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1. 发明申请

WO2012036682A1 FLUID NOZZLE ARRAY 审中-公开
标题翻译：流体喷嘴阵列
公开(公告)号：WO2012036682A1
公开(公告)日：2012-03-22
申请号：PCT/US2010/048976
申请日：2010-09-15
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , BENGALI, Sadiq , CHEN, Chien-Hua , COOK, Galen P. , CUMBIE, Michael W. , MESSENGER, Robert K.
发明人： BENGALI, Sadiq , CHEN, Chien-Hua , COOK, Galen P. , CUMBIE, Michael W. , MESSENGER, Robert K.
IPC分类号： B41J2/16 , B41J2/14 , B41J2/145
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634
摘要： A method for fabricating a fluid nozzle array includes forming a circuitry layer (410) onto a substrate (412), the substrate (412) comprising a stopping layer (404) disposed between a membrane layer (406) and a handle layer (402), forming a fluid feedhole (502) extending from a surface of the membrane layer (406) to the stopping layer (404), and forming a fluid supply trench (702) extending from a surface of the handle layer (402) to the stopping layer (404). A fluid nozzle array includes a substrate (412) including a membrane layer (406), a stopping layer (404) adjacent to the membrane layer, a handle layer (406) adjacent to the stopping layer, and a set of fluid chambers (610) disposed on a surface of the membrane layer above and along a width of a fluid supply trench (702) extending from a surface of the handle layer to the stopping layer.
摘要翻译：用于制造流体喷嘴阵列的方法包括在基底（412）上形成电路层（410），所述基底（412）包括设置在膜层（406）和手柄层（402）之间的阻挡层（404）形成从所述膜层（406）的表面延伸到所述止挡层（404）的流体供给孔（502），以及形成从所述手柄层（402）的表面延伸到所述止动层（404）的流体供给沟槽（702）层（404）。流体喷嘴阵列包括基片（412），其包括膜层（406），邻近膜层的阻挡层（404），邻近止动层的手柄层（406）和一组流体室）设置在膜层的表面上方并沿着从手柄层的表面延伸到止挡层的流体供应沟槽（702）的宽度。

2. 发明申请

WO2007127825A3 FABRICATION TOOL FOR BONDING 审中-公开
标题翻译：用于粘接的制造工具
公开(公告)号：WO2007127825A3
公开(公告)日：2008-04-10
申请号：PCT/US2007067472
申请日：2007-04-26
申请人： HEWLETT PACKARD DEVELOPMENT CO , CHEN CHIEN-HUA , SCHWINABART TROY D , ATKINSON WILLIAM M
发明人： CHEN CHIEN-HUA , SCHWINABART TROY D , ATKINSON WILLIAM M
IPC分类号： H01L21/00
CPC分类号： H01L21/67092
摘要： A fabrication tool (100) presses a first device surface (103) against a second device surface (105) after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston (102) to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate (104) situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism (106, 110) to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
摘要翻译：制造工具（100）在第一和第二器件表面已被等离子体激活之后将第一器件表面（103）压在第二器件表面（105）上，以将第一器件表面与第二器件表面结合。制造工具包括粘合活塞（102），以在第一装置表面上施加力以将第一装置表面压靠第二装置表面。制造工具还包括位于接合活塞和第一装置表面之间的压力板（104）。该制造工具还包括机构（106,110），以确保由第一装置表面经由压板施加的接合活塞的力最初施加在第一装置表面上的一个或多个第一位置上，随后施加在一个或更多的第二位置。

3. 发明申请

WO2007011544A3 ELECTRONICALLY CONNECTING SUBSTRATE WITH ELECTRICAL DEVICE 审中-公开
标题翻译：电子连接基板与电气设备
公开(公告)号：WO2007011544A3
公开(公告)日：2007-08-30
申请号：PCT/US2006026446
申请日：2006-06-29
申请人： HEWLETT PACKARD DEVELOPMENT CO , CRAIG DAVID M , CHEN CHIEN-HUA
发明人： CRAIG DAVID M , CHEN CHIEN-HUA
IPC分类号： H01L21/60 , B23K20/00 , H01L21/603 , H01L21/607
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/80 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48471 , H01L2224/48475 , H01L2224/48599 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85205 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A substrate is electrically connected with an electrical device mounted on the substrate (100). A ball bond is formed between a first end of a wire and a bonding pad of the substrate (106). A reverse-motion loop is formed within the wire (108). A bond is formed between a second end of the wire and a bonding pad of the electrical device (118).
摘要翻译：基板与安装在基板（100）上的电气装置电连接。在导线的第一端和基板（106）的焊盘之间形成球接合。在线（108）内形成反向运动回路。在电线的第二端和电气装置（118）的接合焊盘之间形成接合。

