etching away of handle material beneath the first gauge by an oxide between the device and handle layers and an etch-resistant oxide or nitride on exterior surfaces of the first gauge.
摘要翻译：机械到电感测结构具有形成在手柄层中的第一和第二可移动块。第一铰链联接到第一和第二可移动块并且构造成抵抗除了第一铰链的弯曲之外的载荷。第一铰链形成在手柄层中。第一仪表与第一铰链分离并对齐以提供趋向于使第一或第二块之一相对于第一铰链围绕第一铰链旋转的力矩沿着第一量规的长度施加拉伸或压缩力。第一规格由装置层和手柄层之间的氧化物的器件层形成。感测结构由SOI晶片制成，并且在第一规格下方的手柄材料的蚀刻之前，第一规格由器件和手柄层之间的氧化物和第一表面的外表面上的抗蚀刻氧化物或氮化物进行保护测量。

8. 发明申请

WO2006093938A2 JUNCTION-ISOLATED VIAS 审中-公开
标题翻译：隔离六边形
公开(公告)号：WO2006093938A2
公开(公告)日：2006-09-08
申请号：PCT/US2006/007032
申请日：2006-02-27
申请人： ENDEVCO CORPORATION , WILNER, Leslie, B.
发明人： WILNER, Leslie, B.
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2225/06541 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/14 , H01L2924/00
摘要： A process for forming a junction-isolated, electrically conductive via in a silicon substrate and a conductive apparatus to carry electrical signal from one side of a silicon wafer to the other side are provided. The conductive via is junction-isolated from the bulk of the silicon substrate by diffusing the via with a dopant that is different than the material of the silicon substrate. Several of the junction-isolated vias can be formed in a silicon substrate and the silicon wafer coupled to a second silicon substrate comprised of a device that requires electrical connection. This process for forming junction-isolated, conductive vias is simpler than methods of forming metallized vias, especially for electrical devices more tolerant of both resistance and capacitance.
摘要翻译：提供了一种用于在硅衬底中形成结隔离的导电通孔和用于将电信号从硅晶片的一侧承载到另一侧的导电装置的工艺。导电通孔通过与不同于硅衬底的材料的掺杂剂扩散通孔而与硅衬底的本体结合隔离。结合隔离通孔中的几个可以形成在硅衬底中，并且硅晶片耦合到由需要电连接的器件组成的第二硅衬底。用于形成结隔离导电通孔的方法比形成金属化通孔的方法更简单，特别是对于更耐受电阻和电容的电器件。

9. 发明申请

WO1989008847A1 DIFFERENTIAL CAPACITIVE TRANSDUCER AND METHOD 审中-公开
标题翻译：差分电容式传感器和方法
公开(公告)号：WO1989008847A1
公开(公告)日：1989-09-21
申请号：PCT/US1989000988
申请日：1989-03-13
申请人： ENDEVCO CORPORATION
发明人： ENDEVCO CORPORATION , WILNER, Leslie, Bruce
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , Y10T29/435
摘要： A differential variable capacitance acceleration sensor includes a sandwich structure having three stacked plates (10, 40, 60) of silicon with the center plate (10) mounted such that its center portion (12) is enabled to move in a sealed cavity with each side thereof moving toward and away from a fixed cooperating plate forming the opposite side of a capacitive circuit. The center portion (12) or mass of the center plate (10) is suspended from its rim (14) by means of a large number of integral fingers (18, 20) extending from the rim (14) to the top and bottom surfaces of the center portion (12). This center mass (12) includes a number of through holes (16) to permit the passage of air from one side to the other and may also include grooves to aid in the flow of air. The fixed top plate or lid (40) and the base (60) also have, or may have, grooves (46, 66) to assist in the passage of air. An alternative embodiment includes a smaller number of more compliant fingers (108) to provide a more compliant structure. A number of spaced stops (48, 68) are provided in the lid and based to overcome electrostatic and pneumatic latch up. The method of forming the individual parts is also taught.

10. 发明申请

WO2009120900A4 INTERCONNECTION SYSTEM ON A PLANE ADJACENT TO A SOLID-STATE DEVICE STRUCTURE 审中-公开
公开(公告)号：WO2009120900A4
公开(公告)日：2009-10-01
申请号：PCT/US2009/038456
申请日：2009-03-26
申请人： ENDEVCO CORPORATION , WILNER, Leslie, Bruce
发明人： WILNER, Leslie, Bruce
IPC分类号： G01L9/12
摘要： An interconnection system is provided for a solid-state device. The solid-state that includes, a first layer, multiple devices and a first face. A second layer is bonded to the first face at a bonded face of the second layer that faces the first face. Electrically conductive bonds are between the fist and second faces. Conductive paths are on the bonded face of the second layer and connect two or more of the conductive bonds.

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