4. 发明申请

WO2007018955A1 MICRO ELECTRO-MECHANICAL SYSTEM PACKAGING AND INTERCONNECT 审中-公开
标题翻译：微电子机械系统包装和互连
公开(公告)号：WO2007018955A1
公开(公告)日：2007-02-15
申请号：PCT/US2006/027225
申请日：2006-07-07
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , CHEN, Chien-Hua , BAMBER, John G. , KANG, Henry
发明人： CHEN, Chien-Hua , BAMBER, John G. , KANG, Henry
IPC分类号： B81C3/00
CPC分类号： B81C3/002
摘要： A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.
摘要翻译：微电子机械系统（MEMS）装置包括电晶片，机械晶片，将电晶片结合到机械晶片的等离子体处理的氧化物密封，以及电晶片和机械晶片之间的电互连。

5. 发明申请

WO2005097668A1 SYSTEM AND METHOD FOR DIRECT-BONDING OF SUBSTRATES 审中-公开
标题翻译：用于基板直接接合的系统和方法
公开(公告)号：WO2005097668A1
公开(公告)日：2005-10-20
申请号：PCT/US2005/009878
申请日：2005-03-24
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , CHEN, Chien-hua , HALUZAK, Charles, C.
发明人： CHEN, Chien-hua , HALUZAK, Charles, C.
IPC分类号： B81B7/00
CPC分类号： B81B7/0067 , B81C2203/036
摘要： A method of bonding substrates (230, 240) and devices having bonded substrates (230, 240) are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material (250) onto a bonding surface (242) of a first substrate (240). A bonding site density of at least one of the layer of bonding substrate material (250) or a bonding surface (232) of a second substrate (230) is increased, and the bonding surface (242) of the first substrate (240) having the layer of bonding substrate material (250) is bonded to the bonding surface (232) of the second substrate (230).
摘要翻译：公开了一种将衬底（230,240）和具有接合衬底（230,240）的器件接合的方法。接合衬底的方法包括将一层接合衬底材料（250）沉积到第一衬底（240）的接合表面（242）上。键合基板材料层（250）或第二基板（230）的接合面（232）中的至少一个的接合位置密度增加，并且第一基板（240）的接合面（242）具有接合基板材料层（250）被结合到第二基板（230）的接合表面（232）。

6. 发明申请

WO2014018028A1 PIEZOELECTRIC ACTUATOR AND METHOD OF MAKING A PIEZOELECTRIC ACTUATOR 审中-公开
标题翻译：压电致动器及制造压电致动器的方法
公开(公告)号：WO2014018028A1
公开(公告)日：2014-01-30
申请号：PCT/US2012/048058
申请日：2012-07-25
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , ABBOTT, James, Elmer, Jr. , CHEN, Chien-Hua , POLLARD, Jeffrey, R.
发明人： ABBOTT, James, Elmer, Jr. , CHEN, Chien-Hua , POLLARD, Jeffrey, R.
IPC分类号： B41J2/045 , B41J2/175
CPC分类号： B41J2/14201 , B41J2/145 , B41J2/1618 , B41J2/1623 , B41J2/1642 , B41J2/1646 , H01L41/053 , H01L41/0973 , H01L41/22 , H01L41/313 , Y10T29/42
摘要： In one example, a piezoelectric actuator includes a piezoelectric material, a first conductor on a first part of the piezoelectric material, and a membrane bonded to the first conductor with an adhesive. The first conductor has a root mean square surface roughness of at least 10nm at the bonding interface with the membrane.
摘要翻译：在一个示例中，压电致动器包括压电材料，压电材料的第一部分上的第一导体和用粘合剂结合到第一导体的膜。第一导体在与膜的键合界面处具有至少10nm的均方根粗糙度。

7. 发明申请

WO2012128749A1 DROP DETECTION 审中-公开
标题翻译：下降检测
公开(公告)号：WO2012128749A1
公开(公告)日：2012-09-27
申请号：PCT/US2011/029120
申请日：2011-03-20
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , GOVYADINOV, Alexander , CHEN, Chien-Hua
发明人： GOVYADINOV, Alexander , CHEN, Chien-Hua
IPC分类号： B41J2/125 , B41J29/38
CPC分类号： G01V8/24 , B41J2/04558 , B41J2/04561 , B41J2/04586 , B41J2/125 , B41J2/16579 , B41J2/16585 , B41J2/2142 , B41J2/2146 , G01N21/53 , G01V8/16
摘要： A drop detector assembly is provided including an ejection element to eject a fluid drop, a light guide to selectively receive light scattered off of the fluid drop, and a light detector formed in the light guide to detect light received by the light guide.
摘要翻译：提供了一种液滴检测器组件，其包括用于喷射液滴的喷射元件，用于选择性地接收从液滴散射的光的光导;以及形成在光导中的光检测器，用于检测由光导所接收的光。

8. 发明申请

WO2008157168A1 FLUID MANIFOLD FOR FLUID EJECTION DEVICE 审中-公开
标题翻译：用于流体喷射装置的流体歧管
公开(公告)号：WO2008157168A1
公开(公告)日：2008-12-24
申请号：PCT/US2008/066536
申请日：2008-06-11
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , NIKKEL, Eric L. , CHEN, Chien-Hua , FORREST, Tracy S.
发明人： NIKKEL, Eric L. , CHEN, Chien-Hua , FORREST, Tracy S.
IPC分类号： B41J2/175 , B41J2/135
CPC分类号： B41J2/1603 , B41J2/14145 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1639
摘要： A fluid manifold (120) for a fluid ejection device (130) including a plurality of fluid feed slots (132) includes a first layer (140) and a second layer (150) adjacent the first layer, and a first fluid routing (160) and a second fluid routing (170) each provided through the first layer and the second layer. The fluid ejection device is supported by the second layer, and the first fluid routing is communicated with one of the fluid feed slots, and the second fluid routing is communicated with an adjacent one of the fluid feed slots. A pitch (D3) of the first fluid routing and the second fluid routing through the first layer is greater than a pitch (D1) of the fluid feed slots, and the first fluid routing and the second fluid routing each include a first channel (162/172) oriented substantially parallel with the fluid feed slots and a second channel (166/176) oriented substantially perpendicular to the fluid feed slots.
摘要翻译：用于包括多个流体供给槽（132）的流体喷射装置（130）的流体歧管（120）包括邻近第一层的第一层（140）和第二层（150），以及第一流体路线（160 ）和每个通过第一层和第二层提供的第二流体路线（170）。流体喷射装置由第二层支撑，并且第一流体路线与流体供给槽中的一个连通，并且第二流体路线与相邻的一个流体供给槽连通。第一流体路线的间距（D3）和穿过第一层的第二流体路线大于流体供给槽的间距（D1），并且第一流体路线和第二流体路径各自包括第一通道（162） / 172）基本上平行于流体供给槽和基本上垂直于流体供给槽定向的第二通道（166/176）。

9. 发明申请

WO2008134202A1 A MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME 审中-公开
标题翻译：一种微流体装置和一种流体喷射装置
公开(公告)号：WO2008134202A1
公开(公告)日：2008-11-06
申请号：PCT/US2008/059557
申请日：2008-04-07
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , HALUZAK, Charles C. , CHEN, Chien-hua , SAND, Kirby
发明人： HALUZAK, Charles C. , CHEN, Chien-hua , SAND, Kirby
IPC分类号： B81B1/00 , B81C1/00
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1628 , B41J2/1632 , B41J2/1637
摘要： A microfluidic device (10) includes first and second glass substrates (12, 42) bonded together. The first glass substrate (12) has first and second opposed surfaces (14, 16). A die pocket (18) is formed in the first opposed surface (14), and a through slot (22) extends from the die pocket (18) to the second opposed surface (16). The second glass substrate (42) is bonded to the second opposed surface (16) of the first glass substrate (12) whereby an outlet (O 2 ) of a channel (48) formed in the second glass substrate (42) substantially aligns with the through slot (22). The channel (48) of the second glass substrate (42) has an inlet (I 2 ) that is larger than the outlet (O 2 ).
摘要翻译：微流体装置（10）包括结合在一起的第一和第二玻璃基板（12,42）。第一玻璃基板（12）具有第一和第二相对表面（14,16）。在第一相对表面（14）中形成模口袋（18），并且穿通槽（22）从模腔（18）延伸到第二相对表面（16）。第二玻璃基板（42）与第一玻璃基板（12）的第二相对表面（16）接合，由此形成在第二玻璃基板（12）中的通道（48）的出口（O 2/2）基板（42）基本上与通孔（22）对齐。第二玻璃基板（42）的通道（48）具有大于出口（O 2 2 N）的入口（I 2 2 N）。

10. 发明申请

WO2006044040A1 ASSEMBLY 审中-公开
标题翻译：部件
公开(公告)号：WO2006044040A1
公开(公告)日：2006-04-27
申请号：PCT/US2005/030973
申请日：2005-08-31
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , CRAIG, David, M. , CHEN, Chien-Hua , HALUZAK, Charles, C. , YENCHIK, Ronnie, J.
发明人： CRAIG, David, M. , CHEN, Chien-Hua , HALUZAK, Charles, C. , YENCHIK, Ronnie, J.
IPC分类号： B81B7/00
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： A micro-electromechanical assembly (15, 100) including a substrate (35, 120), a micro-electromechanical device (30, 110) coupled to the substrate (35, 120); a seal ring (140) formed on the substrate (35, 120); and a plurality of bonding pads (40, 160) formed on the substrate (35, 120), wherein the seal ring (140) and bonding pads (40, 160) are formed of the same material.
摘要翻译：包括衬底（35,120）的微机电组件（15,100），耦合到所述衬底（35,120）的微机电装置（30,110）; 形成在所述基板（35,120）上的密封环（140）; 以及形成在所述基板（35,120）上的多个接合焊盘（40,160），其中所述密封环（140）和接合焊盘（40,160）由相同的材料形成。

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